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Microvia-superfilling copper plating technology

A technology of super hole filling and copper plating, applied in jewelry and other directions, can solve the problems of uneven hole filling rate of blind holes, increase the production cost of vertical electroplating lines, etc., achieve high hole filling rate, save power consumption, and reduce production costs. Effect

Inactive Publication Date: 2014-10-22
SUR PRECISION METAL TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Although these operations can increase the filling rate of blind holes and reduce the tank pressure to a certain extent, the additional equipment added greatly increases the production cost of the vertical plating line, and the unevenness of the cathode plate due to side spray or jet flow causes differences The uneven hole filling rate of the blind holes in the area is also inevitable

Method used

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  • Microvia-superfilling copper plating technology

Examples

Experimental program
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Effect test

Embodiment 1

[0026] The process steps of super-filling copper plating process of the present invention include:

[0027] 1. First activate the blind hole plate to be plated (blind hole diameter 150 μm, hole depth 75 μm) in dilute sulfuric acid solution for 1-10 min, wash with water and dry with cold air, then fix the plate to be plated vertically in 1500 mL In the middle of the Hull tank (the bottom of the tank has air holes), phosphor copper plates with a phosphorus content of 0.04 - 0.065% are placed at both ends of the tank as anodes;

[0028] 2. Prepare the plating solution, the base solution consists of 100 - 230 g / L CuSO 4 ·5H 2 O, 40 - 150 g / L of H 2 SO 4 and 10 - 200 ppm Cl - Ion composition, under constant stirring, sequentially add 5 - 50 mL of inhibitor, 1 - 10 mL of accelerator, and 0.5 - 5 mL of leveler to the base solution, and then add deionized water to make up to 1500 mL, after mixing evenly, slowly pour into the Hull cell, and let it stand for 1-20 min, so that the p...

Embodiment 2

[0033] The difference between this embodiment and specific embodiment 1 is that the activation treatment time in step 1 is 1 min. Other steps and parameters are the same as those in Embodiment 1.

Embodiment 3

[0035] The difference between this embodiment and the above-mentioned examples is that the base liquid in step 2 is made of 100-200 g / L CuSO 4 ·5H 2 O, 100 - 150 g / L of H 2 SO 4 and 50 - 100 ppm Cl - ionic composition. Other steps and parameters are the same as those in Embodiment 1 or Embodiment 2.

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Abstract

The invention discloses a microvia-superfilling copper plating technology. The microvia-superfilling copper plating technology comprises the following steps of a, carrying out activation treatment on a blind hole plate to be plated in a dilute sulphuric acid solution for 1-10min, carrying out water washing and drying, vertically fixing the blind hole plate to be plated to the middle of a Hull cell having the volume of 1500mL, and putting phosphor-containing copper plates as anodes having phosphor content of 0.04-0.065% at two ends of the cell, b, preparing a plating solution, c, switching on a power supply, carrying out electroplating at current density of 0.5-2ASD for 5-30min, increasing current density to 0.5-4ASD, carrying out electroplating for 10-20min, wherein the whole electroplating process is finished in a static state, then switching off the power supply, taking out the blind hole plate as a cathode, flushing the blind hole plate by distilled water, and blow-drying the blind hole plate by cold air to obtain a sample. Under the condition of absolutely no forced convection of the plating solution, the microvia-superfilling copper plating technology does not increase surface copper thickness and guarantees a high microvia-filling rate of the blind hole device.

Description

technical field [0001] The invention relates to the technical field of PCB electroplating, and more specifically relates to a super hole-filling copper plating process. Background technique [0002] Electroplated blind hole technology is an effective means to realize high-density interconnection of semiconductors, and it is also a secret weapon to promote the miniaturization of electronic products. In recent years, with the continuous improvement of market requirements, the blind hole plating technology of PCB boards has also been continuously developed and improved, which is manifested in the following aspects: First, the soluble phosphor copper anode is gradually supplemented by the inert anode and copper oxide powder Second, while the vertical electroplating technology is continuously updated and improved, the horizontal electroplating technology has also been greatly developed. In addition, the application of pulse technology to the electroplating hole filling process ha...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C25D3/38C25D7/00
Inventor 谢金平肖宁范小玲李宁
Owner SUR PRECISION METAL TECH
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