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Focusing plane positioning device and method of laser micro-beam back irradiation chip test

A technology of focusing plane and positioning device, which is applied in the field of laser micro-beam irradiation test, and can solve the problems that cannot meet the needs of positioning

Active Publication Date: 2015-09-23
NAT SPACE SCI CENT CAS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, this method cannot meet the needs of the focal plane positioning of the laser microbeam through the silicon substrate of the device in the longitudinal direction for the irradiation test

Method used

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  • Focusing plane positioning device and method of laser micro-beam back irradiation chip test
  • Focusing plane positioning device and method of laser micro-beam back irradiation chip test
  • Focusing plane positioning device and method of laser micro-beam back irradiation chip test

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0065] Such as figure 1 As shown, the focal plane positioning device for the laser microbeam back irradiation chip test is used for positioning the focal plane of the device under test. The device includes a laser source 1 for testing, a focusing optical path adjustment module 2, an imaging CCD module 3, a The mobile station 4 and the three-dimensional mobile station control module 5 .

[0066] The test laser source 1 is used to emit pulsed laser with fixed parameters;

[0067] The focusing optical path adjustment module 2 is used to adjust the pulsed laser emitted by the test laser source 1 to make it a test laser beam;

[0068] The imaging CCD module 3 is used to image the laser reflection spot of the device under test, and output the reflection spot imaging signal to the three-dimensional mobile station control module 5;

[0069] The three-dimensional mobile station 4 is used to place the test circuit board of the device under test;

[0070] The three-dimensional mobile ...

Embodiment 2

[0074] Based on the device in Example 1, in Example 2, such as figure 2 As shown, the device further includes: a device electrical feature acquisition analysis processing module 6, and the three-dimensional mobile station control module 5 also includes an electrical feature processing unit and a second control unit;

[0075] The device electrical characteristic acquisition analysis processing module 6 is used to receive the signal output by the test circuit board of the device under test, and output the processed signal to the electrical characteristic processing unit;

[0076] The electrical characteristic processing unit is used to receive the signal output by the device electrical characteristic acquisition analysis processing module 6, perform statistical analysis and processing, form a feedback signal instruction, and output it to the second control unit;

[0077] The second control unit is used to receive the feedback signal instruction sent by the electrical characteri...

Embodiment 3

[0079] Based on the device in Example 1, in Example 3, such as image 3 As shown, the device further includes: a light source 7 for illumination, and the three-dimensional mobile station control module 5 also includes a second CCD imaging processing unit and a third control unit;

[0080]The illumination light source 7 is used to emit illumination light onto the device under test, and the CCD imaging module 3 will image the metal reflective layer of the device under test; and output the imaging signal to the second CCD for imaging processing unit; the second CCD imaging processing unit outputs a feedback signal instruction to the third control unit according to the definition of imaging;

[0081] The second CCD imaging processing unit is used to receive the imaging signal output by the imaging CCD module 3, and form a feedback signal instruction after performing imaging definition detection, and output it to the third control unit;

[0082] The third control unit is configure...

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Abstract

The invention provides a focusing plane positioning device of a laser micro-beam back irradiation chip test. The focusing plane positioning device used for performing focusing plane positioning on a to-be-tested device comprises a laser source (1) for the test, a focusing light path adjusting module (2), an imaging CCD module (3), a three-dimensional movable platform (4) and a three-dimensional movable platform control module (5), wherein the laser source (1) is used for transmitting fixed-parameter pulse laser; the focusing light path adjusting module (2) is used for adjusting the pulse laser transmitted by the laser source (1); the imaging CCD module (3) is used for imaging the laser reflecting light spot of the to-be-tested device; the three-dimensional movable platform (4) is used for placing the test circuit board of the to-be-tested device; the three-dimensional movable platform control module (5) is used for receiving the reflecting light spot signals output by the imaging CCD module (3) and forming a feedback signal instruction after imaging contrast detecting to automatically adjust the positions of the three-dimensional movable platform (4).

Description

technical field [0001] The present invention relates to the technical field of laser micro-beam irradiation test, in particular, the present invention relates to a focus plane positioning device and method for laser micro-beam back irradiation chip test. Background technique [0002] When using laser microbeams for defect detection, fault injection and radiation resistance testing of semiconductor devices, it is necessary to focus the laser beams to different degrees to ensure that the focal plane of the laser microbeams can be located in the sensitive areas of semiconductor devices and integrated circuits within the response range. There are two incident modes of front irradiation and back irradiation in laser test. Frontal irradiation is mainly applied to simple structural devices and circuits with relatively less dense metal wiring layers; for integrated circuits with more metal wiring layers, infrared band lasers are often used for back irradiation tests. In the proces...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G01N21/88G01R31/26
Inventor 马英起韩建伟封国强姜昱光上官士鹏余永涛朱翔陈睿
Owner NAT SPACE SCI CENT CAS
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