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Heat-conducting adhesive for LED (light-emitting diode) lamp packaging and preparation method thereof

A technology for LED lamps and thermally conductive adhesives, applied in adhesives, semiconductor devices, adhesive additives, etc., can solve problems such as increasing the thermal resistance between the substrate and the radiator, detaching the light source module radiator, increasing production costs, etc., to solve the curing time. and temperature problems, good market prospects, the effect of reducing thermal resistance

Inactive Publication Date: 2014-09-03
南京工大光电材料研究院有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] For thermally conductive adhesives, people mainly focus on the research on thermally conductive silicone grease and thermally conductive silica gel. Judging from the current situation, both of them still have some deficiencies; for the former, because they cannot be cured and have poor adhesion, It makes it easy for the light source module to be separated from the radiator, which increases the thermal resistance between the substrate and the radiator to a certain extent; for the latter, the current thermal silica gel needs to be kneaded by a mixer, cured at high temperature, and demoulded and other processes, which greatly increases the production cost, and at the same time, because the heat-conducting silicone sheet is difficult to completely contact with the contact surface during use, the thermal resistance of the boundary is relatively large.

Method used

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  • Heat-conducting adhesive for LED (light-emitting diode) lamp packaging and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0019] a. Take 10 g of terminal methyl vinyl siloxane with a vinyl content of 160 mPas of 2.5%, 10 g of spherical alumina with a particle diameter of 5 μm, and 0.2 g of a platinum-vinyl siloxane complex catalyst, put them in a vessel, and place the The vessel is placed in a vacuum stirrer, at room temperature, the vacuum degree is 1×10 -1 Stir below MPa for 15min at a speed of 500r / min to obtain component A;

[0020] b. Take 7g of oxygen-containing siloxane with a hydrogen content of 0.18% at 140mPas, 6g of spherical alumina with a particle size of 13nm, and 0.01g of acetylenic alcohol inhibitors, put them in a vessel, and put the vessel in a vacuum stirrer , at room temperature, the vacuum degree is 1×10 -1 Stir for 15 minutes below MPa, and the rotating speed is 500 rpm to prepare component B;

[0021] c. Mix components A and B and put them in a vacuum mixer. At room temperature, the vacuum degree is 1×10 -1 Stir below MPa for 15 minutes at a speed of 600 rpm to prepare A...

Embodiment 2

[0023] a. Take 10g of terminal methyl vinyl siloxane with 160mPas vinyl content of 2.5%, 6g of spherical alumina with a particle size of 5μm, 4g of spherical aluminum nitride with a particle size of 50nm, platinum-vinyl siloxane complex Catalyst 0.3g, be placed in the container, this container is placed in the vacuum stirrer, at room temperature, vacuum degree is at 1 * 10 -1 Stir below MPa for 15min at a speed of 500r / min to obtain component A;

[0024] b. Take 7g of hydrogen-containing siloxane with a hydrogen content of 0.18% at 140mPas, 4g of spherical alumina with a particle size of 13nm, 2g of spherical aluminum nitride with a particle size of 2μm, and 0.01g of acetylenic alcohol inhibitors, and put them in a container Inside, put the vessel in a vacuum stirrer, at room temperature, the vacuum degree is 1×10 -1 Stir for 15 minutes below MPa, and the rotating speed is 500 rpm to prepare component B;

[0025] c. Mix components A and B and put them in a vacuum mixer. At r...

Embodiment 3

[0027] a. Take 10g of terminal methyl vinyl siloxane with 160mPas vinyl content of 2.5%, 6g of spherical alumina with a particle size of 5μm, 4g of spherical aluminum nitride with a particle size of 50nm, platinum-vinyl siloxane complex Catalyst 0.3g, be placed in the container, this container is placed in the vacuum stirrer, at room temperature, vacuum degree is at 1 * 10 -1 Stir below MPa for 15min at a speed of 500r / min to obtain component A;

[0028] b. Take 7g of hydrogen-containing siloxane with a hydrogen content of 0.18% at 140mPas, 3g of spherical alumina with a particle size of 13nm, 2g of spherical aluminum nitride with a particle size of 2μm, 1g of spherical copper powder with a particle size of 10μm, and acetylenic alcohol Inhibitors 0.01g, placed in a container, the container is placed in a vacuum stirrer, at room temperature, the vacuum degree is 1 × 10 -1 Stir for 15 minutes below MPa, and the rotating speed is 500 rpm to prepare component B;

[0029] c. Mix ...

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Abstract

The invention discloses a heat-conducting adhesive for LED (light-emitting diode) lamp packaging and a preparation method thereof. The heat-conducting adhesive for LED packaging is prepared by thoroughly mixing and curing methylvinyl-terminated siloxane composed of components A and B as a base material, methyl hydrogen siloxane as a crosslinking agent, an inhibitor, a catalyst and a coupled heat-conducting filler at room temperature, and the curing time can be regulated according to the addition amount of the catalyst. The method comprises the following steps: putting the heat-conducting filler and base material into a vacuum stirrer, and thoroughly and uniformly mixing at room temperature until the heat-conducting filler forms effective distribution in the base material, thereby preparing the heat-conducting adhesive with excellent performance. The method aims to enhance the heat conductivity of the heat-conducting adhesive, lower the thermal resistance between the base plate and radiator in the LED lamp, improve the problems of curing time and curing temperature, and enhance the heat transfer efficiency. The heat-conducting adhesive has the advantages of higher heat conductivity, simple preparation technique and lower cost, can completely satisfy the requirements of heat dissipation for the LED lamp, and has favorable market prospects.

Description

technical field [0001] The invention relates to a heat-conducting interface material, in particular to a heat-conducting adhesive used for LED lamp packaging and a preparation method thereof. technical background [0002] Light-emitting diode (LED) is a solid-state semiconductor device that can emit light. Compared with conventional lighting equipment, it has many advantages, such as low power consumption, high luminous efficiency, short response time, small size, light weight, and pure light color. As a new type of solid light source, it has great application prospects and strong market potential in the field of lighting and display. [0003] With the development of LEDs to high light intensity and high power, the problem of heat dissipation of LEDs has become increasingly prominent. On the one hand, the power is getting bigger and bigger, and the LED packaging structure is getting more and more complicated; on the other hand, the volume of LEDs is getting smaller and smal...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J183/07C09J183/05C09J11/04C09J11/06H01L33/56
Inventor 施丰华汤坤卓宁泽黄如喜朱月华李东志姜青松王海波
Owner 南京工大光电材料研究院有限公司
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