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Resin composition for forming receiving layer, receiving substrate obtained using same, printed matter, conductive pattern, and electrical circuit

A technology of resin composition and accommodating layer, applied in the directions of printed circuit, printed circuit manufacturing, printing, etc., can solve the problems of disconnection, the heat and humidity resistance of the conductive pattern cannot be said to be sufficient, etc., and achieve the effect of excellent adhesion

Inactive Publication Date: 2013-08-14
DIC CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0025] However, the plating reagent used in the above-mentioned plating treatment or the reagent used in its cleaning step is usually strongly alkaline or strongly acidic, so the peeling of the above-mentioned receiving layer and the like from the support may be caused, resulting in , may cause disconnection, etc.
In addition, the heating conditions and the like in the plating treatment process may cause dissolution, whitening, and peeling of the receiving layer from the support. Therefore, the conventional conductive pattern may not be sufficient in terms of heat and humidity resistance.

Method used

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  • Resin composition for forming receiving layer, receiving substrate obtained using same, printed matter, conductive pattern, and electrical circuit
  • Resin composition for forming receiving layer, receiving substrate obtained using same, printed matter, conductive pattern, and electrical circuit
  • Resin composition for forming receiving layer, receiving substrate obtained using same, printed matter, conductive pattern, and electrical circuit

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0215] Example 1

[0216] 350 parts by mass of deionized water and 4 parts by mass of LATEMUL E-118B (manufactured by Kao Co., Ltd.: active ingredient 25% by mass) were added to a reaction container equipped with a stirrer, a reflux cooling tube, a nitrogen introduction tube, a thermometer, and a dropping funnel, The temperature was raised to 70° C. while blowing nitrogen gas.

[0217] Under stirring, a vinyl monomer mixture containing 55.0 parts by mass of methyl methacrylate, 38.0 parts by mass of n-butyl acrylate and 7.0 parts by mass of methacrylic acid, Aqualon KH- A part (5 parts by mass) of the monomer pre-emulsion obtained by mixing 4 parts by mass of 1025 (made by Daiichi Kogyo Pharmaceutical Co., Ltd.: active ingredient 25 mass %) and 15 parts by mass of deionized water, and then adding potassium persulfate 0.1 It was made to polymerize for 60 minutes, maintaining the temperature in the reaction container at 70 degreeC.

[0218] Then, while maintaining the tempera...

Embodiment 2～6

[0225] Examples 2 to 6

[0226] Except for changing the composition of the vinyl monomer mixture to the composition described in the following Table 1, a resin combination for forming a receiving layer with a non-volatile content of 20% by mass was prepared by the same method as that described in Example 1. Objects (I-2) ~ (I-6).

[0227] In addition, the resin compositions (I-2) to (I-6) for forming an accepting layer were respectively used instead of the resin composition for forming an accepting layer (I-1), using the same method described in Example 1. In the same way as above, the receiving substrates (II-2) to (II-6) were produced.

Embodiment 7

[0228] Example 7

[0229]350 parts by mass of deionized water and 4 parts by mass of LATEMUL E-118B (manufactured by Kao Co., Ltd.: active ingredient 25% by mass) were added to a reaction container equipped with a stirrer, a reflux cooling tube, a nitrogen introduction tube, a thermometer, and a dropping funnel, The temperature was raised to 70° C. while blowing nitrogen gas.

[0230] Under agitation, a vinyl monomer mixture containing 55.0 parts by mass of methyl methacrylate, 38.0 parts by mass of n-butyl acrylate, and 7.0 parts by mass of methacrylic acid, Aqualon KH-1025 (Daiichi Kogyo Pharmaceutical Co., Ltd. Co., Ltd.: a part (5 parts by mass) of the monomer pre-emulsion obtained by mixing 4 parts by mass of active ingredient 25 mass %) and 15 parts by mass of deionized water, then add 0.1 parts by mass of potassium persulfate, and react Polymerization was carried out for 60 minutes while maintaining the temperature in the container at 70°C.

[0231] Then, while maint...

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Abstract

The present invention addresses the problem of providing a resin composition for forming a receiving layer, the resin composition being capable of forming a highly adhesive receiving layer, of ensuring water resistance and the ability to form fine lines both with water-based conductive inks and solvent-based conductive inks, and of forming conductive patterns or the like that have wet heat resistance. This invention is related to a resin composition for forming a receiving layer, characterized in that: the resin composition contains a vinyl resin (A) having a weight-average molecular weight of at least 100,000 and an acid value of 10-80, an aqueous medium (B), and, as necessary, at least one component (C) selected from the group consisting of a water-soluble resin (c1) and a filler (c2);the vinyl resin (A) being dispersed in the aqueous medium (B); and the amount of the component (C) being 0-15% by mass with respect to the total amount of the vinyl resin (A).

Description

technical field [0001] The present invention relates to a printed matter such as a resin composition for forming a receiving layer, a receiving substrate, and a conductive pattern that can receive a fluid such as conductive ink that is discharged by various printing methods including inkjet printing. Background technique [0002] In recent years, in inkjet printing-related industries that have grown significantly, the performance of inkjet printers and the improvement of ink have been greatly promoted, and even ordinary families can easily obtain high-definition printing comparable to silver salt photos Moreover, the image which was excellent in vivid printability was obtained. As a result, inkjet printers have begun to be used not only at home but also in various industries. [0003] Specifically, the technique of using the inkjet printing in the case of making conductive patterns such as circuits is being studied. This is because, along with the demand for high performan...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B41M5/00B41M5/50B41M5/52C08F220/12C09D133/04C09D157/00
CPCB41M5/52C09D133/04C08L33/12B41M5/50C08L2201/54B41M5/00C08F220/12B41M5/5254H05K3/1283H05K1/0373C09D157/00C09D133/12Y10T29/49158C08L101/00
Inventor 齐藤公惠富士川亘白发润
Owner DIC CORP
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