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Method for hole machining with picosecond laser

A picosecond laser and hole processing technology, which is applied in laser welding equipment, metal processing equipment, manufacturing tools, etc., can solve problems affecting the application effect of CMC-SiC materials, CMC-SiC material processing, etc., to achieve strong designability, Good forming quality and good designability

Active Publication Date: 2013-06-12
NORTHWESTERN POLYTECHNICAL UNIV
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0006] In order to overcome the disadvantages existing in the prior art that holes smaller than Φ2.0mm cannot be processed on CMC-SiC materials, especially cooling holes with angles, which affect the application effect of CMC-SiC materials, the present invention proposes a The method of processing holes by picosecond laser,

Method used

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  • Method for hole machining with picosecond laser

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Embodiment 1

[0026] The method for forming round holes proposed in this embodiment is suitable for silicon carbide ceramic matrix composite materials, and in this embodiment only a C / SiC composite material sample is used as an example for illustration. The diameter of the formed pores was 650 μm.

[0027] In this embodiment, the picosecond laser used is a Nd:YAG picosecond laser from Light Conversion Company of Lithuania.

[0028] The concrete process of this embodiment is:

[0029] Step 1, the surface of the sample is cleaned. Cut the 2D CVI C / SiC composite material into a rectangular block sample of 20mm×10mm×3mm, then ultrasonically clean the sample for 15 minutes under alcohol immersion to remove surface dust, oil and other impurities, and finally dry it in a drying oven to obtain the cleaned of samples.

[0030] Step 2, machining holes. Micromachining of 2D CVI C / SiC composite samples by picosecond laser. During processing, the wavelength of the picosecond laser is 355-532nm, the...

Embodiment 2

[0041] The method for forming square holes proposed in this embodiment is suitable for silicon carbide ceramic matrix composite materials, and this embodiment only uses SiC / SiC composite material samples as an example for illustration. The plane size of the formed hole is: 650μm*650μm.

[0042] In this embodiment, the picosecond laser used is an Nd:YAG picosecond laser from Light Conversion Company of Lithuania.

[0043] The concrete process of this embodiment is:

[0044] Step 1, the surface of the sample is cleaned. Cut the 2D CVI C / SiC composite material into a rectangular block sample of 20mm×10mm×3mm, then ultrasonically clean the sample for 15 minutes under alcohol immersion to remove surface dust, oil and other impurities, and finally dry it in a drying oven to obtain the cleaned of samples.

[0045] Step 2, machining holes. Holes are machined on 2D CVI C / SiC composite samples by picosecond laser. During processing, the wavelength of the picosecond laser is 355-532...

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Abstract

A method for hole machining with picosecond laser realizes hole machining on CMC-SiC (Ceramic Matrix Composite-Silicon Carbide) material according to the characteristics of fiber composite materials and the machining feature that picosecond laser is suitable for various materials due to superhigh peak power of picosecond laser. According to the method, round holes or square holes are machined in the CMC-SiC material layer by layer in a distributed machining mode; the influence of tiny cracks can be ignored during machining; the stability is good; and the method is particularly suitable for mass repeated micro-hole machining. Layer-by-layer machining in a heliciform way is adopted when round holes are machined; and layer-by-layer machining in a linear scanning way is adopted when square holes are machined. The method has the advantages of good stability of the machining technology, strong designability, high precision and the like.

Description

technical field [0001] The invention relates to the field of composite material processing, in particular to a method for processing holes on silicon carbide ceramic matrix composite materials by using a picosecond laser Background technique [0002] Continuous fiber toughened silicon carbide ceramic matrix composite (CMC-SiC) is a new strategic high-temperature structural material. Compared with titanium alloys, superalloys and intermetallic compounds, CMC-SiC materials have lower thermal expansion coefficients, better resistance to high and low cycle fatigue and thermal shock fatigue; at the same time, they have ablation resistance, erosion resistance, high dynamic and static friction coefficients and A series of excellent properties such as friction coefficient is not sensitive to humidity. In addition, CMC-SiC materials can effectively increase the operating temperature of the engine and reduce the structural weight, and have broad application prospects in high thrust-t...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K26/38B23K26/42B23K26/382B23K26/60
Inventor 刘永胜张立同成来飞王春辉张青
Owner NORTHWESTERN POLYTECHNICAL UNIV
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