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Adhesion Promoters for Non-Etching Photoresists

An adhesion promoter and photoresist technology, which is applied in the field of adhesion promoters and adhesion promoters for non-etching photoresists, and can solve the problems of poor surface uniformity and less aggregation. , to achieve the effect of improving adhesion, stable and reliable storage, and excellent adhesion

Active Publication Date: 2017-09-05
KUNSHAN CITY BANMING ELECTRONICS SCI & TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the active ingredient of this accelerator is still dominated by small molecule coupling agents. Due to the characteristics of small molecules, it is easy to form an island phenomenon, that is, some areas of the copper surface gather in large quantities, and other areas have less aggregation, resulting in surface poor uniformity

Method used

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Examples

Experimental program
Comparison scheme
Effect test

preparation example Construction

[0031] Printed circuit board (PCB) preparation method:

[0032](a) Typically an insulating substrate is used which includes a copper coating on at least one side thereof and which further has through-holes which can be used to electrically contact individual circuit planes within the carrier; the copper is first coated on the outside of the substrate during manufacture And on the hole wall of the through hole, generally only the electroless copper plating method is used, or the electroless plating method is used first and then the electroplating method is used, or only the electroplating method is used.

[0033] Its further processing depends on the processing method:

[0034] When the surface plating method is used, the copper cladding layer (17 micron thick copper outer layer) material that can be drilled to form a through hole is usually used, and then electrolytic copper plating is performed to generate conductivity in the through hole. The plate surface electroplating al...

specific Embodiment 1

[0047] 4.8g γ-mercaptopropyltriethoxysilane, 18.5g 3-(trimethoxysilyl)-propoxy-2-hydroxypropyl-1,3-oxadiazole, 2.5g γ-methacryloxy Propyltriethoxysilane and 0.8g of hexamethyldisiloxane were mixed evenly and added to 100ml of absolute ethanol, and then 10ml of hydrochloric acid with a mass fraction of 5% was added dropwise at 30°C using a constant pressure dropping funnel Carry out hydrolysis and condensation, after adding the hydrochloric acid dropwise, continue to react at 30°C for half an hour, then raise the temperature to 70°C for 4 hours to allow the silane to fully hydrolyze,

[0048] Then use saturated sodium bicarbonate solution to neutralize the excess hydrochloric acid until the pH reaches about 7, evaporate part of the solvent, remove the generated inorganic salt by filtration, and use the mixed solvent of ethanol and water with a mass ratio of 3:1 to prepare the obtained The mass concentration of the organosilicon polymer was adjusted to 0.5%, and the adhesion pro...

specific Embodiment 2

[0050] 4.8g bis-[γ-(triethoxysilyl)propyl]tetrasulfide, 18.5g N-[3-(triethoxysilyl)propyl]-4,5-dihydroimidazole, 2.5gγ -Methacryloxypropyltrimethoxysilane and 0.8g trimethylethoxysilane are mixed evenly and added to 100ml of anhydrous isopropanol, and then the mass is added dropwise using a constant pressure dropping funnel at 30°C 10ml of hydrochloric acid with a fraction of 5% was hydrolyzed and condensed. After the hydrochloric acid was added dropwise, the reaction was continued at 30°C for half an hour, and then the temperature was raised to 70°C for 4 hours to allow the silane to be fully hydrolyzed, and then used in a saturated sodium bicarbonate solution and excess hydrochloric acid until the pH reaches about 7, evaporate part of the solvent, and remove the generated inorganic salt by filtration, and the filtrate is mixed with isopropanol and water at a mass ratio of 1:1 to prepare the mass concentration of the resulting organosilicon polymer. Adjust to 0.8%, get adhesi...

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PUM

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Abstract

The invention provides an adhesion force promoter for a non-etching photoresist; the adhesion force promoter mainly comprises organosilicon polymer and solvent formed by uniformly mixing water-soluble alcohol with water; the organosilicon polymer has a mass percentage of 0.05-1.0% of total mass of the promoter and the general chemical formula is (R3SiO1 / 2) a (R1SiO3 / 2) b (R2SiO3 / 2) c (R3SiO3 / 2) d; the water-soluble alcohol takes a mass percentage of 50-95% of the total mass of the solvent, and the water takes a mass percentage of 5-50% of the total mass of the solvent. The adhesion force promoter can form excellent chemical bond between a copper surface and the photoresist, thereby effectively promoting the adhesion force between the two, especially the copper having smooth surface and no rough surface can also have excellent adhesion force, so the promoter can be very suitable for being applied in ultra thin circuits and high frequency circuit preparation in which brush grinding or micro etching are not convenient; the promoter can be used without damaging the copper surface, so no vivid rough change is caused to the copper, and storage is stable and reliable.

Description

technical field [0001] The invention relates to an auxiliary agent for improving adhesion, in particular to an adhesion promoter for non-etching photoresist, which is suitable for improving the adhesion between copper and photoresist film layers in the PCB manufacturing process, It belongs to the field of fine chemicals. Background technique [0002] In the manufacturing process of printed circuit board (PCB), the surface of PCB copper layer is mounted with a layer of photoresist, and the adhesion between the photoresist and the above-mentioned copper layer requires long-lasting stability, in order to Prevent the "undercut" phenomenon of the base copper during subsequent processes such as exposure, development, etching, copper electroplating (produced in copper structures) and welding. Therefore, in order to ensure good adhesion between the copper surface and the photoresist, the method widely used in industry is to firstly treat the copper surface by mechanical brushing or...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G03F7/11
Inventor 陈修宁张艳华黄志齐黄京华王淑萍贺承相李建
Owner KUNSHAN CITY BANMING ELECTRONICS SCI & TECH
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