Leadless ceramic chip carrier packaging structure and process for manufacturing same

Abstract

The invention discloses a leadless ceramic chip carrier packaging structure and a process for manufacturing the same. The packaging structure comprises a shell and a cover plate. The cover plate covers the shell; the shell is a multilayer ceramic plate, a chip adhesion zone is arranged in the center of the upper surface of the multilayer ceramic plate, and lead bonding zones are arranged on the periphery of the chip adhesion zone; a pad is arranged in the center of the lower surface of the multilayer ceramic plate, and leading-out-end pads are arranged on the periphery of the pad and are connected with the lead bonding zones; a plurality of metal via holes are vertically formed in positions between the upper surface and the lower surface of the multilayer ceramic plate, the upper ends of the metal via holes are connected with the chip adhesion zone, and the lower ends of the metal via holes are connected with the pad; the leading-out-end pads and the pad are of tungsten metallization layer structures. The leadless ceramic chip carrier packaging structure and the process have the advantages that the leading-out-end pads are provided with tungsten metallization layers instead of the traditional pads which are formed by means of brazing metal blocks on ceramics, accordingly, technologies for machining and brazing metal parts and the like can be omitted, the shell manufacturing yield can be increased, and the cost of the shell can be greatly reduced.

Description

technical field [0001] The invention relates to a packaging structure of a leadless ceramic chip carrier and a preparation process thereof, belonging to the technical field of electronic packaging. Background technique [0002] At present, leadless ceramic chip carrier packages in electronic packaging usually use metallized half-through holes as interconnection channels, and the core cavity of the interconnection channels mounts chips; usually brazed tungsten copper or molybdenum copper is used as heat sinks, and flat cover Plate parallel seam welding or alloy solder fusion sealing structure. When installing, in the traditional technology, when the metallized semicircle hole is connected to the PCB board, due to the large capacitance and inductance and the small gap between the leading ends, the semicircle hole is easy to lack porcelain and short circuit during welding; the metallized semicircle hole is also the overflow of solder. However, as the packaging density increase...

AI Technical Summary

Problems solved by technology

When installing, in the traditional technology, when the metallized semicircle hole is connected to the PCB board, due to the large capacitance and inductance and the small gap between the leading ends, the semicircle hole is easy to lack porcelain and short circuit during welding; the metallized semicircle hole is also the overflow of solder. However, as the packaging density increases, the size of the seal shrinks and the pitch of the pads decreases. This structure can no longer meet the needs of the circuit for packaging. The main problems are:

[0003] 1. When brazing metal blocks on ceramics as pads, the yield is very low;

[0004] 2. Using tungsten copper or molybdenum copper as the heat sink, and the structure of the cavity mounted chip cannot guarantee the size of the package structure;

[0005] 3. After the packaged product is assembled, it is difficult to clean around the pad, and it is very difficult to inspect and remove short circuits and excess solder particles

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