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Sn-Cu-based environment-friendly solder containing Zr and preparation method thereof

A sn-cu, environmentally friendly technology, applied in the field of tin solder alloys, can solve problems such as poor mechanical properties, achieve the effect of improving mechanical properties and inhibiting growth

Active Publication Date: 2015-05-13
HANGZHOU BRANCH ZHEJIANG GEELY AUTOMOBILE RES INST +2
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The object of the present invention is to provide a kind of Sn-Cu based environment-friendly solder that adds Zr with excellent mechanical properties after aging of the solder joint in order to solve the defect that the lead-free solder made by the existing method has poor mechanical properties after aging

Method used

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  • Sn-Cu-based environment-friendly solder containing Zr and preparation method thereof

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Experimental program
Comparison scheme
Effect test

Embodiment 1

[0019] A preparation method of a Sn-Cu-based environment-friendly solder that adds Zr, the steps of the preparation method are as follows:

[0020] a): Tin with a purity of 99.95%, copper with a purity of 99.95%, and zinc with a purity of 99.95% are heated to 1300°C in a vacuum melting furnace under the protection of argon to melt, while stirring, and then cooled to room temperature with the furnace , to obtain tin-copper-zinc alloy;

[0021] b): Heating the tin-copper-zinc alloy obtained in step a) to 500°C in an argon-protected vacuum furnace, then adding zirconium with a purity of 99.95%, keeping it for 3 hours and then cooling to room temperature with the furnace to obtain Zr-added Sn - Cu-based environmentally friendly solder.

[0022] The content of each component is shown in Table 1.

Embodiment 2

[0024] A preparation method of a Sn-Cu-based environment-friendly solder that adds Zr, the steps of the preparation method are as follows:

[0025] a): Tin with a purity of 99.95%, copper with a purity of 99.95%, and zinc with a purity of 99.95% are heated to 1350°C in a vacuum melting furnace under the protection of argon to melt, while stirring, and then cooled to room temperature with the furnace , to obtain tin-copper-zinc alloy;

[0026] b): Heating the tin-copper-zinc alloy obtained in step a) to 550°C in an argon-protected vacuum furnace, then adding zirconium with a purity of 99.95%, keeping it for 4 hours and then cooling to room temperature with the furnace to obtain Zr-added Sn - Cu-based environmentally friendly solder.

[0027] The content of each component is shown in Table 1.

Embodiment 3

[0029] A preparation method of a Sn-Cu-based environment-friendly solder that adds Zr, the steps of the preparation method are as follows:

[0030] a): Tin with a purity of 99.95%, copper with a purity of 99.95%, and zinc with a purity of 99.95% are heated to 1400°C in a vacuum melting furnace under the protection of argon to melt, while stirring, and then cooled to room temperature with the furnace , to obtain tin-copper-zinc alloy;

[0031] b): Heating the tin-copper-zinc alloy obtained in step a) to 650°C in an argon-protected vacuum furnace, then zirconium with a purity of 99.95%, keeping it for 5 hours and then cooling to room temperature with the furnace to obtain Zr-added Sn - Cu-based environmentally friendly solder.

[0032] The content of each component is shown in Table 1.

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Abstract

The invention relates to a Sn-Cu-based environment-friendly solder containing Zr and a preparation method thereof. The solder consists of 0.1%-3% copper, 0.1%-2% zinc, 0.3%-3% zirconium, and the balance of stannum. Trace element Zr is added to the solder, so that a new dispersed phase is produced in the solder; and in the aging process of a soldered joint, the dispersed phase is deposited in interfacial intermetallic components, so that the grain boundaries of the interfacial intermetallic components are increased, and the growing of intermetallic component particles is suppressed in the aging process of the soldered joint, thus improving the mechanical property of the soldered joint.

Description

technical field [0001] The invention relates to the field of tin solder alloys, in particular to a Zr-added Sn-Cu-based environmentally friendly solder and a preparation method thereof. Background technique [0002] The traditional automotive central controller circuit connection solder is leaded solder (Sn-Pb is more commonly used). Leaded solder is harmful to the environment, and its impact on human health cannot be ignored. With the formulation and implementation of environmental protection regulations in the automotive industry, the application of new lead-free solders in automotive electronic components will become more and more extensive. Sn-Cu-based (such as Sn-Cu-Zn) solder is a low-cost solder to replace traditional Sn-Pb solder, but its mechanical properties of the brazed joint are poor after aging. [0003] Chinese Patent Publication No. CN 1799757 A, published on July 12, 2006, named as an invention patent of an environment-friendly lead-free solder and its prep...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B23K35/26C22C13/00C22C1/02
Inventor 高艳俊孙新阁回金楷吴成明赵福全
Owner HANGZHOU BRANCH ZHEJIANG GEELY AUTOMOBILE RES INST
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