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Halogen-free resin composition for copper-clad laminate and preparation method thereof

A technology of resin composition and copper clad laminate, applied in the field of printed circuit boards, can solve the problems of low transition temperature and poor processing performance, achieve high glass transition temperature, increase heat resistance and improve heat resistance.

Inactive Publication Date: 2019-09-27
SHANDONG JINBAO ELECTRONICS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] Aiming at the problems of low glass transition temperature and poor processability of existing halogen-free copper-clad laminates, the present invention provides a halogen-free resin composition for copper-clad laminates and a preparation method thereof

Method used

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  • Halogen-free resin composition for copper-clad laminate and preparation method thereof

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Effect test

Embodiment 1

[0011] A halogen-free resin composition for copper clad laminates, comprising the following components in parts by weight: 650 parts of DOPO with an epoxy equivalent of 180g / eq, 60 parts of o-cresol novolac epoxy resin with an epoxy equivalent of 230g / eq , 25 parts of curing agent solution, 1 part of accelerator solution, 300 parts of silicon micropowder, 3 parts of KH5503 and 750 parts of acetone.

[0012] Wherein, the curing agent solution is prepared by mixing and dissolving dicyandiamide and DMF at a weight ratio of 1:10; the accelerator solution is prepared by mixing and dissolving 2-methylimidazolium acetone at a weight ratio of 1:10.

Embodiment 2

[0014] A halogen-free resin composition for copper clad laminates, comprising the following components in parts by weight: 720 parts of ODOPB with an epoxy equivalent of 200g / eq, 55 parts of BPA novolac epoxy resin with an epoxy equivalent of 230g / eq, 22 parts of curing agent solution, 1.1 parts of accelerator solution, 320 parts of talcum powder, 3.5 parts of KH560 and 720 parts of DMF.

[0015] Wherein, the curing agent solution is prepared by mixing and dissolving dicyandiamide and methanol at a weight ratio of 1:10; the accelerator solution is 2-ethyl, 4-methylimidazole and butanone at a weight ratio of 1:10 Prepared by mixing and dissolving.

Embodiment 3

[0017] A halogen-free resin composition for copper clad laminates, comprising the following components in parts by weight: 800 parts of DOPO with an epoxy equivalent of 220g / eq, 50 parts of DCPD phenol novolac epoxy resin with an epoxy equivalent of 290g / eq , 20 parts of curing agent solution, 1.5 parts of accelerator solution, 350 parts of aluminum hydroxide, 4 parts of KH570 and 700 parts of butanone.

[0018] Wherein, the curing agent solution is prepared by mixing and dissolving dicyandiamide and toluene at a weight ratio of 1:10; the accelerator solution is prepared by mixing and dissolving 2-phenylimidazole and acetone at a weight ratio of 1:10.

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Abstract

The invention discloses a halogen-free resin composition for a copper-clad laminate. The halogen-free resin composition is prepared from the following components in parts by weight: 650-800 parts of polyfunctional-group-based phosphorus-series epoxy resin, 50-60 parts of phenolic novolac epoxy resin, 20-25 parts of a curing agent solution, 1-1.5 parts of an accelerator solution, 300-350 parts of an inorganic filler, 3-4 parts of a silane coupling agent, and 700-750 parts of solvent. The composition disclosed by the invention has the beneficial effects that the halogen-free resin composition for the copper-clad laminate adopts the polyfunctional-group-based phosphorus-series epoxy resin as main resin; the phenolic novolac epoxy resin is used to increase the heat resistance of a sheet material and improve the glass transition temperature of the sheet material; aluminum hydroxide is used to improve the flame retardant properties of the sheet material; talcum powder is used to further improve the heat resistance of the sheet material; through performing surface treatment and particle size control on the aluminum hydroxide and talcum powder filler, and using a high-shearing kettle disperser and an emulsification motor to stir various raw materials for mixing, the filler is uniformly dispersed in a resin glue solution and fiberglass cloth, and the toughness of the sheet material is improved.

Description

technical field [0001] The invention relates to printed circuit board technology, in particular to a halogen-free resin composition for copper clad laminates and a preparation method thereof. Background technique [0002] In the field of electronic materials, the metal and glass fiber cloth substrates in copper clad laminates are non-flammable, but the epoxy resin film used in copper clad laminates is extremely flammable. If there is a problem such as a short circuit in the electronic material, the flammable epoxy resin in the copper clad laminate will burn immediately, which will not only damage the equipment, but also cause a fire in severe cases. Usually, in order to reduce the flammability of epoxy resin, various flame retardants are added. Most of the common flame retardants contain halogens, which are not only not environmentally friendly, but also burn when the temperature is too high. Toxic Chemicals. [0003] The glass transition temperature of conventional haloge...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L63/00C08K9/06C08K3/22C08K3/34
CPCC08K2003/2227C08L63/00C08L2201/08C08L2201/22C08L2203/20C08L2205/025C08K9/06C08K3/22C08K3/34
Inventor 秦伟峰陈长浩郑宝林付军亮杨永亮陈晓鹏姜晓亮姜大鹏朱义刚
Owner SHANDONG JINBAO ELECTRONICS
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