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Boiling-resistant epoxy adhesive as well as preparation method and application thereof

A technology of epoxy adhesive and cooking resistance, applied in epoxy resin adhesives, chemical instruments and methods, adhesives, etc. Effect

Inactive Publication Date: 2012-01-25
上海海鹰粘接科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Ordinary epoxy products cannot meet the demand, which greatly restricts the application of epoxy adhesives in the field of special electronic potting

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0059] A preparation method of retort-resistant epoxy glue, the method comprises the following steps:

[0060] Preparation of A component

[0061] (1) Put 30kg of bisphenol A epoxy resin, 3kg of polyisobutylene, and 0.3kg of coupling agent KH-560 in a reaction kettle, stir and heat to 60°C;

[0062] (2) Keep stirring and drop 50kg of active silicon micropowder and 15kg of aluminum oxide into the reactor successively;

[0063] (3) After mixing evenly, start degassing under reduced pressure, control the vacuum degree of the reactor to be-0.1MPa, and control the reaction time to be 1.5h;

[0064] (4) Add 0.5kg of ethylene glycol after defoaming;

[0065] (5) Check the performance and various indicators of the adhesive, then cool it to room temperature, weigh and pack.

[0066] Preparation of component B

[0067] (1) 25kg methylhexahydrophthalic anhydride is dropped into the reactor, and then the stirring is started;

[0068] (2) Slowly add 0.4kg stannous octoate into the react...

Embodiment 2

[0072] A preparation method of retort-resistant epoxy glue, the method comprises the following steps:

[0073] Preparation of A component

[0074] (1) Put 40kg of bisphenol A type epoxy resin, 5kg of polyisobutylene, and 0.7kg of coupling agent KH-560 in the reaction kettle, stir and heat to 60°C;

[0075] (2) Keep stirring and put 60kg of active silicon micropowder and 25kg of aluminum oxide into the reactor successively;

[0076] (3) After mixing evenly, start degassing under reduced pressure, control the vacuum degree of the reactor to be-0.1MPa, and control the reaction time to be 1.5h;

[0077] (4) Add 0.85kg of glycerol after defoaming, then check the adhesive performance and various indicators, and finally cool to room temperature, weigh and pack.

[0078] Preparation of component B

[0079] (1) 40kg of methylhexahydrophthalic anhydride is dropped into the reactor, and then the stirring is started;

[0080] (2) Slowly add 0.7kg of benzyldimethylamine into the reacti...

Embodiment 3

[0084] A preparation method of retort-resistant epoxy glue, the method comprises the following steps:

[0085] (1) Prepare the raw materials of component A and component B respectively, wherein the raw materials of component A are as follows: bisphenol F epoxy resin 35kg, styrene-butadiene thermoplastic elastomer 4kg as toughening agent, active talc Powder 55kg is used as an active inorganic filler, the active talc powder is obtained through hydrophobic treatment, red phosphorus 30kg is used as an active inorganic flame retardant additive, 1kg coupling agent γ-(2.3-glycidyloxy)propyltrimethoxysilane, 0.8kg of ethylene glycol, the raw materials of component B are as follows: 30kg of methyl tetrahydrophthalic anhydride, 60kg of active mica powder as the active inorganic filler, the active mica powder is obtained through hydroxylation treatment, and 25kg of zinc borate as the active Inorganic flame retardant additive, catalyst stannous octoate 0.5kg;

[0086] (2) Preparation of ...

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Abstract

The invention relates to a boiling-resistant epoxy adhesive as well as a preparation method and application thereof. The boiling-resistant epoxy adhesive consists of a component A and a component B; epoxy resin, toughener and coupling agent are mixed, and are stirred and heated, activated inorganic filler and activated inorganic flame retardant are added, polyhydric alcohol or polyhydric phenol is then added, and thereby the component A is prepared; anhydride and catalyst are mixed and heated, activated inorganic filler and activated inorganic flame retardant are then added, and after depressurization for defoaming, the component B is prepared; when in use, the component A and the component B are uniformly mixed according to the proportion by weight of 1 to 3:1, and thereby the boiling-resistant epoxy adhesive is prepared. Compared with the prior art, the boiling-resistant epoxy adhesive has high adhesive force for electronic elements, is convenient to use, and has excellent high-temperature-resistant property, high strength and good weather fastness and impregnating property, the surface properties of solidified product is excellent, and the post-solidification phenomenon caused by cracking is prevented.

Description

technical field [0001] The invention relates to an adhesive and its preparation method and application, in particular to a retort-resistant epoxy adhesive and its preparation method and application. Background technique [0002] The excellent physical, mechanical and electrical insulation properties of epoxy resin, the bonding performance with various materials, and the flexibility of its use process are not available in other thermosetting plastics. Therefore, various coatings, composite materials, pouring potting materials, adhesives, molding materials and injection molding materials prepared from epoxy resins have been widely used in various fields of the national economy. Among them, epoxy potting glue is widely used in insulating potting of various electronic component circuits and devices. It has become an indispensable and important insulating packaging material for the electronics industry. However, in some high-demand potting occasions, there are quite strict requ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J163/00C09J163/02C09J11/08C09J11/04C09J11/06C09K3/10
Inventor 李厚堂张俊灏樊利东魏云斌
Owner 上海海鹰粘接科技有限公司
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