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Underfill adhesive with good compatibility and preparation method thereof

An underfill and compatibility technology, which is applied in the direction of adhesives, epoxy resin glue, adhesive types, etc., can solve the problems of low reliability of packaging components, poor flux compatibility, and insufficient storage stability. Achieve the effects of fast flow speed, excellent compatibility and low shrinkage

Inactive Publication Date: 2013-12-11
YANTAI DARBOND TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] At present, common underfills have common problems such as poor compatibility with flux and low reliability of packaged components.
The resulting product has poor flow speed, large expansion coefficient, and at the same time has a large odor, is not environmentally friendly, and has insufficient storage stability

Method used

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  • Underfill adhesive with good compatibility and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0020] Accurately weigh the following raw materials, 50g of 3,4-epoxycyclohexylmethyl-3,4-epoxycyclohexyl carboxylate, 6.5g of rosin epoxy resin, 2.5g of 1,4-butanediol, β -(3,4-Epoxycyclohexyl)ethyltrimethoxysilane 5g and carbon black 0.5g were put into the reactor, mixed at room temperature for 30 minutes, then weighed 0.5g of cationic initiator and put into the reactor, Mix for 2 hours, then weigh 35g of silicon micropowder, add it to the reaction kettle, stir and mix for 2 hours at a temperature of 25°C, a vacuum of -0.07MPa, and a rotation speed of 800 rpm to obtain the product.

Embodiment 2

[0022] Accurately weigh the following raw materials, bis(7-oxabicyclo[4.1.0]3-heptylmethyl)adipate 30g, rosin epoxy resin 10g, 1,4-butanediol 2g, γ-shrink Put 7g of glyceryloxypropyltrimethoxysilane and 0.5g of carbon black into the reaction kettle, mix at room temperature for 30 minutes, then weigh 0.5g of cationic initiator and put it into the reaction kettle, mix at room temperature for 2 hours, then weigh the silicon Add 50g of fine powder into the reaction kettle, stir and mix for 2 hours at a temperature of 25°C, a vacuum of -0.07MPa, and a rotation speed of 1000 rpm to obtain the product.

Embodiment 3

[0024] Accurately weigh the following raw materials, bis(7-oxabicyclo[4.1.0]3-heptylmethyl)adipate 14g, bisphenol A epoxy resin (E51) 10g, rosin epoxy resin 20g, 4.8g of 1,4-butanediol, 10g of γ-mercaptopropyltrimethoxysilane, and 0.5g of carbon black were put into the reactor, and mixed at room temperature for 30 minutes, then 0.7g of cationic initiator was put into the reactor, and Mix at room temperature for 2 hours, then weigh 40g of silicon micropowder at a temperature of 25°C, a vacuum of -0.05MPa, and a rotation speed of 1000 rpm, and stir and mix for 2 hours to obtain the product.

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Abstract

The invention relates to an adhesive, and particularly relates to an underfill adhesive with good compatibility and a preparation method thereof, which are applicable to the underfilling for packaging such as chip size packaging (CSP), ball grid array (BGA) packaging and the like, and belong to the field of adhesives. The underfill adhesive is composed of the following raw materials in parts by weight: 20-50 parts of epoxy resin, 5-20 parts of rosin epoxy resin, 2-15 parts of polyols, 5-10 parts of a silane coupling agent, 0.5-1 part of a cationic initiator, 35-55 parts of silicon powder, and 0.5 part of carbon black. The underfill adhesive disclosed by the invention is high in flow speed, and meets the requirements for high density packaging; the underfill adhesive has good compatibility with a soldering flux, and the formation of defects in the processes of flowing and curing is reduced; the shrinkage rate is low, and the reliability of packaging components is effectively guaranteed; the underfill adhesive is small in smell after being cured, thereby complying with the trend of environmental protection; and the underfill adhesive is good in storage stability, and convenient to use and store.

Description

technical field [0001] The invention relates to an adhesive, in particular to an underfill adhesive with good compatibility and a preparation method thereof, which is suitable for underfilling of packages such as chip size packaging (CSP) and ball grid array packaging (BGA), and belongs to adhesive drug field. Background technique [0002] With the rapid development of the electronics industry, the closely related electronic packaging technology is becoming more and more advanced. Intelligence, light weight, small size, fast speed, strong function, and good reliability have become the main development trends of electronic products. In order to adapt to the development of this trend, flip-chip technology has been produced. Key benefits of flip-chip include shrinkability and space savings, in addition to shorter and lower inductance interconnect paths, high I / O density, rework and self-alignment capabilities. Flip-chip performance is also outstanding for thermal management....

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J163/00C09J163/02C09J163/04C09J11/04C09J11/06
Inventor 王红娟王建斌陈田安解海华
Owner YANTAI DARBOND TECH
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