Anti ultraviolet, heat aging resistance and heat radiation paint for LED lamp and preparation method thereof

Abstract

The invention provides an anti-ultraviolet, heat aging resistant and heat radiative paint for an LED lamp, wherein the paint is prepared by the raw materials by weight: 35-40 parts of E-12 epoxy resin, 4-5 parts of vinyl triamine DETA, 1-4 parts of triallyl isocyanurate, 1-2 parts of antioxidant MB, 4-6 parts of amino propyl triethoxysilane, 2-3 parts of nano-silica, 1-2 parts of emery powder, 1-2 parts of lemon oil, 5-8 parts of triglycidyl isocyanurate, 1-2 parts of boron nitride, 2-3 parts of nano hollow bead, 19-22 parts of ethyl acetate, 2-3 parts of molybdenum boride, 14-16 parts of aluminum nitride powder, and 4-5 parts of film forming auxiliary agent. Aluminum nitride powder is added to make the paint have high heat conduction rate and good heat radiation effect; nano silica is added to make that the paint has excellent ultraviolet ray-shielding and infrared ray-reflecting functions, is beneficial to human health, resists heat aging, obviously improves the pot-opening effect, and has advantages of no delamination and thixotropy.

Description

technical field [0001] The invention belongs to the technical field of coatings, and relates to a heat-dissipating coating, more specifically, an anti-ultraviolet, heat-resistant and anti-aging heat-dissipating coating for LED lamps and a preparation method thereof. Background technique [0002] As LED technology has received widespread attention as a new generation of lighting technology in recent years, the power of LED has increased, and the heat dissipation problem has also attracted more and more attention. At present, most of the heat-conducting adhesives are used to solve the heat dissipation problem of LED lamps, but the materials used have technical problems such as poor temperature resistance and aging resistance, low adhesion to the substrate, poor heat dissipation effect and inconvenient operation, which are difficult to meet people's expectations. Requirements for heat dissipation of LED lamps. Some manufacturers also start to select materials with higher therm...

AI Technical Summary

Problems solved by technology

At present, most of the heat-conducting adhesives are used to solve the heat dissipation problem of LED lamps, but the materials used have technical problems such as poor temperature resistance and aging resistance, low adhesion to the substrate, poor heat dissipation effect and inconvenient operation, which are difficult to meet people's expectations. Requirements for heat dissipation of LED lamps

Some manufacturers are also starting to use materials with higher thermal conductivity, but this will increase the production cost of LEDs