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Copper-clad plate with two flexible surfaces and preparation method of copper-clad plate with two flexible surfaces

A flexible copper clad laminate, double-sided technology, applied in the field of double-sided flexible copper clad laminate and its preparation, can solve problems such as affecting the appearance and performance of products, affecting the normal use of products, and difficult to control performance, so as to improve product quality and reduce The phenomenon of sticking to the board and the effect of complete curing

Active Publication Date: 2014-03-05
SHANDONG JINDING ELECTRONICS MATERIALS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The production cost of two-layer flexible copper-clad laminates is much higher than that of three-layer flexible copper-clad laminates, and the performance is difficult to control. Therefore, many manufacturers still mainly produce three-layer flexible copper-clad laminates.
[0005] However, the preparation method of the three-layer flexible copper-clad laminate in the prior art is not completely cured. After the circuit is etched on the copper-clad laminate, the exposed adhesive is easy to bond with other substances such as copper powder during baking, and it is easy to It leads to the occurrence of board sticking phenomenon after the printed circuit, which not only affects the appearance and performance of the product, but even affects the normal use of the product

Method used

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  • Copper-clad plate with two flexible surfaces and preparation method of copper-clad plate with two flexible surfaces

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Experimental program
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Effect test

Embodiment 1

[0031] A method for preparing a double-sided flexible copper-clad laminate provided in this embodiment includes the following steps:

[0032] Step 1, preparation of adhesive: mix bisphenol A epoxy resin, aluminum hydroxide, carboxyl liquid nitrile rubber, 3,3'-diaminodiphenylsulfone and 1-methylimidazole according to the ratio of 50:20:27 : The mass ratio of 2:1 is added to the mixture of butanone and ethylene glycol methyl ether, wherein the volume ratio of butanone and ethylene glycol methyl ether is 1:1, and the adhesive is prepared after stirring evenly. The quality of the mixture of ethylene glycol methyl ether accounts for 50% of the total mass of the adhesive;

[0033] Step 2, extrusion-coat the adhesive prepared in step 1 on a surface of the polyester film, and then bake the adhesive in an automatic temperature control box under the following conditions: first, within 1 h, The temperature is raised from 25°C to 80°C, and then baked at 80°C for 1 hour to completely vol...

Embodiment 2

[0036] A method for preparing a double-sided flexible copper-clad laminate provided in this embodiment includes the following steps:

[0037] Step 1, preparation of the adhesive: mix bisphenol A epoxy resin, magnesium hydroxide, liquid silicone rubber, 4,4'-diaminodiphenyl sulfone and 2-methylimidazole according to the ratio of 40:25:30:4.2 : The mass ratio of 0.8 is added to the mixture of butanone and ethylene glycol methyl ether, wherein the volume ratio of butanone and ethylene glycol methyl ether is 3:1, and the adhesive is obtained after stirring evenly. Butanone and ethylene glycol The quality of the mixture of alcohol methyl ether accounts for 40% of the total mass of the adhesive;

[0038]Step 2, extrusion coating the adhesive prepared in step 1 on a surface of the polyimide film, then bake the adhesive under the following conditions in an automatic temperature control box: first, in 30min Increase the temperature from 25°C to 80°C, then bake at 80°C for 30 minutes, ...

Embodiment 3

[0041] A method for preparing a double-sided flexible copper-clad laminate provided in this embodiment includes the following steps:

[0042] Step 1, preparation of adhesive: Bisphenol A type epoxy resin, talc powder, nano-titanium dioxide, 4,4'-diaminodiphenylmethane and 2-phenylimidazole according to the ratio of 45:25:26:3.3:0.7 Add the mass ratio of butanone and ethylene glycol methyl ether into the mixture, wherein, the volume ratio of butanone and ethylene glycol methyl ether is 5:1, after stirring evenly, the adhesive is prepared, butanone and ethylene glycol methyl ether The quality of the ether mixture accounts for 60% of the total mass of the adhesive;

[0043] Step 2, on a surface of the polyimide film, extrude the adhesive prepared in step 1, and then bake the adhesive under the following conditions in an automatic temperature control box: first at 1.5 Increase the temperature from 25°C to 80°C within 1 h, then heat-preserve and bake at 80°C for 50 minutes, then i...

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Abstract

The invention belongs to the technical field of copper-clad plates and particularly relates to a preparation method of a copper-clad plate with two flexible surfaces. The preparation method comprises the following steps of preparing an adhesive; smearing the adhesive on one surface of a flexible insulated base film, then baking the adhesive by adopting a segmented temperature control method, then compositing the dried adhesive and a copper foil in a rolling manner; smearing the adhesive on the other surface of the flexible insulated base film, then baking the adhesive by adopting a segmented temperature control method, then compositing the dried adhesive and the other copper foil so as to obtain the copper clad plate with two flexible surfaces. Compared with the prior art, the copper-clad plate and the preparation method have the advantages that by segmented temperature control, the temperature is firstly increased to be higher than the volatilization temperature of a solvent slowly, so that the solvent can be fully volatilized; then the temperature is slowly increased to be more than the reaction temperature of epoxy resin, so that the linear epoxy resin is completely cured into a shaped high-molecular compound, further the curing of the adhesive is safe, the occurrence of the phenomenon of plate adhesion after a circuit is printed can be reduced and the quality of the product is improved.

Description

technical field [0001] The invention belongs to the technical field of copper clad laminates, in particular to a double-sided flexible copper clad laminate and a preparation method thereof. Background technique [0002] Flexible copper clad laminate, also known as flexible copper clad laminate, is the processing substrate material of flexible printed circuit board, which is generally composed of flexible insulating base film and copper foil. Compared with rigid copper clad laminates, flexible copper clad laminates are thin, light and flexible. Flexible printed circuit boards using flexible copper clad laminates as substrate materials are widely used in electronic products such as mobile phones, digital cameras, digital video cameras, automotive satellite direction positioning devices, LCD TVs, and notebook computers. [0003] Flexible copper-clad laminates are generally divided into three-layer flexible copper-clad laminates and flexible copper-clad laminates without adhesi...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B32B37/12B32B38/16C09J163/00C09J113/00C09J183/04C09J11/04C09J11/06
Inventor 欧阳彦辉邹威耿国凌白莹
Owner SHANDONG JINDING ELECTRONICS MATERIALS CO LTD
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