Electronic packaging material

Abstract

The invention discloses an electronic packaging material. The electronic packaging material is characterized by comprising a matrix and a reinforcement, wherein the matrix is made of aluminum, copper, aluminum alloy or copper alloy, the reinforcement is of graphene accounting for 0.5-30% of total mass percentage, and the graphene has 1-20 layers of tiny plates the area of each which is 1-5000 mu m<2> or plates the area of each which is more than 1mm<2>; and the aluminum or copper metal comprises Cr, Fe, Ti, W, B or Mo element, the content of the Cr, Fe, Ti, W, B or Mo element is 0.05-1%. The electronic packaging material has the advantages of being high-heat conductivity, high-strength, low-density, environment-friendly and good in machineable property; and as the electronic packaging material, the composite has excellent property and good application prospects.

Description

technical field [0001] The invention relates to material science, in particular to an electronic packaging material with aluminum or copper as a matrix and graphene as an additive. technical background [0002] In microelectronic integrated circuits, highly dense tiny components generate a lot of heat during operation. The thermal expansion coefficient mismatch between the chip and the packaging material will cause thermal stress fatigue, and the poor heat dissipation performance of the packaging material will cause the chip to overheat. The latter has become the main failure mode of electronic circuit devices. According to the development requirements of integrated circuits and the working environment of electronic components, ideal electronic packaging materials must meet the following basic requirements: [0003] 1) Low coefficient of thermal expansion (CTE), can match with Si, GaAs and other semiconductor materials [0004] 2) Excellent thermal conductivity [0005] 3...

AI Technical Summary

Problems solved by technology

[0005] 3) Low density

[0011] Commonly used electronic packaging materials mainly include: Al 2 o 3 , BeO, AlN, Al, Cu, W, Kovar, W-Cu, etc. However, these traditional materials can no longer meet the performance requirements of electronic packaging materials, Al 2 o 3 The thermal expansion coefficient of Kovar is matched with Si and GaAs, but the thermal conductivity is too low; the thermal conductivity of BeO is close to GaAs and has good thermal conductivity characteristics, but it is highly toxic; Al and Cu have high thermal conductivity, but the thermal expansion coefficient Too large; W-Cu density is too large, AlN has problems such as poor processing and electroplating performance