Solvent-free epoxy-tetramaleimide resin adhesive and preparation method thereof

A solvent-free and adhesive technology is applied in the field of solvent-free epoxy-tetrama adhesive and its preparation, and can solve the problems of high cost, high price, and unfavorable large-scale popularization and application of polyetherimide resin. , to achieve the effect of good comprehensive performance, convenient operation and low cost

Inactive Publication Date: 2013-11-27
DONGHUA UNIV +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0011] (2) Monomers such as 2,2-bis(3-amino-4-hydroxyphenyl)hexafluoropropane (BAHPFP) are expensive, resulting in high cost of polyetherimide resin (HPEI) and adhesives, which is not conducive to Large-scale promotion and application can only be limited to some special fields

Method used

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  • Solvent-free epoxy-tetramaleimide resin adhesive and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0038] Embodiment 1: the preparation of A component

[0039] Mix 100 grams of N,N,N',N'-tetraglycidyl-2,2-bis[4-(4-aminophenoxy)phenyl]propane (TGBAPOPP) epoxy resin, 50 grams of isophthalic Add phenol diglycidyl ether epoxy resin to the reaction kettle, add 3 grams of 4,4'-bis(4-aminophenoxy)diphenyl sulfide and 3 grams of 2,2-bis[4-(4-aminobenzene oxy)phenyl]propane and 20 grams of 1,4-bis(2,4-dimaleimidophenoxy)benzene, stirred and reacted at 80°C for 0.5 hours, cooled to 50°C, and added 10 grams Hydrogenated bisphenol A epoxy resin and 15 grams of 3,4-epoxy cyclohexanoic acid-3',4'-epoxy cyclohexyl methyl ester were stirred and reacted at 50°C for 0.5 hour to obtain 201 grams of component A, Denote it as A1.

[0040] Mix 100 grams of N,N,N',N'-tetraglycidyl-2,2-bis[4-(4-aminophenoxy)phenyl]propane (TGBAPOPP) epoxy resin, 10 grams of isophthalic Add phenol diglycidyl ether epoxy resin to the reaction kettle, add 5 grams of 2,2-bis[4-(4-aminophenoxy)phenyl]hexafluoropropa...

Embodiment 2

[0043] Embodiment 2: the preparation of B component

[0044] Put 50 grams of m-xylylenediamine, 20 grams of resorcinol diglycidyl ether epoxy resin and 10 grams of 1,3-bis(2,4-bismaleimidophenoxy)benzene into the reaction In the still, stir and react at 60° C. for 0.5 hour to obtain 80 g of component B, which is designated as B1.

[0045] Mix 60 grams of m-xylylenediamine, 20 grams of resorcinol diglycidyl ether epoxy resin, 4 grams of 2,2-bis[4-(2,4-dimaleimidophenoxy)benzene Base] propane and 2 grams of 1,3-bis(2,4-dimaleimidophenoxy)benzene were put into the reaction kettle, stirred and reacted at 100°C for 1.5 hours, and 86 grams of component B were obtained. Do B2.

[0046] Put 80 grams of m-xylylenediamine, 20 grams of resorcinol diglycidyl ether epoxy resin and 8 grams of 1,4-bis(2,4-bismaleimidophenoxy)benzene into the reaction In the still, stir and react at 80° C. for 1 hour to obtain 108 grams of component B, which is designated as B3.

[0047] 100 grams of m-xy...

Embodiment 3

[0048] Embodiment 3: the preparation of adhesive

[0049] At room temperature, add 20 grams of A1 and 20 grams of B3 into the reaction kettle and stir and mix evenly to obtain 40 grams of solvent-free epoxy-tetrama adhesive, which is designated as ETA1.

[0050] At room temperature, add 10 grams of A1, 20 grams of A3 and 20 grams of B1 into the reaction kettle and stir and mix evenly to obtain 40 grams of solvent-free epoxy-tetrama adhesive, which is designated as ETA2.

[0051] At room temperature, add 10 grams of A2, 15 grams of A3, 5 grams of A4, 10 grams of B2, and 5 grams of B4 into the reaction kettle and stir and mix evenly to obtain 45 grams of solvent-free epoxy-tetrama adhesive, which is designated as ETA3.

[0052] At room temperature, add 40 grams of A4, 5 grams of B1, and 5 grams of B4 into the reactor and stir and mix evenly to obtain 50 grams of solvent-free epoxy-tetrama adhesive, which is designated as ETA4.

[0053] At room temperature, add 20 grams of A1, 1...

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Abstract

The invention relates to a solvent-free epoxy-tetramaleimide resin adhesive and a preparation method thereof. The adhesive is composed of a component A and a component B with a mass ratio of 1-4:1. The component A is composed of N,N,N',N'-tetraglycidyl-2,2-bis[4-(4-aminophenoxy)phenyl]propane epoxy resin, resorcin diglycidyl epoxy resin, an active diluting agent, aromatic diamine, and tetramaleimide resin with a mass ratio of 100:10-80:10-50:5-10:10-30. The component B is composed of resorcin diglycidyl epoxy resin, xylylenediamine, and tetramaleimide resin with a mass ratio of 20:50-100:5-10. The method provided by the invention has the advantages of simple synthesis process and environment friendliness. The adhesive has excellent comprehensive performance, and can be used in bonding of substrates such as glass, ceramic, metal, epoxy resin-based composite material, and the like. The adhesive has high bonding strength and wide market prospect.

Description

technical field [0001] The invention belongs to the field of polymer materials and their preparation, in particular to a solvent-free epoxy-tetrama adhesive and a preparation method thereof. Background technique [0002] As we all know, epoxy resin has many excellent properties: (1) Good bonding performance: high bonding strength, wide bonding surface, it is compatible with many metals (such as iron, steel, copper, aluminum, metal alloys, etc.) The bonding strength of metal materials (such as glass, ceramics, wood, plastics, etc.) is very high, and some even exceed the strength of the bonded material itself, so it can be used in many stressed structural parts and is the main component of structural adhesives One; (2) Good processing performance: the flexibility of epoxy resin formula, the diversity of processing technology and product performance are the most prominent among polymer materials; (3) Good stability performance: the curing of epoxy resin is mainly It relies on ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J163/00C09J179/08C09J11/06
Inventor 虞鑫海陈东红虞静远
Owner DONGHUA UNIV
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