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Integrated-type LED (light-emitting diode) light source heat radiating device and preparation method thereof

A technology for an LED light source and a heat sink, which is applied in the field of an integrated LED light source heat sink and its preparation, can solve the problems that the LED cannot reach a large power value, it is difficult to meet the LED standard and device standard, and the brightness and photoelectric conversion rate are low.

Inactive Publication Date: 2013-02-06
王宁军
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, there is a big problem in the actual application of LEDs, that is, the heat dissipation problem. The heat dissipation problem has always been the bottleneck in the LED application and has not been solved well. It is difficult to meet the LED standards and device standards, which is also a worldwide problem.
Install these modules on different heat dissipation structures (radiators) respectively, and then put them on different lamps. When the light source modules are installed with heat dissipation structures (radiators), there are gaps at the contact points. The usual technology is to use thermally conductive silver glue and The method of applying thermal paste to fill the gap, but there is still a certain thermal resistance between the light source module and the heat sink of the heat dissipation structure, with a large temperature difference, and the problem of heat conduction cannot be completely solved, which leads to the fact that the LED cannot reach a large power value. , making the brightness and photoelectric conversion rate of the LED too low

Method used

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  • Integrated-type LED (light-emitting diode) light source heat radiating device and preparation method thereof
  • Integrated-type LED (light-emitting diode) light source heat radiating device and preparation method thereof
  • Integrated-type LED (light-emitting diode) light source heat radiating device and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0086] When the LED chip is 30W, the main structure of the integrated LED light source cooling device adopts a double-layer overlapping structure;

[0087] Material preparation:

[0088] The first layer (i.e. the base):

[0089] Material A: silicon carbide powder (quality 95%, the quality here is the mass content of silicon carbide); fineness 240 mesh;

[0090] Material B: silicon carbide powder fineness 90 mesh;

[0091] Mass ratio: material A: material B=7:3;

[0092] Silica sol [Quality is above 12%. That is, containing more than 12% silicon] is 15% of the total mass of material A and material B.

[0093] The second layer (ie heat sink):

[0094] (1) Material C: silicon carbide powder fineness 80 mesh

[0095] (2) Material D: silicon carbide powder fineness 100 mesh

[0096] Mass ratio: material C: material D=7:3;

[0097] (3) Epoxy resin (mass is 10% of the total mass of material C and material D)

[0098] (4) Pore-forming agent ethyl naphthalene (mass is 3% of th...

example 2

[0104] When the LED chip is 50W, the main structure of the integrated LED light source cooling device adopts a double-layer overlapping structure;

[0105] Material preparation:

[0106] First layer (pedestal):

[0107] (1) Material A: silicon carbide powder (quality 95%) with a fineness of 60 mesh, or use ceramic fiber ceramic particles

[0108] (2) Material B: silicon carbide powder (quality 95%) fineness 100 mesh

[0109] Mass ratio: Material A: Material B=6:4

[0110] (3) Silica sol [the quality is above 12%. That is, containing more than 12% silicon] is 15% of the total mass of material A and material B.

[0111] The second layer (heat sink):

[0112] (1) Material C: silicon carbide powder fineness 30 mesh

[0113] (2) Material D: silicon carbide powder fineness 80 mesh

[0114] Mass ratio: material C: material D=6:4;

[0115] (3) Epoxy resin (mass is 20% of the total mass of material C and material D)

[0116] (4) Pore-forming agent ethyl naphthalene (mass is 1...

example 4

[0122] Step 1: Prepare the base;

[0123] Prepare material A with a fineness of 240 mesh, material B with a fineness of 90 mesh, and silica sol; material A is at least one of silicon carbide powder, ceramic fiber and ceramic particles; material B is silicon carbide powder;

[0124] The mass ratio of material A and material B is 7:3;

[0125] The quality of silica sol is 15% of the total mass of material A and material B;

[0126] Coat the release agent on the first preform mold, put the printed circuit board (0.5-1.5mm thick copper foil thickness) into the first preform mold; use silica sol to mix material A and material B evenly as Die-casting raw materials for die-casting, demoulding after die-casting; pressure range 150-300 N; drying after demoulding, that is, the preparation of the base is completed;

[0127] Step 2: Grinding and packaging:

[0128]There is a packaging groove at the front end of the base (you can also not set the packaging groove, just solder the LED ch...

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Abstract

The invention discloses an integrated-type LED (light-emitting diode) light source heat radiating device and a preparation method thereof. The integrated-type heat radiating device adopts a combined structure of a base and a heat radiating body, wherein the combined structure is a nested structure or a dual-layer overlapped structure; the nested structure is that the base is located at an inner ring, and the heat radiating body is located at an outer ring; the dual-layer overlapped structure is that the heat radiating body is arranged on the back surface of the periphery of the base; the base is prepared from two powders with different particle sizes and silicon dioxide sol; the heat radiating body is prepared from two powders with different particle sizes, epoxy resin and a pore-forming agent, and is internally provided with heat radiating micro holes formed by the pore-forming agent; and the powder is at least one of silicon carbide, ceramic fibers and ceramic particles. The integrated-type LED light source heat radiating device adopts the integrated heat radiating structure, and is high in heat radiating efficiency, simple in structure, small in volume, light in weight and low in cost, and the preparation method is easy to implement.

Description

technical field [0001] The invention relates to an integrated LED light source cooling device and a preparation method thereof. Background technique [0002] In recent years, with the development of LED lamps, major global lighting manufacturers have successively joined in the development and promotion of LED lamps and markets. The United States, Japan, Europe and Taiwan Province of China have all launched semiconductor lighting plans. Development and promotion of external LED lamps. However, there is a big problem in the actual application of LEDs, that is, the problem of heat dissipation. The problem of heat dissipation has always been a bottleneck in LED applications and has not been solved well. It is difficult to meet LED standards and device standards, which is also a worldwide problem. The application of high-power LED lamps in the lighting field has just begun. There are many indoor and outdoor products, but there are also many problems. In the final analysis, there...

Claims

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Application Information

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IPC IPC(8): F21V29/00F21Y101/02F21V29/503F21V29/85F21Y105/16F21Y115/10
Inventor 王宁军
Owner 王宁军
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