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High-strength aluminum alloy solder for brazing at medium temperature and preparation method thereof

An aluminum alloy, high-strength technology, applied in welding equipment, metal processing equipment, welding/cutting media/materials, etc., can solve problems such as difficult to obtain performance brazed joints, can not meet brazing requirements, etc., to achieve high strength, good The effect of brazing manufacturability and narrow melting zone

Active Publication Date: 2012-06-27
ZHEJIANG UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The existing Al-Si, Al-Si-Cu and other brazing materials cannot meet the brazing requirements of 6063, 6061 and other heat-treatable aluminum alloys, and it is difficult to obtain brazed joints with excellent performance

Method used

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Effect test

preparation example Construction

[0014] The preparation method of the high-strength aluminum alloy medium-temperature brazing filler metal of the present invention, the steps are as follows:

[0015] 1. Use Al, Si, Cu, Ge and Ni with a purity greater than 99.6% as raw materials, according to 5.0~7.0%Si, 10.0~12.0%Cu, 3.0~4.0%Ge, 2.0~3.0%Ni, and the rest is the quality of Al Proportioned materials are taken, put into a vacuum induction melting furnace, and the vacuum is drawn to 3.0~4.0×10 -3 Pa, filled with 0.05MPa pure argon for induction melting, fully alloyed and then poured into the water-cooled copper mold in the furnace to obtain a master alloy ingot with uniform composition;

[0016] 2) Break the master alloy ingot into small pieces and put it into the quartz tube in the vacuum spin quenching system, start the vacuum spin quenching system, and extract the vacuum of the induction furnace cavity to 3.0~4.0×10 -3 After the Pa is filled with 0.05MPa pure argon for protection, the master alloy in the quart...

Embodiment 1

[0019] Embodiment 1: Determination of solder alloy composition

[0020] Existing studies have shown that adding Cu to Al-Si-based solder can greatly reduce the melting point of Al-Si-based solder. For example, the melting temperature range of Al-9.6Si-20Cu with 20wt.% Cu added is 522 ~536°C, but the addition of more Cu will make the material brittle and cause corrosion of the base metal during brazing, making it difficult to obtain a brazed joint with excellent performance; adding a small amount of Ni can reduce the melting point of the solder to a certain extent, For example, the melting temperature range of Al-10Si-20Cu-3.3Ni with 3.3wt.% Ni added is 491.7~535.8°C. More importantly, Ni replaces part of Cu to reduce the damage of Cu to the plasticity of the solder, reduce brittleness, and improve Brazing joint strength; adding Ge can significantly reduce the melting point of the solder, for example, the melting temperature range of Al-Si-20Cu-10Ge with 10wt.% Ge added is 408~...

Embodiment 2

[0021] Embodiment 2: the preparation of solder

[0022]Existing studies have shown that compared with ordinary solders of the same composition prepared by traditional methods, solders prepared by melt rapid cooling technology have uniform composition and narrow melting temperature range, which can achieve instantaneous melting and spread rapidly. , so it has good wettability. The narrow melting temperature range of the solder is beneficial to avoid over-burning of the base metal and improve the quality of the brazed joint. Ordinary brazing materials prepared by traditional methods have a coarse structure and uneven distribution of components. The eutectic with a low melting point melts first, and the precipitated phase and intermetallic compound with a high melting point melt afterward. Moisture is poor. Compared with the melting point, the crystal grains of the quick-cooling solder are fine and the surface energy is increased, which finally makes the melting point lower tha...

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Abstract

The invention discloses a high-strength aluminum alloy solder for brazing at medium temperature and a preparation method thereof. The chemical compositions of the solder include: by mass percentage, 5.0%-7.0% of Si, 10.0%-12.0% of Cu, 3.0%-4.0% of Ge, 2.0%-3.-% of Ni, and the balance Al. The solder is prepared by the melt quick-cooling technology with the melting temperature ranging from 514 DEG C to 538 DEG C and the brazing temperature ranging from 540 DEG C and 560 DEG C, is applicable to brazing of aluminum alloy with the solidus curve higher than 560 DEG C, is particularly suitable for heat-treatable strengthened aluminum alloy which requires solution treatment at the temperature not higher than 530 DEG C after being brazed, and can be adaptable to the brazing methods including brazing in protective gas, vacuum brazing, induction brazing, flame brazing and the like. With the solder, aluminum alloy 6063 is brazed in a soldering flux QJ201 gas protection furnace, soldered joints are subjected to T6 heat treatment, and the shearing strength of the soldered joints is higher than 91Mpa.

Description

technical field [0001] The invention belongs to the technical field of welding connection of aluminum alloys, and in particular relates to a high-strength aluminum alloy medium-temperature brazing filler material and a preparation method thereof. Background technique [0002] Aluminum alloy has excellent characteristics such as high specific strength, good corrosion resistance, easy forming, and good electrical and thermal conductivity. It is widely used in military and civilian industries such as aerospace, ships, power transmission, petrochemicals, automobiles, and electronics. Brazing is one of the most commonly used methods for joining aluminum alloys. It has the advantages of small deformation of brazing parts and beautiful brazing seams, and is especially suitable for manufacturing complex aluminum alloy components. The most widely used solder for aluminum alloy brazing is Al-Si solder, which is based on the A1-Si eutectic composition (Al-12.6Si). This eutectic alloy h...

Claims

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Application Information

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IPC IPC(8): B23K35/28B23K35/40
Inventor 罗伟严密黄鹏史佩珍林坤王成林白国华王博
Owner ZHEJIANG UNIV
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