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Manufacturing method of patch type LED (Light-Emitting Diode) module

A technology of LED module and manufacturing method, applied in printed circuit manufacturing, final product manufacturing, sustainable manufacturing/processing, etc., can solve the problem of multi-material cost of materials, low reliability of a single LED light source, processing technology and process time Long and other problems, to achieve the effect of low chip failure rate, saving packaging materials and packaging process time, and short process time

Inactive Publication Date: 2015-02-04
XIAMEN G WATT LIGHTING TECHNOLOGY INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] The main purpose of the present invention is to provide a method for manufacturing a chip-type LED module, which solves the problem of excessive material cost due to the large-scale production of LED modules; The time cost problem of too long process time during production; another purpose is to solve the problem of low reliability of a single LED light source on the finished LED module and hidden dangers of processing technology:

Method used

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  • Manufacturing method of patch type LED (Light-Emitting Diode) module
  • Manufacturing method of patch type LED (Light-Emitting Diode) module
  • Manufacturing method of patch type LED (Light-Emitting Diode) module

Examples

Experimental program
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Effect test

Embodiment 1

[0047] figure 1 As shown, in the LED chip 10 with a flip-chip structure used in the present invention, its main body 10 is a semiconductor material part, and the lower part is the positive and negative metal electrodes forming ohmic contact with the main body 10. The plane below the main body 10 Inside, the distance G1 between the metal electrodes 13 is 80 μm; for this type of flip-chip LED chip, the light-emitting surface 12 and the metal electrodes 13 of the conductive part are located on both sides of the main body 10 without interfering with each other, and its luminous efficiency is high.

[0048] Such as figure 2 and image 3 As shown, the LED chips 10 are put into the braid 20 one by one, each LED chip occupies an accommodating space 23 and is independent of each other; and the metal electrode 13 of the LED chip 10 is located at the bottom of the accommodating space 23; The opening of the space. When the LED chips 13 are placed into the accommodating space, there wi...

Embodiment 2

[0060] Such as Figure 9 , Figure 10 , two state diagrams of Embodiment 2 of the present invention:

[0061] Compared with Embodiment 1, this embodiment is different in that in the mounting step, there is an auxiliary colloid 45 between the pads 41 of the substrate 40. The role of the auxiliary colloid 45 is that when the volume of the LED chip 10 is large, It is difficult to temporarily fix the LED chip 10 to the substrate by the tension of the solder paste 42. The auxiliary colloid 45 is used as a temporary component to make the LED chip 10 and the pad 41 relatively accurate and stable, and there will be no posture deviation even after passing through the reflow oven. .

[0062] Another difference is that after the fixing step of the LED chip 10 is completed, the light-emitting surface of the LED chip 10 is covered with the fluorescent film 50. This fluorescent film is in the form of an integral thin film and is formed separately, so it can be directly applied with approp...

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Abstract

Disclosed is a method of fabricating a surface-mounted LED module, comprising the following steps: preparing, providing an LED chip (10) of a flip-chip structure, one side of the LED chip (10) having metal electrodes (13), and the surface pitch of the metal electrodes (13) being not smaller than 80 mum; arranging, placing a plurality of LEpsilonD chips (10) in a strip, the metal electrodes (13) of the LED chip (10) being located at the bottom of a strip receiving space (23), and the light emitting surface (12) of the LED chip (10) being located at the opening of the receiving space (23); adhering, sucking the LED chip (10) from the strip using a vacuum suction cup (30), and placing the LED chip (10) on a solder pad of a substrate, so that the metal electrode (13) is opposite the solder pad, and the light emitting surface (12) of the LED chip (10) faces upwards; and fixing, correspondingly fixing and joining the solder pad and the metal electrode (13). By directly adopting a strip carrying manner for a flip-chip LED chip, the encapsulation of a single LED light source is avoided; the encapsulation material, encapsulation process time, and production line for a single LED light source are saved.

Description

technical field [0001] The invention relates to a production method for manufacturing a patch type LED module. Background technique [0002] With the development of lighting LED technology, compared with traditional incandescent lamps and halogen lamps, LEDs have obvious advantages in energy saving, reliability, and longevity, and can gradually achieve the lighting performance of fluorescent lamps, such as light efficiency and display. Color index and lifespan. Therefore, globally, the development of lighting LED is in the ascendant, and the annual output of LED light source is gradually increasing. [0003] Compared with traditional light sources, LED light sources have some obvious characteristics. Usually, in terms of volume, LED light sources are based on a single chip (chip), with electrodes, phosphors, packaging structures, etc., with smaller volume and With less luminous flux, if it is necessary to form a suitable lighting fixture, it is inevitable to use multiple L...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L33/48H01L25/075
CPCH05K2203/1366H01L33/486H05K3/3431H05K2201/10106H05K3/281H05K3/3436H05K2203/048H05K2203/082H01L33/62H01L2933/0066H01L2224/16Y02P70/50
Inventor 廖泳吕宗宜
Owner XIAMEN G WATT LIGHTING TECHNOLOGY INC
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