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Surface treatment technology for ceramic substrate of LED (light-emitting diode) area light source

A technology of LED surface light source and ceramic substrate, which is applied in the direction of electrical components, circuits, semiconductor devices, etc., can solve the problems of reducing the ability to maintain light efficiency, achieve the effects of improving long-term stability, increasing reflectivity, and reducing light attenuation

Inactive Publication Date: 2013-04-17
HANGZHOU HANGKE OPTOELECTRONICS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

At present, in order to improve the reflectivity of the surface of the ceramic substrate, the industry often adopts the process of silver plating on the surface of the ceramic substrate. However, during the long-term use, the Ag layer will be vulcanized, and the black silver sulfide will absorb the light emitted by the LED and reduce the light emission. Efficiency maintenance

Method used

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  • Surface treatment technology for ceramic substrate of LED (light-emitting diode) area light source
  • Surface treatment technology for ceramic substrate of LED (light-emitting diode) area light source
  • Surface treatment technology for ceramic substrate of LED (light-emitting diode) area light source

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0021] (1) Clean the alumina ceramic substrate with fixed LED chips and bonding wires on the surface with deionized water, and then dry it in an oven at 120°C for 30 minutes;

[0022] (2) Carry out radio frequency treatment to the alumina ceramic substrate obtained in step (1) in a plasma cleaning machine, the radio frequency power is 250W, the Ar gas flow rate is 20 SCCM, and the treatment time is 1min;

[0023] (3) KER-2500 (silica gel, produced by Shin-Etsu Chemical), TiO 2 , SiO 2 Mix it with YAG-04 (yellow fluorescent powder, produced in the United States) at a weight ratio of 1:5:0.08:0.15, and stir in a vacuum defoaming mixer for 10 minutes;

[0024] (4) Cover the mask plate on the alumina ceramic substrate treated in step (2), use the mask plate to cover and fix the LED chip and bonding wire area, and apply the mixture obtained in step (3) by screen printing On a ceramic substrate with a mask;

[0025] (5) Remove the mask to get the following figure 1 As shown in t...

Embodiment 2

[0028] (1) Clean the alumina / aluminum nitride composite ceramic substrate with fixed LED chips and bonding wires on the surface with deionized water, and then dry it in an oven at 80°C for 60 minutes;

[0029] (2) Perform radio frequency treatment on the aluminum oxide / aluminum nitride composite ceramic substrate obtained in step (1) in a plasma cleaning machine, the radio frequency power is 150W, the Ar gas flow rate is 35 SCCM, and the treatment time is 3min;

[0030] (3) OE-6650 (silica gel, produced by Dow Corning, USA), ZrO 2 , SiO 2 , Y4156 (green silicate phosphor, produced by Intel America) and BR-102D (nitride red phosphor, produced by Mitsubishi Chemical, Japan) are mixed together in a weight ratio of 1:2:0.01:0.015:0.005. Stir in a vacuum defoaming mixer for 5 minutes;

[0031] (4) Cover the mask plate on the aluminum oxide / aluminum nitride composite ceramic substrate processed through step (2), use the mask plate to cover the fixed LED chip and bonding wire area,...

Embodiment 3

[0034] (1) Use deionized water to clean the surface of the aluminum nitride ceramic substrate with Ag-plated surface and fixed LED chip and bonding wire area, and dry the ceramic substrate after surface cleaning in an oven at 120 ° C for 45 minutes;

[0035] (2) Carry out radio frequency treatment to the aluminum nitride ceramic substrate plated with Ag on the surface obtained in step (1) in a plasma cleaning machine, the radio frequency power is 200W, the Ar gas flow rate is 30 SCCM, and the treatment time is 2min;

[0036] (3) HK-Si55D40 (silica gel, China Hangke Optoelectronics Co., Ltd.), TiO 2 , SiO 2 , Y36E (yellow-green aluminate phosphor, produced by Taiwan Chimei Industrial Co., Ltd.) and BR-102D (nitride red phosphor, produced by Mitsubishi Chemical Co., Ltd.) are mixed together in a weight ratio of 1:3.5:0.05:0.08:0.01. Stir in a vacuum defoaming mixer for 8 minutes;

[0037] (4) Cover the mask plate on the aluminum nitride ceramic substrate treated in step (2), u...

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Abstract

The invention discloses a surface treatment technology for a ceramic substrate of an LED (light-emitting diode) area light source. The surface treatment technology comprises the following steps of: firstly, washing a ceramic substrate provided with a fixed LED chip and a bonding wire area on the surface by deionized water, drying and then carrying out radio frequency washing; after that, covering a mask plate on the ceramic substrate; covering the fixed LED chip and the bonding wire area by the mask plate, and coating even mixture of silica gel, disperse powder, anti-setting powder and fluorescent powder onto the mask plate; and uncovering the mask plate, heating and curing to obtain the ceramic substrate coated with a light reflecting layer, wherein the ceramic substrate can be used for preparing the LED area light source. After the surface of the ceramic substrate is treated by the surface treatment technology, the reflectivity of the ceramic substrate is effectively increased, the lost luminous flux caused by transmitting the substrate downward can be reduced, a lighting effect of the LED area light source is improved, and the surface performance of the ceramic substrate can be well protected.

Description

technical field [0001] The invention relates to a surface treatment process for a ceramic substrate used for an LED surface light source, and belongs to the technical field of LED packaging. Background technique [0002] As a new type of light source, LED (Light Emitting Diode) has the advantages of long life, high luminous efficiency, high stability, good safety, no mercury, no radiation, and low power consumption. It is gradually replacing traditional light sources in various fields. The use of ceramic substrates to make LED surface light sources has the advantages of good heat dissipation, no glare, uniform light emission, and high voltage resistance, and is one of the leading directions for the development of packaging technology. [0003] At present, most of the ceramic substrates used for LED surface light sources are alumina or alumina / aluminum nitride composite ceramics. There are fixed LED chips and bonding wire areas on the substrate. The substrate itself has a cer...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C04B41/85H01L33/48H01L33/60
Inventor 严钱军高基伟杨敬葵徐小秋李红兰
Owner HANGZHOU HANGKE OPTOELECTRONICS
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