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Halogen-free flame-retardant epoxy resin electronic pouring sealant

A technology of epoxy resin and potting glue, applied in the field of potting glue, can solve the problems of corrosiveness, toxicity, ozone layer destruction, etc., and achieve the effect of convenient operation and strong flame retardant ability

Inactive Publication Date: 2012-06-27
YANTAI DARBOND TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, a large amount of hydrogen halide released by halogenated flame retardants is not only poisonous but also corrosive. At the same time, it will produce carcinogens such as dioxin, and also produce substances that destroy the ozone layer. Therefore, halogens that endanger human health and damage the environment Flame retardants have been gradually banned by countries all over the world in recent years

Method used

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  • Halogen-free flame-retardant epoxy resin electronic pouring sealant
  • Halogen-free flame-retardant epoxy resin electronic pouring sealant

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0027] Bisphenol A type epoxy resin 828EL (from Hexion) 15 parts, bisphenol F type epoxy resin 830LVP (from Dainippon Ink) 15 parts, aluminum hydroxide 65 parts, CARDURA E-10 2 parts, Doher 601R2 1 part, 1 part of carboxyl-terminated liquid nitrile rubber, 0.1 part of KH560, 0.1 part of black paste (Degussa T4 carbon black and 828EL are mixed in proportion, and the specific weight ratio is 2:8), and stirred evenly at room temperature to obtain A Components: Polyetheramine D-400 and isophorone diamine are mixed in a weight ratio of 8:2 to form an amine curing agent. Mix component A and amine curing agent in a weight ratio of 100:13, stir evenly under vacuum at room temperature, pour the mixture into a mold and cure at 80°C for 4 hours, and measure the flame retardant grade of the cured product.

Embodiment 2

[0029] Bisphenol A type epoxy resin 828EL (produced by Hexion) 20 parts, bisphenol F type epoxy resin EP-4901E (produced by Japan Adidas) 15 parts, aluminum hydroxide 53 parts, CARDURA E-10 4.5 parts , 4.5 parts of Doher601R, 2.5 parts of carboxyl-terminated liquid nitrile rubber, 0.25 parts of KH560, 0.25 parts of black paste (Degussa T4 carbon black and 828EL are mixed in proportion, and the specific weight ratio is 2: 8), stir evenly at room temperature, Obtained component A; isophorone diamine constitutes an amine curing agent. Mix component A and amine curing agent at a weight ratio of 100:8.5, stir evenly under vacuum at room temperature, pour the mixture into a mold and cure at 80°C for 4 hours, and measure the flame retardancy of the cured product.

Embodiment 3

[0031] Bisphenol A type epoxy resin DER 331P (from Dow) 20 parts, bisphenol F type epoxy resin 830LVP (from Dainippon Ink) 20 parts, aluminum hydroxide 40 parts, CARDURA E-10 7 parts, Doher 7 parts of 601R, 5 parts of carboxyl-terminated liquid nitrile rubber, 0.5 parts of KH560, 0.5 parts of black paste (Degussa T4 carbon black and 828EL are mixed in proportion, the specific weight ratio is 2:8), and stirred evenly at room temperature to obtain A component; triethylenetetramine composition amine curing agent. Mix component A and amine curing agent in a weight ratio of 100:4, stir evenly under vacuum at room temperature, pour the mixture into a mold and cure at 25°C for 48 hours, and measure the flame retardant grade of the cured product.

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Abstract

The invention relates to a halogen-free flame-retardant epoxy resin electronic pouring sealant which is formed by mixing an A component and an amine curing agent according to the weight ratio of 100:4-13, wherein the A component comprises the following raw materials in parts by weight: 30-40 parts of halogen-free epoxy resin, 40-65 parts of flame-retardant fillers, 2-7 parts of halogen-free active diluting agents, 2-7 parts of halogen-free liquid flame retardants, 1-5 parts of toughening agents, 0.1-0.5 part of coupling agent and 0.1-0.5 part of pigment. The invention has the beneficial effects that the pouring sealant is free from halogen and satisfies the halogen-free requirements; the flame retardance is independent of a halogen-added flame retardant, so that the environment friendliness is achieved; the fame retardant ability is strong and can achieve the grade UL94-V0; and with the adoption of a double-component system, not only can the room-temperature curing be achieved, but also the thermal curing can be achieved, so that the operation is covneneint.

Description

technical field [0001] The invention relates to a potting glue, in particular to a halogen-free flame-retardant epoxy resin electronic potting glue, which belongs to the technical field of potting glue. Background technique [0002] Epoxy resin electronic potting glue is widely used in electronic components because of its good adhesion, temperature resistance, electrical insulation, good mechanical properties, excellent molding process and low cost. The potting and encapsulation of devices is one of the most important electronic packaging chemical materials at present. However, like most organic polymer materials, epoxy cured products are relatively flammable and easy to cause fires, which cause huge casualties and property losses all over the world every year. Therefore, people have carried out flame-retardant treatment and added flame retardants to epoxy potting adhesives used in the electrical and electronic fields. [0003] In recent decades, halogenated flame retardan...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J163/02C09J11/04C09J11/06C09J11/08C09K3/10
Inventor 林荣杏王建斌陈田安
Owner YANTAI DARBOND TECH
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