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Double-surface grinding and double-surface polishing high-efficiency ultraprecise processing method for large-sized A-directional sapphire mobile phone screen

A technology of ultra-precision machining and double-sided grinding, which is applied to polishing compositions containing abrasives, stone processing equipment, grinding/polishing equipment, etc. It can solve the problems of high processing costs and low processing quality of sapphire mobile phone screens, and achieve Good processing quality, eliminate mechanical processing damage layer, and reduce the effect of surface scratches

Active Publication Date: 2015-06-03
江西伟嘉晶创光电科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] Purpose of the invention: the purpose of the invention is to overcome the problems of low processing quality and high processing cost of existing sapphire mobile phone screens

Method used

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  • Double-surface grinding and double-surface polishing high-efficiency ultraprecise processing method for large-sized A-directional sapphire mobile phone screen
  • Double-surface grinding and double-surface polishing high-efficiency ultraprecise processing method for large-sized A-directional sapphire mobile phone screen
  • Double-surface grinding and double-surface polishing high-efficiency ultraprecise processing method for large-sized A-directional sapphire mobile phone screen

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Experimental program
Comparison scheme
Effect test

Embodiment 1

[0054] A high-efficiency ultra-precision machining method for double-side grinding and double-side polishing of a large-size sapphire mobile phone screen, which includes the following steps:

[0055] (1) Orientation: Select the sapphire A surface with better wear resistance of the sapphire crystal, and perform orientation to ensure that the cut-out mobile phone screen is A-oriented;

[0056] (2) Slicing: According to the shape and size of the mobile phone screen, slice the sapphire crystal. The thickness of the sliced ​​sapphire crystal is 50-70 microns thicker than that of the mobile phone screen, and the length and width are consistent with the mobile phone screen;

[0057] (3) Double-sided grinding: use double-sided grinding equipment to perform double-sided grinding on the sliced ​​sapphire mobile phone screen (2); the specific operation method of double-sided grinding is:

[0058] (3-1) If figure 1 and figure 2 As shown, the lower grinding pad (4) and the upper grindin...

Embodiment 2

[0086] A high-efficiency ultra-precision machining method for double-side grinding and double-side polishing of a large-size sapphire mobile phone screen, which includes the following steps:

[0087] (1) Orientation: Select the sapphire A surface with better wear resistance of the sapphire crystal, and perform orientation to ensure that the cut-out mobile phone screen is A-oriented;

[0088] (2) Slicing: According to the shape and size of the mobile phone screen, slice the sapphire crystal. The thickness of the sliced ​​sapphire crystal is 50-70 microns thicker than that of the mobile phone screen, and the length and width are consistent with the mobile phone screen;

[0089] (3) Double-sided grinding: Use double-sided grinding equipment to perform double-sided grinding on the sliced ​​sapphire crystal; the specific operation method of double-sided grinding is:

[0090] (3-1) If figure 1 and figure 2 As shown, the lower grinding pad (4) and the upper grinding pad (7) contai...

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Abstract

The invention discloses a double-surface grinding and double-surface polishing high-efficiency ultraprecise processing method for a large-sized A-directional sapphire mobile phone screen. The method comprises the steps of crystal ingot orientation, crystal plate slicing, crystal plate double-surface grinding, crystal plate cleaning, crystal plate annealing, crystal plate double-surface polishing, secondary crystal plate cleaning, laser drilling, crystal plate chamfering, triple crystal plate cleaning and crystal plate film plating. According to the method, optimal parameters, including constituents of polishing liquid, of the optimal processing technology and all the steps can be obtained by screening by a large quantity of experiments. By the method, the manufacturing technology of the large-sized (10 inches) sapphire mobile phone screen can be simplified, the processing stress on the surface layer can be effectively eliminated, the mechanical processing damaged layers can be eliminated, and the ultrasmooth surface with a complete surface crystal lattice, the flatness being less than 5 microns and the polishing surface roughness (RMS) being less than 0.2 nanometers can be obtained; the processing quality is high, the cost is low, and the efficiency is high; compared with the prior art, the method disclosed by the invention has the advantage that an extremely high technical progress is achieved.

Description

technical field [0001] The invention relates to a high-efficiency ultra-precision processing method for double-side grinding and double-side polishing of a sapphire mobile phone screen. Background technique [0002] sapphire( ) crystal is an important basic material of modern industry, and has been widely used in optoelectronics, microelectronics, optics, laser, superconductivity, national defense and other fields. Because its crystal Mohs hardness reaches 9, it is the crystal material with the hardness second only to diamond in the world. It has strong wear resistance and is not easy to be scratched; because of its stable chemical properties, it is difficult to undergo chemical reactions at room temperature. These excellent physical and chemical properties make sapphire very suitable for mobile phone screens. But at the same time, due to its high hardness, it is difficult to process, the processing technology is complicated, and the processing cost is high. Ordinary pro...

Claims

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Application Information

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IPC IPC(8): B24B37/08B08B3/12B28D5/00B28D5/02C09G1/02C09K3/14
CPCB08B3/08B08B3/12B24B7/228B24B37/08C09G1/02
Inventor 周海黄传锦高翔
Owner 江西伟嘉晶创光电科技有限公司
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