Backboard fabricating method

Abstract

The invention discloses a backboard fabricating method, comprising the following steps of: providing a backboard casting piece; forging the backboard casting piece at a temperature of 800-1000 DEG C so as to form a backboard blank; and processing the backboard blank so as to form a backboard. According to the backboard fabricating method disclosed by the invention, the backboard with a finer and more uniform inner organization structure can be obtained, so that the backboard is prevented from distortion and deformation. On one hand, a deviation between each part of a target and a silicon wafer substrate is reduced, and the quality of a coating film is improved; and on the other hand, the service life of a sputtering target assembly is prolonged.

Description

technical field [0001] The invention relates to the field of semiconductors, in particular to a manufacturing method of a backplane. Background technique [0002] In the modern large-scale integrated circuit manufacturing process, magnetron sputtering has become the most excellent substrate coating process due to its advantages such as high sputtering rate, low substrate temperature rise, and good film-substrate bonding force. [0003] In the magnetron sputtering coating process, the target assembly is composed of a target meeting the sputtering performance and a back plate combined with the target and having a certain strength. The back plate not only plays a supporting role when the target assembly is assembled to the sputtering base station, but also has the effect of conducting heat, and is used for heat dissipation of the target in the magnetron sputtering process. In the process of magnetron sputtering coating, the working environment of target components is relativel...

AI Technical Summary

Problems solved by technology

However, the method for uniformly refining the grains of the backplane by the forging process is not yet mature.

Taking the brass backplane as an example, the brass backplane contains a certain amount of zinc element. Zinc is a body-centered cubic metal, and the backplane is prone to temperature brittleness during forging; at the same time, because the brass backplane also contains There are trace amounts of lead and bismuth harmful impurities and the back plate metal copper to form a low-melting point eutectic film distributed on the grain boundary, which is prone to intergranular cracking during forging

[0005] Therefore, it is necessary to propose a new method for making a backplane to overcome the defects that the grains of the backplane in the prior art are not uniform and not refined enough

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