Composite heat insulation material using phenolic resin and perlite as major raw materials and preparation method of composite heat insulation material

Abstract

The invention discloses a composite thermal insulation material with phenolic resin and expanded perlite as main raw materials and a preparation method thereof. The phenolic resin, expanded perlite and an appropriate amount of additives are evenly mixed, molded, and hot-pressed with different compression ratios. forming. The phenolic resin is boron-modified thermoplastic solid phenolic resin, the dosage is 20~70Wt%; the expanded perlite is bulk material with a bulk density of 80~150kg / m3, and the dosage is 30~80Wt%; the compression ratio is 1.25~2.5; 200~240℃, holding time 1.5~2.5h. The apparent density of the sample is 280~350Kg / m3, the thermal conductivity is 0.037~0.068W / (m﹐K), the compressive strength is 1.1~1.8MPa, the flexural strength is 0.8~1.5MPa, and the combustion performance is B1. The composite thermal insulation material of the invention has the advantages of low thermal conductivity of the organic thermal insulation material and high strength and non-combustibility of the inorganic thermal insulation material.

Description

technical field [0001] The invention relates to the field of thermal insulation materials and their preparation, in particular to a composite thermal insulation material with phenolic resin and perlite as main raw materials and a preparation method thereof Background technique [0002] Existing thermal insulation materials mainly include inorganic thermal insulation materials and organic thermal insulation materials. Inorganic thermal insulation materials mainly include perlite, vermiculite, calcium silicate, foamed cement, mineral wool, glass wool, etc. For example, the patent application with publication number CN102336561A, compared with organic thermal insulation materials, the thermal conductivity of inorganic thermal insulation materials is relatively large , the thermal insulation effect is slightly poor, but fire retardant, small deformation coefficient, anti-aging, stable performance, long service life; [0003] Organic thermal insulation material then mainly conta...

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Problems solved by technology

[0003] Organic thermal insulation material then mainly contains foamed polystyrene board, extruded polystyrene board, spray polyurethane, phenolic resin foam board etc., as the patent application that publication number is CN101565541; The thermal conductivity of organic thermal insulation material is little, and thermal insulation effect is good, but, They are easy to burn and are not suitable for places with strict fire hazard requirements. Once a fire occurs, the spread of the flame will be accelerated, and a large amount of toxic gas will be discharged.

In addition, organic thermal insulation materials are not resistant to aging, have a large deformation coefficient, poor stability, and poor safety.

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