Antifriction and toughening metal/ceramic bionic multilayer-film artificial joint
An artificial joint and multi-layer film technology, applied in metal material coating process, coating, prosthesis and other directions, can solve the problems of low bonding strength between coating and metal matrix, poor biological stability, coating melting and falling off, etc. Improve biocompatibility and resistance to body fluids, improve wettability, and reduce aseptic loosening
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Embodiment 1
[0021] 316L stainless steel alloy is selected as the base material, and the preparation process is as follows: Step 1: process into a suitable artificial joint shape, mechanically grind and polish the ball head part of the joint; Step 2: in ultra-high vacuum magnetron sputtering equipment The growth of multilayer film is carried out in the medium, and the cathode adopts high-purity metal titanium and hot-pressed sintered ceramic TiB 2 As the target, first grow a titanium layer, the process parameters are as follows: sputtering power 50W, working pressure 0.1Pa, substrate heating temperature 250°C; then grow TiB 2 ceramic layer, and ensure TiB 2 It is the outermost layer, and the process parameters are as follows: sputtering power 120W, working pressure 0.4Pa, substrate heating temperature 450°C, substrate negative bias voltage 60V; the total thickness of the multilayer film is 30μm, including 20 cycles in total. The thickness of the titanium layer is 1 μm, TiB 2 The thicknes...
Embodiment 2
[0023] Ni50Ti50 shape memory alloy is selected as the base material, and the preparation process is as follows: the first step: process into a suitable artificial joint shape, mechanically grind and polish the joint ball part; the second step: magnetron sputtering in ultra-high vacuum Multi-layer film growth is carried out in the equipment, and the cathode adopts high-purity metal titanium and hot-pressed sintered ceramic TiB 2 As the target material, first grow a titanium layer, the process parameters are as follows: sputtering power 20W, working pressure 0.15Pa, substrate heating temperature 250°C; then grow TiB 2 ceramic layer, and ensure TiB 2 It is the outermost layer, and the process parameters are as follows: sputtering power 300W, working pressure 0.7Pa, substrate heating temperature 400°C, substrate negative bias voltage 60V; the total thickness of the multilayer film is 5μm, including 10 cycles in total. The thickness of the titanium layer is 100nm, TiB 2 The thick...
Embodiment 3
[0026] Ti6Al4V titanium alloy is selected as the base material, and the preparation process is as follows: the first step: process into a suitable artificial joint shape, mechanically grind and polish the joint ball part; the second step: in the ultra-high vacuum magnetron sputtering equipment The growth of multilayer film is carried out in the medium, and the cathode adopts high-purity metal titanium and hot-pressed sintered ceramic TiB 2 As the target material, first grow a titanium layer, the process parameters are as follows: sputtering power 10W, working pressure 0.2Pa, substrate heating temperature 300°C; then grow TiB 2 ceramic layer, and ensure TiB 2 It is the outermost layer, and the process parameters are as follows: sputtering power 400W, working pressure 0.5Pa, substrate heating temperature 400°C, substrate negative bias 60V; the total thickness of the multilayer film is about 1.65μm, including 15 cycles in total. The thickness of the titanium layer in the period ...
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