High refraction and high adhesion large power LED packaging organosilicon material and preparation method thereof
A technology of LED packaging and high adhesion, which is applied in the direction of electrical components, circuits, semiconductor devices, etc., can solve the problems of detachment of packaging materials from the shell, waste products, unsatisfactory bonding of PPA and metal, and achieve colloidal compatibility Good, moderate hardness and flexibility, excellent bonding effect
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Embodiment 1
[0030] Example 1: Stir 100 g of vinyl phenyl polysiloxane and 50 g of vinyl phenyl silicone oil, vacuumize under reduced pressure, heat to 100°C and mix evenly; after cooling down to room temperature, add platinum-containing polysiloxane catalyst 1.1 g, tackifier (preferably adopt the special tackifier of the present invention, also can adopt a kind of silane coupling agent KH-560, alkane coupling agent KH-550, alkane coupling agent KH-570) 1g, vacuum Stir evenly under pressure, and obtain component A after pressure filtration.
[0031]Stir 80g of phenylvinylpolysiloxane, 27g of dihydrogen-terminated phenylpolysiloxane, and 45g of hydrogen-containing phenylpolysiloxane and vacuumize under reduced pressure, heat to 100°C and mix well; after cooling down to room temperature Add 0.1 g of 1-acetylene-1-cyclohexanol, stir evenly under vacuum, and press filter to obtain component B.
[0032] .Take components A and B and mix well, remove air bubbles under vacuum, pour into a mold wi...
Embodiment 2
[0033] Example 2: Stir 100 g of vinyl phenyl polysiloxane and 55 g of vinyl phenyl silicone oil, vacuumize under reduced pressure, heat to 100°C and mix evenly; after cooling down to room temperature, add platinum-containing polysiloxane catalyst 1.2 g. 1.3 g of tackifier (preferably the special tackifier of the present invention, or titanate coupling agent), stir evenly under vacuum, and press filter to obtain component A.
[0034] Stir 80 g of phenyl vinyl polysiloxane obtained above, 23 g of dihydrogen-terminated phenyl polysiloxane, and 54.4 g of hydrogen-containing phenyl polysiloxane, and vacuumize under reduced pressure, heat to 100°C and mix uniformly; After reaching room temperature, add 0.1 g of 2-phenyl-3-butyn-2-ol, stir evenly under vacuum, and press filter to obtain component B.
[0035] Take components A and B and mix well, remove air bubbles under vacuum, pour into a mold with LED chips, bake at 80°C for 1 hour, then bake at 150°C for 2 hours, and then solidify...
Embodiment 3
[0036] Example 3: Stir 100 g of vinyl phenyl polysiloxane and 45 g of vinyl phenyl silicone oil, vacuumize under reduced pressure, heat to 100°C and mix evenly; after cooling down to room temperature, add platinum-containing polysiloxane catalyst 1.1 g. Tackifier (preferably the special tackifier of the present invention, or a simple adduct of hydrogen-containing cyclic body and allyl glycidyl ether) 1.2g, stir evenly under vacuum, and obtain A after pressure filtration Component.
[0037] Stir 80 g of phenyl vinyl polysiloxane obtained above, 16.4 g of dihydrogen-terminated phenyl polysiloxane, and 50.8 g of hydrogen-containing phenyl polysiloxane, then vacuumize under reduced pressure, heat to 100°C and mix well; After cooling down to room temperature, add 0.1 g of 1-acetylene-1-cyclohexanol, stir evenly under vacuum, and press filter to obtain component B.
[0038] Take components A and B and mix well, remove air bubbles under vacuum, pour into a mold with LED chips, bake ...
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