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Epoxy die-bonding adhesive and preparation method thereof and multi-chip embedded flexible printed circuit board

A technology of epoxy solidification and solid crystal glue, which is applied to the printed circuit, epoxy resin glue, adhesive and other directions connected with non-printed electrical components, which can solve the problems of high curing temperature, low bonding strength and slow speed. , to achieve the effect of improving mechanical properties, ensuring reliability, and good rheology

Active Publication Date: 2015-04-29
GUANGDONG DANBOND TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Acrylate-type crystal-bonding adhesives are divided into two types: ultraviolet curing and thermal curing. Their advantages are stable performance, storage at room temperature, excellent dispensing performance, and superior to epoxy crystal-bonding adhesives in terms of low temperature and rapid curing; but the disadvantages It is low bonding strength, poor electrical performance, and may require additional investment in UV equipment
The advantages of epoxy crystal bonding glue are high bonding strength and excellent electrical properties; the disadvantages are low temperature storage, poor high-speed dispensing performance, high curing temperature and slow speed

Method used

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  • Epoxy die-bonding adhesive and preparation method thereof and multi-chip embedded flexible printed circuit board
  • Epoxy die-bonding adhesive and preparation method thereof and multi-chip embedded flexible printed circuit board
  • Epoxy die-bonding adhesive and preparation method thereof and multi-chip embedded flexible printed circuit board

Examples

Experimental program
Comparison scheme
Effect test

preparation example Construction

[0041] A preparation method of low modulus, high thixotropic epoxy crystal-bonding adhesive, comprising epoxy resin, curing agent, curing accelerator, toughening agent, thixotropic agent, diluent, red pigment and stabilizer, through stirring and mixing Made evenly.

[0042] The epoxy resin is a low-viscosity epoxy resin, such as: E-51 or E-55 epoxy resin, bisphenol F epoxy resin, etc. This type of resin has low viscosity and good fluidity, and is suitable for high-speed dispensing process , and also has the characteristics of good heat resistance and excellent electrical properties;

[0043] The curing agent is an imidazole derivative containing a long-chain substituted alkyl group, such as: 2-undecylimidazole, 2-nonylimidazole, etc., which is a type of latent curing agent, which is beneficial to improve the pot life of the glue. At the same time, the long alkyl chain also helps to improve the flexibility of epoxy cured products;

[0044]The curing accelerator is a latent cu...

Embodiment 1

[0055] The formula of epoxy crystal-bonding adhesive is as follows (parts by weight):

[0056]

[0057] The preparation steps are as follows:

[0058] S1: Mix 40g of 2-undecylimidazole and 5g of N-phenyl-β-naphthylamine with 50g of E-51 epoxy resin in a planetary dynamic mixer to form a paste, and grind it through a three-roller machine 2 times, spare;

[0059] S2: Add the remaining 50g of E-51 epoxy resin, 35g of ethylene glycol diglycidyl ether, 35g of GMA-BA-EA terpolymer, 6g of hydrogenated castor oil in the planetary power mixer, control material Temperature 80-85°C, stir until the hydrogenated castor oil is completely dissolved, then pass cooling water to the jacket of the stirred tank to reduce the temperature of the material to below 35°C;

[0060] S3: Add the latent curing agent paste in S1, 8g of fumed silica, 0.8g of red iron oxide, and 3g of DMP-30 tris(2-ethylhexanoate) salt to the mixture in S2, and stir After uniformity, turn on the vacuum system and conti...

Embodiment 2

[0065] The formula is as follows:

[0066]

[0067] The preparation steps are similar to Example 1, and the test results are shown in Table 1.

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Abstract

The invention discloses an epoxy die-bonding adhesive, a preparation method of the epoxy die-bonding adhesive, and a multi-chip embedded flexible printed circuit board. The epoxy die-bonding adhesive comprises the following components: low-viscosity epoxy resin, a curing agent, a curing accelerator, a flexibilizer, a thixotropic agent, a diluent, a pigment and a stabilizer, and is characterized in that the curing agent contains a long chain alkyl-substituted imidazole derivative; the curing accelerator refers to a latent curing accelerator; the flexibilizer refers to epoxy group-containing acrylate liquid rubber; the thixotropic agent refers to a combination of inorganic thixotropic agents and organic thixotropic agents, the inorganic thixotropic agents comprise fumed silica and / or organobentonite, and the organic thixotropic agents comprise hydrogenated castor oil and / or polyamide wax; and the diluent refers to an epoxy active diluent. The preparation method refers to a method for preparing the epoxy die-bonding adhesive, and the flexible printed circuit board adopts a chip encapsulated by the die-bonding adhesive. The adopted die-bonding adhesive has the advantage of excellent physical performance.

Description

technical field [0001] The invention relates to packaging and interconnection materials for integrated circuits, in particular to an epoxy crystal-bonding adhesive, a preparation method thereof, and a multi-chip embedded flexible circuit board. Background technique [0002] While achieving high speed and high performance, semiconductor devices are constantly developing towards miniaturization, thinning, light weight and flexibility. Multi-layer multi-chip flexible packaging is the main means to achieve this development direction. While reducing the thickness of the chip and the substrate itself, increasing the number of chip stacking and FPC folding layers, higher requirements are also put forward for the performance of the die-bonding adhesive: (1) can be cured quickly to meet the needs of high-speed production; (2) good Excellent rheological properties, overcome the phenomenon of stringing, tailing and spreading and slumping that often occur in the high-speed dispensing pr...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J163/00C09J163/02C09J11/06H05K1/18
Inventor 张双庆
Owner GUANGDONG DANBOND TECH
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