Ultrafine ceramic particle Cu based composite material taking Ti2SnC as precursor and preparation method of composite material

A technology of ceramic particles and composite materials, which is applied in the field of ultrafine ceramic particle ultrafine Cu-based composite materials and its preparation, and achieves the effects of simple process, low cost and convenient operation

Inactive Publication Date: 2015-09-16
BEIJING JIAOTONG UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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  • Ultrafine ceramic particle Cu based composite material taking Ti2SnC as precursor and preparation method of composite material
  • Ultrafine ceramic particle Cu based composite material taking Ti2SnC as precursor and preparation method of composite material

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Experimental program
Comparison scheme
Effect test

Embodiment approach 1

[0020] Weigh Ti with a purity of 98.5% and a particle size of 5 μm 2 2.2 grams of SnC powder, 97.8 grams of Cu powder with a purity of 99.8% and a particle size of 50 μm, after mixing, add 200 grams of agate balls, ball mill the mixture for 2 hours, put the mixed powder into a Φ50 steel mold, and apply a pressure of 120 MPa , compact the powder in the mold, put the above block into a high-temperature furnace, and under the protection of argon, raise the temperature of the furnace to 1100°C at a heating rate of 10°C / min, keep it warm for 30min, and then heat it for 10 The temperature is lowered at a rate of ℃ / min, and after cooling, an ultrafine Cu-based composite material with ultrafine ceramic particles is obtained.

[0021] The measured TiC of the above composite materials 0.5 The particles are about 200-300nm, the Cu crystal grains are about 0.8-1μm, the yield strength of the composite material is 100MPa, the compressive strength is 295MPa, and the elongation is 53%.

Embodiment approach 2

[0023] Weigh Ti with a purity of 98.5% and a particle size of 10 μm 2 7.33 grams of SnC powder, 92.67 grams of Cu powder with a purity of 99.8% and a particle size of 70 μm, after mixing, add 400 grams of agate balls, ball mill the mixture for 2 hours, put the mixed powder into a Φ76 steel mold, and apply a pressure of 250 MPa , compact the powder in the mold, put the block into a high-temperature furnace, and under the protection of argon, raise the temperature of the furnace to 1150°C at a heating rate of 20°C / min, keep it warm for 45min, and then heat it for 30 The temperature is lowered at a rate of ℃ / min, and after cooling, an ultrafine Cu-based composite material with ultrafine ceramic particles is obtained.

[0024] The measured TiC of the above composite materials 0.5 The particles are about 150-200nm, the Cu crystal grains are about 0.3-0.5μm, the yield strength of the composite material is 225MPa, the compressive strength is 562MPa, and the elongation is 46%.

Embodiment approach 3

[0026] Weigh Ti with a purity of 98.5% and a particle size of 7 μm 2 15.12 grams of SnC powder, 84.88 grams of Cu powder with a purity of 99.8% and a particle size of 60 μm, after mixing, add 300 grams of agate balls, ball mill the mixture for 4 hours, put the mixed powder into a Φ50 steel mold, and apply a pressure of 200 MPa , compact the powder in the mold, put the block into a high-temperature furnace, and under the protection of argon, raise the temperature of the furnace to 1170°C at a heating rate of 30°C / min, keep it warm for 60 minutes, and then heat it for 20 The temperature is lowered at a rate of ℃ / min, and after cooling, an ultrafine Cu-based composite material with ultrafine ceramic particles is obtained.

[0027] The measured TiC of the above composite materials 0.5 The particles are about 60-80nm, the Cu crystal grains are about 0.1-0.2μm, the yield strength of the composite material is 335MPa, the compressive strength is 870MPa, and the elongation is 38%.

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Abstract

The invention discloses an ultrafine ceramic particle Cu based composite material taking Ti2SnC as a precursor and a preparation method of the composite material. Micron-sized Ti2SnC with the volume content of 3-50% and micron-sized Cu serve as starting materials, ultrafine TiC0.5 particles are generated and uniformly dispersed in a Cu (Sn) matrix after reaction, and Cu crystalline grains are refined into sub-micron grade. The preparation method of the composite material includes the steps: uniformly mixing Ti2SnC powder and Cu powder on a ball mill and then forming the powder under the pressure of 120-250MPa; placing the powder into a high-temperature furnace; performing argon protection; increasing the temperature of the furnace to reach 1100-1250 DEG C; keeping the temperature for 30-60min; cooling the powder to obtain the ultrafine ceramic particle Cu based composite material. The preparation method has the remarkable advantages of simple process, convenience in operation and the like. The ultrafine ceramic particle Cu based composite material has the advantages of high strength and ductility, abrasion resistance and erosion resistance, and can be widely applied to the field of military equipment, high-speed railways, aerospace and the like such as high-strength box shell materials.

Description

technical field [0001] The present invention relates to a Ti 2 The invention discloses an ultrafine Cu-based composite material with ultrafine ceramic particles as a precursor and a preparation method thereof. Background technique [0002] Copper-based materials with high yield strength, high ductility, wear resistance and corrosion resistance, because of their high characteristics and easy processing and molding, they have great applications in military equipment, high-speed railways, aerospace and other fields, such as high-strength box shells materials etc. However, for general copper-based materials, high strength and high ductility cannot be obtained at the same time. Copper has good plastic deformation ability, but its yield strength is low. Generally, work hardening and grain boundary strengthening are used to improve the strength by hindering the movement of dislocations and increasing the density of dislocation barriers. In recent years, the strength and hardnes...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C22C1/05C22C1/10C22C9/00C22C32/00
Inventor 黄振莺翟洪祥王雅正位兴民蔡乐平鲍佳蕾漆振宇欧阳君颜
Owner BEIJING JIAOTONG UNIV
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