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Flexible metal laminate sheet

A flexible metal and laminate technology, applied in the direction of metal layered products, coatings, layered products, etc., can solve the problems of poor adhesion strength, inability to apply flexible copper foil, copper foil line peeling, etc., to achieve the difference Reduced effect

Active Publication Date: 2014-12-17
GUANGDONG SHENGYI SCI TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, as disclosed in the above-mentioned U.S. patent document, since the fluoropolymer exists in a large amount in the outer layer of the insulating layer, the total moisture regain of the insulating layer is lowered, and since the fluororesin is on the outer surface, moisture penetration and absorption are also lowered, but May create problems not present in flexible copper foil laminates composed of existing polyimides
For example, the bonding strength of the polyimide resin disclosed in the above-mentioned U.S. patent document to coverlay, prepreg or ACF may be deteriorated, and the coefficient of thermal expansion (CTE) of the polyimide disclosed in the above-mentioned U.S. patent document is too large , and cannot be applied to flexible copper foil laminates, and the fluororesin may melt at a temperature of about 380°C (the temperature applied during the storage process of PCB preparation)
There is also a risk of copper foil line peeling due to the presence of too much fluororesin on the outer surface of the polyimide

Method used

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Examples

Experimental program
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Effect test

preparation Embodiment 1

[0112] Preparation Example 1: Preparation of Polyamic Acid Solution (P1) Containing Fluororesin

[0113] Fill a 1 L polyethylene (PE) bottle with nitrogen gas and add 765 g of dimethylacetamide (DMAc), 219 g of polytetrafluoroethylene (PTFE) fine powder (particle size: 0.1 μm to 2.0 μm), 10.95 After g of polyester-based polymer [acid value: 26 mg KOH / g, alkali equivalent: 1200] as a dispersant and 765 g of beads with a diameter of 2 mm, the resulting mixture was stirred in a high-speed ball mill to disperse PTFE. In a 500mL round bottom flask, put 80g of the solution dispersed with PTFE, 107g of dimethylacetamide, 1.852g of 3,4,3',4'-biphenyltetracarboxylic dianhydride, 12.355g pyromellitic dianhydride, 5.453g of 2,2'-dimethyl-4,4'-diaminobiphenyl, 12.340g of 2,2'-bis(trifluoromethyl)-4,4' - After diaminobiphenyl, the mixture was stirred with a stirrer, and reacted at 50° C. for 10 hours while blowing nitrogen gas thereinto, to obtain a polyamic acid solution (P1) having a ...

preparation Embodiment 2

[0114] Preparation Example 2: Preparation of Polyamic Acid Solution (P2) Containing Fluororesin

[0115] Fill a 1 L polyethylene (PE) bottle with nitrogen gas and add 765 g of dimethylacetamide (DMAc), 219 g of polytetrafluoroethylene (PTFE) fine powder (particle size: 0.1 μm to 2.0 μm), 10.95 After g of polyester-based polymer [acid value: 26 mg KOH / g, alkali equivalent: 1200] as a dispersant and 765 g of beads with a diameter of 2 mm, the resulting mixture was stirred in a high-speed ball mill to disperse PTFE. In a 500mL round bottom flask, put 73g of the solution dispersed with the PTFE, 115g of dimethylacetamide, 11.609g of pyromellitic dianhydride, 17.391g of 2,2'-bis(trifluoroform base)-4,4'-diaminobiphenyl, the mixture was stirred with a stirrer, and reacted at 50° C. for 10 hours while blowing nitrogen thereinto, to obtain a polyamic acid solution having a viscosity of about 100,000 cps (P2).

preparation Embodiment 3

[0116] Preparation Example 3: Preparation of Polyamic Acid Solution (P3) Containing Fluororesin

[0117] Fill a 1 L polyethylene (PE) bottle with nitrogen gas and add 765 g of dimethylacetamide (DMAc), 219 g of polytetrafluoroethylene (PTFE) fine powder (particle size: 0.1 μm to 2.0 μm), 10.95 After g of polyester-based polymer [density (20° C.): 1.13 g / ml] as a dispersant and 765 g of beads with a diameter of 2 mm, the resulting mixture was stirred in a high-speed ball mill to disperse PTFE.

[0118] In a 500mL round bottom flask, put 80g of the solution dispersed with the PTFE, 107g of dimethylacetamide, 13.937g of pyromellitic dianhydride, 5.536g of 2,2'-dimethyl-4 , 4'-diaminobiphenyl (m-TB-HG), 12.527 g of 2,2'-bis(trifluoromethyl)-4,4'-diaminobiphenyl, the mixture was stirred with a stirrer, And reacted at 50° C. for 10 hours while blowing nitrogen gas thereinto, to obtain a polyamic acid solution (P3) having a viscosity of about 20,000 cps.

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Abstract

The present invention relates to a flexible metal laminate sheet comprising a polymer resin layer including a polyimide resin having a specific structure and a fluorine-based resin. More fluorine-based resin is distributed on the inside of the polymer resin layer than at the surface of the polymer resin layer.

Description

technical field [0001] The present invention relates to a flexible metal laminate, in particular to a flexible metal laminate having a low dielectric constant and a low moisture regain and ensuring high elasticity and an optimized coefficient of thermal expansion. Background technique [0002] With the recent trend of miniaturization, high speed, and integration of various functions of electronic equipment, the signal transmission speed inside the electronic equipment or the signal transmission speed outside the electronic equipment is getting faster and faster. [0003] Therefore, it is increasingly necessary to use a printed circuit board with an insulating layer having a lower dielectric constant and a lower dielectric loss factor than existing insulating layers. In view of this trend, recent attempts have been made to apply liquid crystal polymers (LCPs), which are insulating layers with lower dielectric constants and are more susceptible to moisture absorption than exis...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B32B15/08C08L79/08
CPCH05K1/0353H05K1/0373H05K1/0393H05K3/022H05K2201/015H05K2201/0154Y10T428/24355Y10T428/25Y10T428/263Y10T428/264Y10T428/266Y10T428/3154Y10T428/31544C09D127/18C08L79/08B32B15/08C08G73/10H05K1/03
Inventor 朴永锡朴谆龙张世明
Owner GUANGDONG SHENGYI SCI TECH
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