Joint coating copper-based alloy for silver and preparation method thereof
A copper-based alloy and a manufacturing method, which are applied in the field of metallurgy and can solve the problems of inappropriate addition of rare earth elements, difficulty in controlling the burning loss rate of rare earth elements, erythema oxidation and the like
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Examples
preparation example Construction
[0028] This embodiment also provides a method for preparing the above-mentioned copper-based alloy for silver jointing, which includes the following steps:
[0029] S10: According to the composition of the above-mentioned patch copper-based alloy for silver, each component except copper is made into a binary master alloy with copper;
[0030] S20: Analyze the component content of each binary master alloy, mix each binary master alloy according to the content of each component in the above-mentioned silver-use copper-based alloy, and in an inert gas protection environment, remove the binary intermediate alloy of compound rare earth elements Other binary master alloys other than the alloy are mixed and smelted, adding a deoxidizer, and then adding a binary master alloy compounded with rare earth elements, continuing to smelt, and using a granulation device to smelt into joint particles with a particle size of 2-5mm.
[0031]In step S01, the required elemental components other th...
Embodiment 1
[0036] The percentage by weight of each element of the copper-based alloy for silver jointing of the present embodiment is:
[0037] Zn: 35%, Sn: 2%, Si: 0.5%, La: 0.2%, Y: 0.5%, B: 0.05%, Li: 0.05%, In: 1.0%, Cu: balance.
[0038] The manufacturing method of the copper-based alloy for silver jointing comprises the following steps:
[0039] a. Making rare earth elements and other oxygen active elements with copper to form a binary master alloy respectively, that is to say, each element except copper in the above formula forms a binary master alloy with copper respectively;
[0040] b. Analyze the composition of each binary master alloy, mix the ingredients according to the above-mentioned formula ratio, melt them into joint particles in the jewelry alloy granulation device, add deoxidizer during smelting, wherein the binary master alloy of rare earth elements is added Add the deoxidizer last;
[0041] c. Grinding and polishing the joint alloy particles, and pickling to remov...
Embodiment 2
[0044] The percentage by weight of each element in the copper-based alloy that the present embodiment silver uses is:
[0045] Zn: 34%, Sn: 8%, Si: 1.0%, Ce: 0.2%, Y: 1.0%, Li: 0.05%, In: 1.0%, Cu: balance.
[0046] The manufacturing method of the copper-based alloy for silver jointing comprises the following steps:
[0047] a, the above-mentioned addition elements except copper are made into Cu-Me binary master alloy with copper respectively;
[0048] b. Analyze the composition of each binary master alloy, mix the ingredients according to the above proportions, melt them into joint particles in the jewelry alloy granulation device, add a deoxidizer during smelting, and the binary master alloy of rare earth elements will be deoxidized after adding Add at the end after the agent;
[0049] c. Grinding and polishing the joint alloy particles, and pickling to remove the oxide film.
[0050] The prepared copper base alloy and pure silver are formulated and smelted into silver al...
PUM
Property | Measurement | Unit |
---|---|---|
particle diameter | aaaaa | aaaaa |
hardness | aaaaa | aaaaa |
Vickers hardness | aaaaa | aaaaa |
Abstract
Description
Claims
Application Information
- R&D Engineer
- R&D Manager
- IP Professional
- Industry Leading Data Capabilities
- Powerful AI technology
- Patent DNA Extraction
Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.
© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com