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Application of flexible thermal conductive insulation adhesive on LED (Light Emitting Diode) heat dissipation substrate

A heat-conducting, insulating and adhesive technology, applied in the field of polymer material preparation, can solve problems such as complex preparation process, and achieve the effects of high peel strength, high heat dissipation, and strong adhesion

Inactive Publication Date: 2013-11-27
HAISO TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The cover film has certain insulation and thermal conductivity, but the preparation process is complicated

Method used

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  • Application of flexible thermal conductive insulation adhesive on LED (Light Emitting Diode) heat dissipation substrate

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0034] Place the high thermal conductivity inorganic filler in a vacuum oven at 140°C to vacuum dry for 4 hours to remove moisture, and cool to room temperature; weigh the high thermal conductivity inorganic filler in an ethanol aqueous solution (95% by volume of ethanol) in which the coupling agent KH560 is dissolved according to the proportion %), heated in a water bath to 40°C, stirred for 4 hours, filtered, washed twice with absolute ethanol, dried in vacuum at 60°C for 12 hours, ground into powder to obtain a surface-treated high thermal conductivity inorganic filler for use;

[0035] Choose bisphenol A epoxy resin E-44 as liquid epoxy resin, choose bisphenol A epoxy resin CYD-014 as solid epoxy resin, choose CTBN1300×31 as toughening agent, choose dapsone as curing agent , the mixture of alumina, boron nitride and silicon carbide (arbitrary ratio) is selected as the high thermal conductivity inorganic filler, H-1331 is selected as the leveling agent, and the mixed solutio...

Embodiment 2

[0039] The surface treatment process of the high thermal conductivity inorganic filler is as described in Example 1, and the coupling agent is replaced by KH550.

[0040] Choose bisphenol A epoxy resin E-42 as liquid epoxy resin, choose bisphenol A epoxy resin CYD-011 as solid epoxy resin, choose carboxyl-terminated liquid nitrile rubber CTBN1300×8 as toughener, choose Dapsone is used as a curing agent, a mixture of alumina, boron nitride and silicon carbide (arbitrary ratio) is used as a high thermal conductivity inorganic filler, H-140 is used as a leveling agent, ethyl acetate, tetrahydrofuran and dimethylformamide are selected (arbitrary ratio) of the mixed solution as an organic solvent. The preparation process of the thermally conductive and insulating adhesive is as described in Example 1, and the dosage of each formulation of the flexible thermally conductive and insulating adhesive is shown in Example 2 in Table 1.

[0041] The obtained flexible thermally conductive ...

Embodiment 3

[0044] The surface treatment process of the highly thermally conductive inorganic filler is as described in Example 1, and the coupling agent is replaced by TMC-201.

[0045] The polybutadiene epoxy resin Oxiron2000 was selected as the liquid epoxy resin, the o-cresol aldehyde epoxy resin CYDCN-100 was selected as the solid epoxy resin, the amino-terminated liquid nitrile rubber ATBN1300×35 was selected as the toughening agent, and dapsone was selected As a curing agent, a mixture of alumina, boron nitride and silicon carbide (arbitrary ratio) is selected as a high thermal conductivity inorganic filler, H-1231 is used as a leveling agent, and acetone, tetrahydrofuran and dimethylformamide (arbitrary ratio) are selected. The mixed solution is used as an organic solvent. The preparation process of the flexible thermally conductive insulating adhesive is as described in Example 1, and the dosage of each formulation of the flexible thermally conductive insulating adhesive is shown...

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Abstract

The invention relates to application of a flexible thermal conductive insulation adhesive on an LED (Light Emitting Diode) heat dissipation substrate, which comprises preparation of a flexible thermal conductive insulation adhesive and a flexible thermal conductive insulation adhesive film. The flexible thermal conductive insulation adhesive contains liquid epoxy resin, solid epoxy resin, a flexibilizer, a curing agent, a high thermal conductive inorganic filling material, an organic solvent, a coupling agent, a dispersing agent and a flatting agent. A preparation method of the flexible thermal conductive insulation adhesive film comprises the following steps of coating the flexible thermal conductive insulation adhesive on a release film through a coating machine, and roasting through a temperature control drying tunnel to prepare a flexible thermal conductive insulation adhesive layer for the LED heat dissipation substrate; and compounding the release film for covering on the adhesive surface, and rolling and forming to prepare the flexible thermal conductive insulation adhesive film for the LED heat dissipation substrate. The adhesive film disclosed by the invention is used for the LED heat dissipation substrate and has the characteristics of high heat dissipation, insulation, heat resistance, release intensity, flexible and the like.

Description

technical field [0001] The present invention is a divisional case of patent CN102676109A, the patent name being "a preparation method of a flexible heat-conducting insulating adhesive film for LED heat-dissipating base material". It belongs to the field of polymer material preparation. The invention relates to the application of a flexible heat-conducting and insulating adhesive on an LED heat-dissipating base material. Background technique [0002] As a high-profile emerging product, light-emitting diode (LED) has the advantages of high brightness, small size, long life, environmental protection and energy saving, and has been widely used in indoor and outdoor lighting, display light source, automotive lamp, backlight and other industries . With the popularity of LED applications, the main factor and technical bottleneck restricting its development is heat dissipation. Improving LED luminous efficiency and service life, and solving the heat dissipation problem of LED pro...

Claims

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Application Information

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IPC IPC(8): C09D163/02C09D163/04C09D163/08C09D113/00C09D115/00C09D11/04B32B37/12
Inventor 范和平韩志慧李桢林杨蓓刘莎莎
Owner HAISO TECH
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