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Corrosion-resistant low-temperature solder for photovoltaic solder strip and preparation method of corrosion-resistant low-temperature solder

A technology of low-temperature solder and photovoltaic ribbon, applied in welding equipment, welding/cutting medium/material, welding medium, etc., can solve problems such as corrosion resistance of materials that are not involved, achieve strong corrosion resistance, avoid segregation phenomenon, melting point low effect

Active Publication Date: 2015-11-04
SUZHOU YOURBEST NEW TYPE MATERIALS +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

This patent improves the wetting force and strength of the alloy through elements such as Co and Ag, but does not involve the corrosion resistance of the material

Method used

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  • Corrosion-resistant low-temperature solder for photovoltaic solder strip and preparation method of corrosion-resistant low-temperature solder
  • Corrosion-resistant low-temperature solder for photovoltaic solder strip and preparation method of corrosion-resistant low-temperature solder
  • Corrosion-resistant low-temperature solder for photovoltaic solder strip and preparation method of corrosion-resistant low-temperature solder

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0039] When smelting, first mix and heat an appropriate amount of pure tin (99.95%) and pure bismuth (99.95%) to 300°C for the mixed melt, then add bismuth chloride powder to cover the surface of the mixed melt (the ratio of the mass of the mixed melt to the mass of bismuth chloride 20:1) after heat preservation and stirring for 15 minutes, the temperature was lowered to 170°C to obtain molten solder, and then the molten solder was poured into a graphite crucible covered with a porous carbon filter layer (thickness: 2 mm), and the melt in the graphite crucible was repeatedly Filter 3 times. Reduce the temperature of the filtered molten solder to 150°C, inject carbon monoxide from the bottom of the solder and keep it for 30 minutes, and finally remove the slag floating on the surface of the melt and cast it to obtain the finished product. After spark direct reading spectroscopy and chemical analysis (see: National Standard GB / T 10574.1-13 "Chemical Analysis Method for Tin-Lead ...

Embodiment 2

[0043] When smelting, first mix and heat appropriate amount of pure tin (99.95%) and pure bismuth (99.95%) to 280°C to mix the melt, then add bismuth chloride powder to cover the surface of the melt (mass ratio of mixed melt to bismuth chloride is 20:1) After heat preservation and stirring for 20 minutes, the temperature was lowered to 170°C to melt the solder, and then the molten solder was poured into a graphite crucible covered with a porous carbon filter layer (2 mm in thickness), and the melt in the graphite crucible was repeatedly filtered for 5 Second-rate. Reduce the temperature of the filtered molten solder to 150°C, inject carbon monoxide from the bottom of the solder and keep it for 30 minutes, and finally remove the slag floating on the surface of the melt and cast it to obtain the finished product. According to spark direct reading spectroscopy and chemical analysis, the bismuth content of the solder prepared by this process is 59% by mass, and the rest are impuri...

Embodiment 3

[0046]When smelting, first mix and heat appropriate amount of pure tin (99.95%) and pure bismuth (99.95%) to 280°C to mix the melt, then add bismuth chloride powder to cover the surface of the mixed melt (the mass of the mixed melt and the mass of bismuth chloride The ratio is 20:1) after heat preservation and stirring for 18 minutes, the temperature is lowered to 175°C to obtain molten solder, and then the molten solder is poured into a graphite crucible covered with a porous carbon filter layer (thickness is 2 mm), and the melt in the graphite crucible Filter repeatedly 8 times. Reduce the temperature of the filtered molten solder to 150°C, inject carbon monoxide from the bottom of the solder and keep it for 40 minutes, and finally remove the slag floating on the surface of the melt and cast it to obtain the finished product. According to spark direct reading spectroscopy and chemical analysis, the bismuth content of the solder prepared by this process is 60% by mass, and th...

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Abstract

The invention discloses corrosion-resistant low-temperature solder for a photovoltaic solder strip and a preparation method of the corrosion-resistant low-temperature solder. The solder comprises, by weight, 55%-60% of Bi, 0-0.01% of Sb, 0-0.0005% of Al, 0-0.0005% of Zn and the balance tin. The method comprises the following steps that a proper amount of the tin and bismuth is heated to 280 DEG C to 300 DEG C, and mixed melt is obtained; a proper amount of bismuth chloride is added to cover the surface of the mixed melt, then heat preservation is carried out, temperature is reduced to below 180 DEG C after stirring of 15-20 minutes, and molten solder is obtained; and finally the molten solder is filtered through porous carbon, the filtered molten solder is cast, and the corrosion-resistant low-temperature solder is obtained. According to the solder, the content of the key component Bi is controlled, it is measured that the melting point is close to 139 DEG C, the temperature difference of a solid phase and a liquid phase is only about 12 DEG C, and the phenomenon of segregation can be effectively avoided in dip soldering and other welding processes with the high cooling rate; the content of impurities is controlled to be low, so that the melting point of the prepared solder is low, and the corrosion resistance of the prepared solder is high.

Description

technical field [0001] The invention relates to a solder and a preparation method thereof, in particular to a corrosion-resistant low-temperature solder for a photovoltaic ribbon and a preparation method thereof. Background technique [0002] Photovoltaic ribbon is a key raw material for the production of photovoltaic modules. It acts as a conductive connection between cells, and its reliability largely determines the life of photovoltaic modules. [0003] At present, due to the obvious performance difference between lead-free solder and lead-containing solder in terms of reliability such as corrosion resistance and fatigue resistance, the application of lead-free photovoltaic modules is greatly limited. At the same time, the welding process of materials determines the efficiency and yield of component production, so it is required to reduce the welding temperature, which puts forward new requirements for the melting point of solder. [0004] Chinese patent (application num...

Claims

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Application Information

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IPC IPC(8): B23K35/26B23K35/40
CPCB23K35/0222B23K35/264B23K35/40
Inventor 肖锋周健陈旭朱骄峰李赛鹏
Owner SUZHOU YOURBEST NEW TYPE MATERIALS
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