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Low-cost lead-free soldering flux alloy powder for LED (light emitting diode) and preparation method of alloy powder

A lead-free solder alloy, low-cost technology, applied in the field of SnZnBiCu-X lead-free solder alloy powder and its preparation for LED, low-cost lead-free solder alloy powder and its preparation field, can solve the problem of poor oxidation resistance, corrosion resistance, and constraints The development of the LED industry, the increase in raw material costs and other issues, achieve the effect of smooth surface, improved atomization efficiency, and stable particle size distribution range

Active Publication Date: 2015-02-18
BEIJING COMPO ADVANCED TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the main problem of the current Sn-Zn solder powder is that its wettability is relatively low, and its oxidation resistance and corrosion resistance are poor. Therefore, the current mainstream Sn-Zn solder powder is mainly Sn-Zn-Bi- In, Sn-Zn-Bi-Ag, Sn-Zn-Bi-RE (rare earth elements) series, but the addition of elements such as In, Ag, RE (rare earth elements) in these alloy series is expensive, which greatly increases the cost of raw materials, seriously Restricted the development of the LED industry

Method used

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  • Low-cost lead-free soldering flux alloy powder for LED (light emitting diode) and preparation method of alloy powder
  • Low-cost lead-free soldering flux alloy powder for LED (light emitting diode) and preparation method of alloy powder
  • Low-cost lead-free soldering flux alloy powder for LED (light emitting diode) and preparation method of alloy powder

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0031] A kind of lead-free solder alloy powder for LED, by weight percentage, this lead-free solder alloy powder comprises: Zn 6.5%, Bi 1.0%, Cu 0.5%, Ni 0.5%, Al 0.5%, Ti 0.2%, the rest is Sn , the lead-free solder alloy powder is spherical, and its shape is as follows figure 1 As shown, its oxygen content is lower than 75ppm, its particle size distribution range is 25-35μm, the average particle size is 28μm, and its melting point is 193-206.5°C. The method for preparing the lead-free solder alloy powder for LED comprises the following steps:

[0032] 1) The metal Sn, Sn-10Cu, Sn-5Ni, Sn-6Al, Zn-3Ti master alloy and metal Bi are proportioned according to the weight percentage, and put into the induction furnace crucible as raw materials.

[0033] 2) Pre-vacuumize the smelting chamber and atomization chamber to 1×10 -2 Pa, and then filled with an inert protective gas (argon or nitrogen), the pressure of the melting chamber is 0.5MPa.

[0034] 3) The raw material is heated a...

Embodiment 2

[0038]A kind of lead-free solder alloy powder for LED, by weight percentage, this lead-free solder alloy powder comprises: Zn 6.5%, Bi 1.0%, Cu 0.5%, Ni 0.5%, Al 0.5%, Ti 0.2%, the rest is Sn , the lead-free solder alloy powder is spherical, its oxygen content is lower than 75ppm, its particle size is 20-38μm, its average particle size is 28.5μm, and its melting point is 193-206.5°C. The method for preparing the lead-free solder alloy powder for LED comprises the following steps:

[0039] 1) The metal Sn, Sn-10Cu, Sn-5Ni, Sn-6Al, Zn-3Ti master alloy and metal Bi are proportioned according to the weight percentage, and put into the induction furnace crucible as raw materials.

[0040] 2) Pre-vacuumize the smelting chamber and atomization chamber to 1×10 -1 Pa, and then filled with inert protective gas, the pressure of the smelting chamber is 0.5MPa.

[0041] 3) Induction coils are used to heat and melt the raw materials.

[0042] 4) Pass high-pressure atomizing gas into the ...

Embodiment 3

[0045] A kind of lead-free solder alloy powder for LED, by weight percentage, this lead-free solder alloy powder comprises: Zn 7.0%, Bi 2.0%, Cu 0.5%, Ni 0.5%, Al 0.5%, Ti 0.2%, the rest is Sn , the lead-free solder alloy powder is spherical, its oxygen content is lower than 78ppm, its particle size is 23-37μm, its average particle size is 30μm, and its melting point is 190-203°C. The method for preparing the lead-free solder alloy powder for LED comprises the following steps:

[0046] 1) The metal Sn, Sn-10Cu, Sn-5Ni, Sn-6Al, Zn-3Ti master alloy and metal Bi are proportioned according to the weight percentage, and put into the induction furnace crucible as raw materials.

[0047] 2) Pre-vacuumize the smelting chamber and atomization chamber to 1×10 -2 Pa, and then filled with inert protective gas, the pressure of the smelting chamber is 0.5MPa.

[0048] 3) Induction coils are used to heat and melt the raw materials.

[0049] 4) Pass high-pressure atomizing gas into the noz...

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Abstract

The invention relates to low-cost lead-free soldering flux alloy powder for an LED (light emitting diode) and a preparation method of the alloy powder, and belongs to the field of soft soldering fluxes and application. The alloy powder consists of the following components in percentage by weight: 6.5-9.5 percent of Zn, 1.0-3.0 percent of Bi, 0.5-1.0 percent of Cu and the balance being Sn. The preparation method comprises the steps of putting the raw materials into an induction furnace crucible after burdening according to the weight percentage; pre-vacuumizing a smelting chamber and an atomization chamber, and filling the chambers with inert protection gas; performing heating smelting on the raw materials by an induction coil; feeding high-pressure atomized gas into a nozzle, wherein the high-pressure atomized gas crushes alloy liquid flow which is in a smelted state after falling into the atomization chamber from the bottom of the crucible, and highly atomized liquid drops are formed, fall off and are cooled into alloy powder in an atomization tank; grading the alloy powder which is cooled through screening, and performing vacuumizing nitrogen-filled packaging. The soldering flux alloy powder prepared by the method disclosed by the invention is spherical and is high in oxidization resistance and corrosion resistance and excellent in mechanical property.

Description

technical field [0001] The invention relates to a low-cost lead-free solder alloy powder for LEDs and a preparation method thereof, in particular to a SnZnBiCu-X lead-free solder alloy powder for LEDs and a preparation method thereof, belonging to the technical field of solder and applications. Background technique [0002] Sn-Pb alloy solder has been gradually withdrawn from the field of electronic products after the implementation of the two EU directives due to the toxicity of lead and its compounds to the environment. In the prior art, LED packaging mainly uses SnPb36Ag2 solder powder with NC-SMQ92J flux or SnPb37 solder powder, and even some fields use SnPb45 solder powder to reduce raw material costs. With the continuous development and growth of my country's LED industry, the development of high-performance, low-cost, lead-free and environmentally friendly solder that can be used to replace Sn-Pb solder powder is an important issue currently facing my country's LED in...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B22F9/08C22C13/00
Inventor 徐骏孙彦斌胡强朱学新张富文王志刚金帅马俪
Owner BEIJING COMPO ADVANCED TECH
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