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Nitrogen-containing resin, adhesive for environmentally friendly composite base copper-clad laminates and laminates

A technology of copper-clad laminates and nitrogen-containing resins, applied in epoxy resin adhesives, synthetic resin layered products, lamination, etc., can solve the problems of expensive adhesive materials and achieve good application prospects and market benefits , reduce material costs, and the effect of large market application value

Active Publication Date: 2021-09-28
西安西电电工材料有限责任公司 +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0009] In order to solve the above-mentioned technical problems, the object of the present invention is to provide a nitrogen-containing resin, which can be used to prepare adhesives, and use the adhesive to prepare composite-based flame-retardant copper-clad laminates, which can solve the problem of environmental protection. The cost of adhesive materials for composite-based flame-retardant copper-clad laminates is relatively expensive

Method used

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  • Nitrogen-containing resin, adhesive for environmentally friendly composite base copper-clad laminates and laminates
  • Nitrogen-containing resin, adhesive for environmentally friendly composite base copper-clad laminates and laminates

Examples

Experimental program
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Effect test

Embodiment 1

[0048] The present embodiment provides a nitrogen-containing resin, which is prepared through the following steps:

[0049] Add 26% melamine, 51% formaldehyde, 4.89% modified phenol and 0.045% catalyst to the reaction kettle in sequence, mix and stir for 5 minutes to obtain the mixed material, and measure the pH value of the mixed material;

[0050] When the pH value of the mixed material reaches 8 ≤ the pH value of the mixed material ≤ 9, in the reflux state, the temperature of the mixed material is raised to 95°C within 40 minutes, and the temperature is kept for 60 minutes;

[0051] Take a sample to measure the water number, the water number reaches 9mL, add 0.065% polymerization inhibitor to the mixed material, after stirring for 5 minutes, vacuumize to above 0.07MPa, after the temperature of the mixed material rises to 2°C, remove the vacuum, add 18% by mass The solvent methanol, obtains nitrogen-containing resin;

[0052] Wherein, modified phenol is cresol;

[0053] Th...

Embodiment 2

[0058] This example provides an adhesive for a composite-based flame-retardant copper-clad laminate, which is prepared by the following steps:

[0059] Add 12% of toluene, 6% of methanol, 3% of titanium dioxide, 5% of magnesium hydroxide, and 4% of polyphosphate in the reaction kettle, and mix and stir for about 30 minutes;

[0060] Then add 54% of nitrogen-containing resin, 12% of phosphorus-based epoxy resin, and 4% of non-halogen environmental protection epoxy resin in sequence, and stir and mix for about 60 minutes to obtain an adhesive;

[0061] Wherein, nitrogen-containing resin is the nitrogen-containing resin of embodiment 1;

[0062] Polyphosphate is T-903 polyphosphate flame retardant;

[0063] Phosphorous epoxy resin is GEBR577A70 high phosphorus epoxy resin;

[0064] Non-halogen environmental protection epoxy resin is GEBR580K70 resin;

[0065] Titanium dioxide is rutile titanium dioxide.

Embodiment 3

[0067] This embodiment provides a composite-based flame-retardant copper-clad laminate, which is prepared through the following steps:

[0068] Make adhesive content that is 55%, the sizing paper that soluble resin content is 80%, the sizing agent content is 57%, the sizing cloth that soluble resin content is 93%; Wherein, sizing agent is the glue of embodiment 2 Adhesive;

[0069] Compound the glued paper, glued cloth and copper foil, and press it for 90 minutes under the conditions of 16MPa and 163°C to obtain a composite base flame-retardant copper-clad laminate, which is a copper-clad ring for printed circuits of CEPCP-22F Oxygen paper laminate.

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Abstract

The invention relates to a nitrogen-containing resin, an adhesive for an environment-friendly composite base copper-clad laminate and a laminate. The preparation method of the nitrogen-containing resin comprises the following steps: mixing and stirring melamine, formaldehyde, modified phenol and a catalyst to obtain a mixed material; when the pH value of the mixed material reaches 8≤pH value≤9, the mixed material is Heat up, keep warm and react; take a sample to measure the water number, when the water number reaches 8-12mL, add a polymerization inhibitor to the mixed material, stir, and vacuumize, when the temperature of the mixed material rises, remove the vacuum, add methanol, and obtain a nitrogen-containing resin . The invention also provides an adhesive prepared by using the above-mentioned nitrogen-containing resin and an environment-friendly composite base copper-clad laminate prepared by using the adhesive. The use of the above-mentioned adhesive can meet the performance requirements of the composite-based flame-retardant copper-clad laminate and has excellent flame-retardant performance, especially meets the European Union's halogen-free requirements, and can greatly reduce the material cost of such products.

Description

technical field [0001] The invention relates to a nitrogen-containing resin, an adhesive for an environment-friendly composite base copper-clad laminate and a laminate, and belongs to the technical field of flame-retardant copper-clad laminate preparation. Background technique [0002] In the copper clad laminate industry, more than 80% are flame retardant copper clad laminates. These flame retardant copper clad laminates mainly use brominated epoxy resin or add brominated flame retardants to achieve flame retardant effect. [0003] Due to the excellent flame retardant effect of the bromine-antimony synergistic flame retardant system, many companies have been using the bromine-antimony synergistic flame retardant system to meet the flame retardancy requirements of the composite base flame retardant copper clad laminate, that is, in the adhesive formulation Use brominated flame retardants (such as pentabromodiphenyl ether, tetrabromobisphenol A, high-brominated epoxy, low-bro...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C08G14/10C09J161/34C09J163/00B32B37/10B32B37/12B32B38/08B32B38/16B32B15/20B32B15/14B32B17/04B32B17/06B32B27/04B32B7/12B32B29/06B32B29/02B32B15/18B32B33/00
CPCB32B5/02B32B7/12B32B15/14B32B15/18B32B15/20B32B17/061B32B17/065B32B29/02B32B29/06B32B33/00B32B37/10B32B37/12B32B38/08B32B38/16B32B2260/021B32B2260/028B32B2260/046B32B2262/101B32B2307/3065C08G14/10C08K2003/2224C08K2003/2241C08K2003/321C08L2201/02C08L2203/20C08L2205/025C08L2205/03C09J161/34C08L63/00C08K3/22C08K3/32
Inventor 杜超云王战强许可
Owner 西安西电电工材料有限责任公司
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