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Epoxy resin bonding agent cured at normal temperature for roads and bridges and preparation method of epoxy resin bonding agent

An epoxy resin, curing technology at room temperature, applied in the direction of epoxy resin glue, adhesive, adhesive type, etc., can solve the problems of inability to resist vehicles and the environment, pavement layer damage, low strength, etc., achieve good flexibility, increase Water resistance and low temperature resistance, and the effect of improving toughness

Inactive Publication Date: 2015-03-25
NANJING UNIV +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Although the above materials have been widely used in the waterproof adhesive layer of bridges, for special occasions such as heavy-duty traffic and long longitudinal slopes, the pavement layer is often damaged. The outside of the binder is thermoplastic material, which is prone to large plastic deformation and even flow at high temperature, and the bond between this material and the concrete of the bridge deck is at the physical level, and its strength is low, so it cannot resist vehicles and the environment etc.

Method used

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  • Epoxy resin bonding agent cured at normal temperature for roads and bridges and preparation method of epoxy resin bonding agent
  • Epoxy resin bonding agent cured at normal temperature for roads and bridges and preparation method of epoxy resin bonding agent
  • Epoxy resin bonding agent cured at normal temperature for roads and bridges and preparation method of epoxy resin bonding agent

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0036] Embodiment 1: Weigh 100 parts (parts by mass, the same below) bisphenol A glycidyl ether epoxy resin (E51, provided by Wuxi Bluestar Petrochemical Co., Ltd.), add 30 parts of glycidyl ether type flexible epoxy resin ( JEF-0211, provided by Changshu Changshu Jiafa Chemical Co., Ltd.), start stirring, and raise the temperature to 60 ° C, react for 2 hours and cool to room temperature, add 10 parts of dibutyl phthalate (DBP) (Shandong Qilu Plasticizer Co., Ltd. provides) to obtain the A component of the normal temperature curing epoxy resin adhesive for road bridges.

Embodiment 2

[0037] Example 2: Weigh 100 parts of bisphenol A glycidyl ether epoxy resin (E51), add 40 parts of glycidyl ether flexible epoxy resin (JEF-0211), start stirring, and raise the temperature to 60°C , after reacting for 2 hours, cool to room temperature, add 15 parts of nonylphenol (NP) (provided by Jiangsu Lingfei Technology Co., Ltd.), to obtain component A of room temperature curing epoxy resin adhesive for road bridges.

Embodiment 3

[0038] Example 3: Weigh 100 parts of bisphenol A type glycidyl ether epoxy resin (E51), add 35 parts of glycidyl ether type flexible epoxy resin (JEF-0211), start stirring, and raise the temperature to 60°C , After reacting for 2 hours, cool to room temperature, and add 5 parts of dibutyl phthalate (DBP) to obtain component A of room temperature curing epoxy resin adhesive for road bridges.

[0039] The preparation method of component B of normal temperature curing epoxy resin adhesive for road and bridge is as follows:

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Abstract

The invention discloses an epoxy resin bonding agent cured at the normal temperature for roads and bridges. The epoxy resin bonding agent comprises a component A and a component B, wherein the component A comprises the following ingredients in parts by mass: 100 parts of epoxy resin, 30-40 parts of flexible epoxy resin, and 5-15 parts of a diluent; the component B comprises the following ingredients in parts by mass: 60-70 parts of a curing agent, 3-5 parts of a flexibilizer, 1-3 parts of an accelerant, and 0.2-0.5 part of a defoaming agent; the ratio of the component A to the component B is (100:80)-(100:100). According to the invention, the flexible epoxy resin is added into the commonly-used epoxy resin, and after the flexible epoxy resin reacts with the curing agent, a thermoset three-dimensional crosslinking structure is formed, so that the good flexibility, better bonding capacity and water resistance are achieved; cashew nut shell oil modified amine is used as the curing agent, so that the water resistance and low temperature resistance of the bonding agent are improved effectively; in addition, since novel multiple-alcohol derivative is used as the flexibilizer of the epoxy resin, the toughness of the epoxy resin is effectively improved, so as to adapt to deformation of steel bridge decks or cement concrete bridge decks during vibration, and realize the purpose of high durability of the epoxy resin bonding agent solidified at the normal temperature for roads and bridges. The epoxy resin bonding agent solidified at the normal temperature for roads and bridges is suitable for bonding and water resistance of steel bridge decks, urban viaducts, cement concrete bridge decks, tunnels and pavements of expressways and the like. The invention further discloses a preparation method of the epoxy resin bonding agent.

Description

technical field [0001] The invention relates to an epoxy resin adhesive, in particular to a normal temperature curing epoxy resin adhesive for road bridges and a preparation method thereof. Background technique [0002] In the bridge deck pavement project, in order to prevent moisture from penetrating into the concrete structure of the bridge deck, corroding the steel bars, and threatening the safety of the bridge; Due to the stress on the deck and the pavement, a waterproof bonding layer needs to be installed between the steel bridge deck or the cement concrete bridge deck and the asphalt pavement. The waterproof adhesive layer is generally made of elastic material with large deformation capacity. When the bridge deck deforms horizontally under the action of temperature changes or driving loads, the waterproof adhesive layer can absorb part of the relative displacement between the pavement and the bridge deck, thereby reducing the Stresses within the small pavement. With ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J163/02C09J163/00C09J11/06C09J11/08E01D19/08
Inventor 谢鸿峰孙一帆许可张育歌张婧陈茹于迪尔朱雷
Owner NANJING UNIV
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