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A kind of manufacturing method of halogen-free tg130 copper clad laminate

A production method and technology of copper clad laminates are applied in the field of copper clad laminates to achieve the effects of small smoke generation and excellent heat resistance

Active Publication Date: 2016-06-15
金宝电子(铜陵)有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The purpose of the present invention is to solve the problems of heat resistance and combustibility of copper clad laminates

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0021] A method for manufacturing a halogen-free Tg130 copper clad laminate, the steps are as follows:

[0022] a. Add 900 parts of phosphorus-based flame retardant halogen-free epoxy resin A, 12 parts of tetraphenol-based ethylene epoxy resin, 0.6 parts of accelerator solution and 65 parts of bisphenol A novolac epoxy resin into the high-shear kettle , turn on the stirring paddle of the high-shear kettle, adjust the dispersion motor to 40HZ, the emulsification motor to 40HZ, and stir for 0.5 hours;

[0023] b. Then adjust the dispersion motor to 35HZ, the emulsification motor to 35HZ, stir for 2 hours, and take samples to test the glue index;

[0024] After the glue solution in steps c and b is qualified, add 2.8 parts of coupling agent, 45 parts of aluminum hydroxide, 175 parts of soft silicon, 60 parts of talcum powder, 21 parts of curing agent and 400 parts of solvent, and start the high-shear kettle. Adjust the dispersion motor to 40HZ, the emulsification motor to 40HZ, ...

Embodiment 2

[0031] A method for manufacturing a halogen-free Tg130 copper clad laminate, the steps are as follows:

[0032] a. Add 1000 parts of phosphorus-based flame retardant halogen-free epoxy resin A, 14 parts of tetraphenol-based ethylene epoxy resin, 0.7 parts of accelerator solution and 70 parts of bisphenol A novolac epoxy resin into the high-shear kettle , turn on the stirring paddle of the high-shear kettle, adjust the dispersion motor to 40HZ, the emulsification motor to 40HZ, and stir for 0.5 hours;

[0033] b. Then adjust the dispersion motor to 35HZ, the emulsification motor to 35HZ, stir for 2 hours, and take samples to test the glue index;

[0034] After the glue solution in steps c and b is qualified, add 3 parts of coupling agent, 50 parts of aluminum hydroxide, 200 parts of soft silicon, 70 parts of talcum powder, 24 parts of curing agent and 416 parts of solvent, and start the high-shear kettle. Adjust the dispersion motor to 40HZ, the emulsification motor to 40HZ, a...

Embodiment 3

[0041] A method for manufacturing a halogen-free Tg130 copper clad laminate, the steps are as follows:

[0042] a. Add 1100 parts of phosphorus-based flame retardant halogen-free epoxy resin A, 14.5 parts of tetraphenol-based ethylene epoxy resin, 0.78 parts of accelerator solution and 74 parts of bisphenol A novolac epoxy resin to high Shear the kettle, turn on the high-shear kettle stirring paddle, adjust the dispersion motor to 40HZ, the emulsification motor to 40HZ, and stir for 0.5 hours;

[0043] b. Then adjust the dispersion motor to 35HZ, the emulsification motor to 35HZ, stir for 2 hours, and take samples to test the glue index;

[0044] After the glue solution in steps c and b is qualified, add 4.6 parts of coupling agent, 55 parts of aluminum hydroxide, 210 parts of soft silicon, 78 parts of talcum powder, 25 parts of curing agent and 420 parts of solvent, and start the high-shear kettle. Adjust the dispersion motor to 40HZ, the emulsification motor to 40HZ, and st...

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PUM

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Abstract

The invention discloses a method for making a halogen-free Tg130 copper-clad laminate, which includes configuring glue, coating the glue on glass cloth, drying, stacking, and pressing. The halogen-free Tg130 plate produced by the invention has a The total content is less than 900ppm. Satisfy the European Union and other halogen-free requirements; plate performance: glass transition temperature Tg135-145, higher than the general Tg130 series plate in the market, excellent heat resistance, reaching 80S-110S (tested according to IPC-TM-650-2.4.8 standard) Compared with the conventional halogen-free Tg130 in the industry, the heat resistance is improved by about 20S, the flammability is V-0 level (tested according to the US UL-94 standard), and the amount of smoke is small when burning.

Description

technical field [0001] The invention relates to the technical field of copper clad laminates used in printed circuit boards, in particular to a method for manufacturing a halogen-free Tg130 copper clad laminate. Background technique [0002] At present, according to the latest EU halogen-free requirements for electronic products, IEC, JPCA, and IPC jointly agree on various industry standards. The acceptable halogen content is: bromine is 900ppm, chlorine is 900ppm, and the total halogen content is at most 1500ppm. The main resin of ordinary FR-4 copper clad laminate is a brominated epoxy resin based on tetrabromobisphenol A, in which tetrabromobisphenol A is used as a flame retardant for glass fiber reinforced copper clad laminate, so that the copper clad laminate has good flame retardancy , but the halogen content of the copper clad laminate mainly based on brominated epoxy resin is much greater than 100000ppm. At present, the halogen content of halogen-free resins on the ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B32B37/06B32B15/092B32B15/20B32B27/04B32B27/18C08L63/00C08L63/04C08K3/22C08K3/34C08K3/36
Inventor 凌云钱笑雄
Owner 金宝电子(铜陵)有限公司
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