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Calcium-aluminum-boron-silicon glass and fused quartz low-temperature co-fired ceramic material and preparation method thereof

A low-temperature co-fired ceramic and fused silica technology, applied in the field of electronic packaging materials, can solve the problems of difficult control of crystallization process, unpredictable material properties, unfavorable mass production, etc., and achieves low porosity, low thermal expansion coefficient, and densification degree. high effect

Inactive Publication Date: 2012-06-20
TIANJIN UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The disadvantage is that the crystallization process is difficult to control, the material properties are difficult to predict, especially the dielectric loss, the process window is narrow, and the device stability is poor, which is not conducive to mass production

Method used

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  • Calcium-aluminum-boron-silicon glass and fused quartz low-temperature co-fired ceramic material and preparation method thereof
  • Calcium-aluminum-boron-silicon glass and fused quartz low-temperature co-fired ceramic material and preparation method thereof
  • Calcium-aluminum-boron-silicon glass and fused quartz low-temperature co-fired ceramic material and preparation method thereof

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Experimental program
Comparison scheme
Effect test

Embodiment 1

[0024] In a specific embodiment of the present invention, the mole percentage content of each oxide in calcium aluminum borosilicate glass is as follows:

[0025]

[0026] The preparation method of the low-temperature co-fired ceramic material in this embodiment comprises the following steps:

[0027] (1) Raw material preparation for low melting point glass: Weigh the raw materials required for low melting point calcium aluminum borosilicate glass according to the mole percentage of each oxide mentioned above, and mix them evenly.

[0028] (2) Preparation of low-melting point glass: put the above-mentioned homogeneously mixed mixture into a crucible, heat it at 1500° C. for 4 hours, pour the molten glass liquid directly into deionized water to obtain glass slag, and after ball milling (the ball-to-material ratio is 3:1, the ball milling medium is deionized water), and the glass powder with an average particle size of 3 μm is obtained.

[0029] (3) Preparation of high melti...

Embodiment 2

[0034] In a specific embodiment of the present invention, the mole percentage content of each oxide in calcium aluminum borosilicate glass is as follows:

[0035]

[0036] The preparation method of the low-temperature co-fired ceramic material in this embodiment comprises the following steps:

[0037] (1) Raw material preparation for low melting point glass: Weigh the raw materials required for low melting point calcium aluminum borosilicate glass according to the mole percentage of each oxide mentioned above, and mix them evenly.

[0038] (2) Preparation of low-melting point glass: put the above-mentioned homogeneously mixed mixture into a crucible, heat it at 1550° C. for 4 hours, pour the molten glass liquid directly into deionized water to obtain glass slag, and after ball milling (the ball-to-material ratio is 3:1, the ball milling medium is deionized water), and the glass powder with an average particle size of 1 μm is obtained.

[0039] (3) Preparation of high melti...

Embodiment 3

[0044] In a specific embodiment of the present invention, the mole percentage content of each oxide in calcium aluminum borosilicate glass is as follows:

[0045]

[0046] The preparation method of the low-temperature co-fired ceramic material in this embodiment comprises the following steps:

[0047] (1) Raw material preparation for low melting point glass: Weigh the raw materials required for low melting point calcium aluminum borosilicate glass according to the mole percentage of each oxide mentioned above, and mix them evenly.

[0048] (2) Preparation of low-melting point glass: put the above-mentioned homogeneously mixed mixture into a crucible, heat it at 1550° C. for 5 hours, pour the molten glass liquid directly into deionized water to obtain glass slag, and after ball milling (the ball-to-material ratio is 3:1, the ball milling medium is deionized water), and the glass powder with an average particle size of 1.5 μm is obtained.

[0049] (3) Preparation of high mel...

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Abstract

The invention relates to a calcium-aluminum-boron-silicon glass and fused quartz low-temperature co-fired ceramic material and a preparation method thereof. In the ceramic material, the calcium-aluminum-boron-silicon low-melting-point glass phase accounts for 50-70% of the total material mass. The preparation method comprises the steps of: weighing raw materials according to the molar percentages of oxides required by the low-melting-point glass phase, maintaining the temperature at 1500-1600 DEG C for 3-5 hours, directly pouring the molten glass into deionized water to obtain glass slag, and ball-milling to obtain glass powder with average granularity of 1-3 mu m; ball-milling fused quartz to obtain fused quartz powder with average granularity of 3-5 mu m; uniformly mixing 50-70wt% of low-melting-point glass phase and high-melting-point ceramic filling phase, adding a polyvinyl alcohol adhesive accounting for 3wt% of the mixed material, granulating and carrying out dry pressing to obtain blank sheets; and sintering to obtain the low-temperature co-fired ceramic material. The obtained low-temperature co-fired ceramic material has low sintering temperature, and can be co-fired with gold, silver, copper and other conductor materials; the obtained material is high in densification degree, low porosity and lower in thermal expansion coefficient; and the process flow is simple and the cost is low.

Description

technical field [0001] The invention relates to a low-temperature co-fired ceramic material with a low thermal expansion coefficient and a preparation method thereof, belonging to the field of electronic packaging materials. Background technique [0002] With the rapid development of microelectronics technology, electronic circuits are increasingly miniaturized and integrated. However, the development of electronic packaging technology has not been matched with it, which has become a bottleneck restricting the continued development of microelectronic technology. Low temperature cofired ceramics (Low Temperature Cofired Ceramics, LTCC) technology, as a new electronic packaging technology that has emerged in recent years, has received extensive attention and research by researchers at home and abroad. It involves a wide range of fields such as circuit design, microwave technology, and material science. In particular, material technology, which plays a key role, has received ...

Claims

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Application Information

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IPC IPC(8): C03C10/00
Inventor 杨德安夏国斌
Owner TIANJIN UNIV
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