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Adhesive-free FCCL (flexible copper-clad laminate) with two medium layers

A technology for adhesive-flexible and copper-clad laminates, applied in the field of double-layer dielectric non-adhesive flexible copper-clad laminates, can solve the problems of reducing the thickness of non-adhesive flexible copper-clad laminates, low product dimensional stability, and difficult processing, saving raw materials, The effect of good appearance and performance, high peel strength

Active Publication Date: 2015-08-26
CHENGDU DO ITC NEW MATERIAL
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0008] The object of the present invention is to provide a double-layer dielectric adhesive-free flexible copper-clad laminate. The structure of this kind of copper-clad laminate is reduced from five layers to four layers, which reduces the thickness of the adhesive-free flexible copper-clad laminate, saves materials, and simplifies the manufacturing process. can be 350 o The high temperature pressing temperature of C is reduced to 120-220 o C, saving energy consumption; at the same time, the present invention overcomes the problem of the brittleness of the adhesive-free flexible copper clad laminate when the medium between the copper foils is two layers of thermosetting polyimide in the prior art, and the medium layer is thermosetting polyimide Imide / TPI glue / thermosetting polyimide / thickness leads to processing difficulties and other problems. When the dielectric layer is TPI glue / thermosetting polyimide / TPI glue, there is a delamination explosion, and the size of the product is stable during downstream processing. issues of low sex

Method used

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  • Adhesive-free FCCL (flexible copper-clad laminate) with two medium layers
  • Adhesive-free FCCL (flexible copper-clad laminate) with two medium layers
  • Adhesive-free FCCL (flexible copper-clad laminate) with two medium layers

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Embodiment 1

[0045] A double-layer dielectric adhesive-free flexible copper-clad laminate is composed of a first copper foil 1, a second copper foil 4, and an insulating layer between the first copper foil 1 and the second copper foil 4 arranged in parallel. The layers include thermoplastic polyimide layer 2 and polyimide structural film layer 3 .

[0046] In this embodiment, the thicknesses of the first copper foil 1 and the second copper foil 4 are respectively 7 μm; the thickness of the thermoplastic polyimide layer 2 is 1 μm; the thickness of the polyimide structure film layer 3 is 5 μm;

[0047] The total thickness of the copper clad laminate in this embodiment is 20 μm, which is suitable for electronic products with high thickness requirements, such as mobile phones and other fields.

Embodiment 2

[0049] A double-layer dielectric adhesive-free flexible copper-clad laminate is composed of a first copper foil 1, a second copper foil 4, and an insulating layer between the first copper foil 1 and the second copper foil 4 arranged in parallel. The layers include thermoplastic polyimide layer 2 and polyimide structural film layer 3 .

[0050] In this embodiment, the thicknesses of the first copper foil 1 and the second copper foil 4 are respectively 12 μm; the thickness of the thermoplastic polyimide layer 2 is 3 μm; the thickness of the polyimide structure film layer 3 is 10 μm; in this embodiment The total thickness of the copper clad laminate is 37 μm.

Embodiment 3

[0052] A double-layer dielectric adhesive-free flexible copper-clad laminate is composed of a first copper foil 1, a second copper foil 4, and an insulating layer between the first copper foil 1 and the second copper foil 4 arranged in parallel. The layers include thermoplastic polyimide layer 2 and polyimide structural film layer 3 .

[0053] In this embodiment, the thickness of the first copper foil 1 and the second copper foil 4 is 35 μm; the thickness of the thermoplastic polyimide layer 2 is 7 μm; the thickness of the polyimide structure film layer 3 is 15 μm; the copper clad laminate of this embodiment The total thickness is 92 μm.

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Abstract

The invention provides an adhesive-free FCCL (flexible copper-clad laminate) with two medium layers. The FCCL comprises first copper foil, second copper foil and insulating layers arranged between the first copper foil and the second copper foil, wherein the first copper foil, the second copper foil and the insulating layers are arranged in parallel, and the insulating layers comprise a TPI (thermoplastic polyimide) layer and a polyimide structure membrane layer. With the adoption of the FCCL structure, the thickness is reduced, materials are saved, the dimensional stability of the FCCL and the dimensional stability of a PCB (printed circuit board) during downstream processing are guaranteed while manufacturing processes are reduced, the FCCL is excellent in comprehensive performance and thinner, and the requirement for thin electronic products can be met.

Description

technical field [0001] The invention relates to a flexible copper-clad laminate, in particular to a double-layer dielectric adhesive-free flexible copper-clad laminate. Background technique [0002] Flexible Copper Clad Laminate (Flexible Copper Clad Laminate, abbreviated as FCCL) refers to an insulating substrate (polyimide film, polyester film or polynaphthyl film, etc.) covered with copper foil, which can be bent repeatedly. The flexible printed circuit board (FPCB) made of thin sheet composite materials can meet the requirements of lightness, thinness, shortness and miniaturization of electronic equipment. The main uses are as follows: computer peripherals and displays, aircraft instruments, navigation and positioning devices, Oil exploration equipment, missile tracking instruments, artificial satellites, space shuttles and spaceships, police wireless telephones, camcorders and digital cameras, medical electronic products, circuit board busbars. [0003] Traditional fle...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B32B15/08B32B15/20
CPCB32B15/01B32B15/20B32B2250/04B32B2255/06B32B2255/26B32B2307/202B32B2307/306B32B2307/3065B32B2307/558B32B2307/734B32B2457/08
Inventor 杨刚
Owner CHENGDU DO ITC NEW MATERIAL
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