Sapphire mobile phone panel processing method
A technology of panel processing and processing method, applied in the field of sapphire material mobile phone panel processing, can solve the problems of high cost and low processing efficiency of sapphire mobile phone panels, and achieve the effects of long service life, screen scratch protection and high hardness
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[0020] The whole preparation and processing method needs to carry out the following steps: material - cutting - chamfering - rough grinding - annealing - DMP - CMP - cleaning - coating - silk screen - finished product inspection, of which 1. Cutting is to cut the crystal block into pieces to facilitate subsequent processing; 2. Chamfering is to trim the edge of the wafer into an arc shape to improve the mechanical strength of the edge of the slice and avoid defects caused by stress concentration; 3. Rough grinding is to remove slices 4. Annealing is to improve the stress concentration BOW caused by mechanical processing; 5. DMP is to improve the damage layer caused by rough grinding and reduce the surface roughness of the wafer; 6. CMP is to improve the roughness of the wafer so that the surface can reach nanometer precision; 7. Coating is to perform anti-fingerprint coating on the wafer; 8. Silkscreen is to perform silkscreen treatment on one side of the wafer to enhance light...
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