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Soft board base material without glue and preparation method thereof

A soft board substrate and base material technology, applied in circuit substrate materials, chemical instruments and methods, printed circuit manufacturing, etc., can solve the problems of poor dimensional stability, different material properties, poor heat resistance, etc., and achieve mechanical processing performance. Good, easy processing, excellent bending performance

Active Publication Date: 2013-06-19
英德宏庆电子有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

3L-FCCL is mainly composed of three layers of insulating base film, adhesive, and copper foil. However, the heat resistance and dimensional stability of the adhesive are poor. The field of board substrates is extremely limited
The manufacturing methods of the second type of flexible substrates are different, the material properties are also different, and the applied product items are different. 3L-FCCL is used in the current bulk of flexible board products, while 2L-FCCL is used in higher-level flexible board manufacturing. , such as soft and hard boards, COF, etc., and the price of 2L-FCCL is relatively expensive, the output is low, and there are also problems of slow output speed and low quality
Traditional circuit substrates are mostly adhesive materials, which are made by composite pressing of polymer adhesive materials and copper plates. This material has great disadvantages: 1) The peel strength between the metal and the base material is low, and at the same time due to the existence of adhesive materials Poor heat resistance; 2) Poor dimensional stability; 3) Poor adjustability of metal thickness, unable to achieve ultra-thin metal layer
4) The use of chemical materials makes it difficult to solve environmental problems
[0007] The comprehensive performance of the non-adhesive soft board base material prepared by the above method is better than that of the adhesive base material, which is the main development trend of the current base material. The thickness uniformity of the metal material layer of the board substrate is poor, the metal material layer is thick, and the thickness of the metal material layer cannot be adjusted during the preparation process, and the ultra-thin metal layer cannot be achieved. The composite strength of the metal material layer and the PI base film is weak, and the bending performance Poor, poor machining performance and other defects, the reliability of the base material is poor during use, which seriously affects the subsequent use performance of the base material

Method used

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  • Soft board base material without glue and preparation method thereof
  • Soft board base material without glue and preparation method thereof

Examples

Experimental program
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Effect test

preparation example Construction

[0052] The preparation method of the non-adhesive soft board base material is as follows:

[0053] 1. Corona treatment

[0054] According to the characteristics of PI, under the condition of air cleanliness of 10,000 grades, and in the environment of eliminating static electricity, the polyimide (PI) film with a thickness of 3-50um and a width of 20-1200mm is sent into the corona machine. The surface of the film is subjected to surface corona treatment to improve the adhesion performance of the surface of the base material PI film. During the corona treatment, the control voltage is 5000-20000V, and the corona voltage and current are adjusted until the surface energy of the PI film reaches 50. -55 dyne.

[0055] Wherein, the corona treatment described in the present invention is conventional surface corona treatment.

[0056] 2. Physical vapor deposition treatment

[0057] Send the corona-treated base material PI film into the magnetron sputtering equipment, control the tem...

Embodiment 1

[0068] Example 1 Preparation method of non-adhesive soft board substrate with double-sided metal layer

[0069] 1. Corona treatment

[0070] According to the characteristics of PI, under the condition of air cleanliness of 10,000 grades, and in the environment of eliminating static electricity, the polyimide (PI) film base material with a thickness of 50um and a width of 1200mm is sent into the corona machine, the PI film Surface corona treatment is carried out on both sides (that is, the upper and lower sides) to improve the adhesion performance of the surface of the PI film of the base material. During the corona treatment, the control voltage is 20000V, and the corona voltage and current are adjusted to reach the surface energy of the PI film. Reach 50 dyne.

[0071] Wherein, the corona treatment described in the present invention is conventional surface corona treatment.

[0072] 2. Physical vapor deposition treatment

[0073] Send the PI film of the base material that ...

Embodiment 2

[0084] Example 2 Preparation method of non-adhesive soft board substrate with single-sided metal layer

[0085] 1. Corona treatment

[0086] According to the characteristics of PI, under the condition of air cleanliness of 10,000 grades, and in the environment of eliminating static electricity, the polyimide (PI) film base material with a thickness of 3um and a width of 30mm is sent into the corona machine, the PI film Surface corona treatment is carried out on one side (ie, the upper surface) to improve the adhesion performance of the surface of the PI film of the base material. In the process of corona treatment, the control voltage is 5000V, and the corona voltage and current are adjusted to reach the surface energy of the PI film. Reach 55 dyne.

[0087] Wherein, the corona treatment described in the present invention is conventional surface corona treatment.

[0088] 2. Physical vapor deposition treatment

[0089] Send the PI film of the substrate material treated by s...

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Abstract

A functional soft board base material without glue is composed of a metal layer, a basal layer and a metal passivation layer which are superimposed. The manufacturing method includes that (1), polyimide is used to make a basal body, and surface treatment is performed for two faces (or one face) of the basal body; (2), a physical vapor deposition (PVD) method is adopted to deposit and form a metal membrane layer on a product improve (PI) face of a treated face; and (3), passivation treatment is performed for the metal membrane layer. The soft board base material without the glue has high-strength tensile performance, excellent chemical resistance, heat resistance, dimensional stability, peel strength, compactness, uniform consistency, and mechanical machining performance, is strong in shielding function, and can be used for manufacturing printed circuit boards (PCB), flexible printed circuits (FPC), soft and hard combination plate, special function (shielding function) material and the like, the PVD method is adopted to deposit the metal layer, the thickness of the metal layer is enabled to be adjustable, achievement of superfine precision circuit is enabled to be possible, and the soft board base material without glue is low in cost, environment-friendly, good in bending performance and easy for technical processing.

Description

technical field [0001] The invention relates to a soft board base material and a preparation method thereof, in particular to an adhesive-free soft board base material and a preparation method thereof. Background technique [0002] "Without electronic substrates, there would be no electronic technology industry today." Benefiting from the rapid development of electronic information and other industries, the market demand for electronic substrates is becoming stronger and stronger. Flexible Printed Circuit (FPC), referred to as FPC, has the advantages of softness, lightness, thinness and flexibility. It has been widely used under the trend of information electronics products becoming light, thin, short and small. Used in notebook computers, digital related, mobile phones, LCD monitors, etc. At present, the world's electronic substrates use adhesive substrates and non-adhesive substrates. [0003] The traditional glued flexible board substrates are divided into two categorie...

Claims

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Application Information

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IPC IPC(8): H05K1/05H05K3/00B32B15/08
Inventor 祝琼
Owner 英德宏庆电子有限公司
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