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Soluble functional polyimide containing rigid non-planar conjugated structure, and preparation method and application thereof

A polyimide, conjugated structure technology, applied in the field of material science, can solve problems such as single species, achieve the effects of simple preparation process, excellent photoluminescence, high glass transition temperature and thermal stability

Active Publication Date: 2012-01-18
SUN YAT SEN UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In the past two years, soluble functionalized polyimide based on triphenylamine structure has shown attractive application prospects in the application of polymer storage materials due to its unique resistance switching effect, which has aroused the interest of researchers in this field. Attention, however, the development and research of functional polyimide is still in its infancy, the variety is relatively single, and its function needs to be further developed

Method used

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  • Soluble functional polyimide containing rigid non-planar conjugated structure, and preparation method and application thereof
  • Soluble functional polyimide containing rigid non-planar conjugated structure, and preparation method and application thereof
  • Soluble functional polyimide containing rigid non-planar conjugated structure, and preparation method and application thereof

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Experimental program
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Effect test

Embodiment 1

[0040] At room temperature, 4.3856g (0.01mol) 4', 4"-(2-phenylethene-1,1-diyl) dibiphenyl-4-amine (TriPEDBA) and 58.6g (62.3ml) N, N-dimethyl form Add the amide into a 100ml three-necked flask, pass in argon, stir, and after it is completely dissolved, add 4.4424g (0.01mol) of 4,4-hexafluoroisopropylphthalic anhydride (6-FDA), and continue to stir the reaction After 4 hours, a homogeneous, transparent and viscous polyamic acid solution was obtained. Scrape-coat the obtained polyamic acid solution on a clean glass plate, then place the glass plate in a vacuum oven, vacuumize, and the heating program is: room temperature to 100°C After constant temperature (the whole process 1h) → 100°C to 200°C, then constant temperature (the whole process 1h) → 200°C to 350°C, then constant temperature (the whole process 1.5h), the polyimide film can be taken out after cooling. The 5% thermal weight loss temperature of the imide film is 524°C, the glass transition temperature is 361°C, the str...

Embodiment 2

[0044] Prepare polyamic acid solution in the same way as in Example 1, and then prepare polyimide by chemical imidization. The steps are as follows: add 5 mL of acetic anhydride to the obtained polyamic acid solution, continue stirring, and then slowly add 2.5 mL of three Ethylamine, and heated to 70°C, continued to stir for 6 hours, then scraped the solution onto a clean glass plate, then placed the glass plate in a vacuum oven, evacuated, and dried at 100°C for 12 hours, and the polyimide film could be taken out after cooling. The 5% thermal weight loss temperature of the polyimide film is 527°C, the glass transition temperature is 363°C, the wavelength corresponding to the strongest fluorescence peak is 462nm, the visible light transmittance is 85%, the solubility of the polyimide film is Test result and infrared spectrogram are identical with embodiment 1.

Embodiment 3

[0046] At room temperature, 4.3856g (0.01mol) 4', 4"-(2-phenylethene-1,1-diyl) dibiphenyl-4-amine (TriPEDBA) and 48.6g (51.5ml) N, N-dimethyl form Add the amide into a 100ml three-necked flask, pass in argon, stir, and after it is completely dissolved, add 2.9027g (0.01mol) of 4,4'-biphenyltetracarboxylic dianhydride (BPDA), and continue stirring for 2h to obtain a homogeneous Transparent and viscous polyamic acid solution. Scrape-coat the obtained polyamic acid solution on a clean glass plate, then place the glass plate in a vacuum oven and vacuumize it. 1h) → 100°C to 200°C and then constant temperature (the whole process 1h) → 200°C to 350°C and then constant temperature (the whole process 1.5h), the polyimide film can be taken out after cooling. The polyimide film 5 The thermal weight loss temperature of % is 551°C, the glass transition temperature is 368°C, the wavelength corresponding to the strongest fluorescence peak is 467nm, and the visible light transmittance is 88%...

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Abstract

The invention discloses a soluble functional polyimide containing rigid non-planar conjugated structure, and a preparation method and application thereof. The polyimide disclosed by the invention is prepared from aromatic diamine and various tetracid dianhydrides by an imidization method. The polyimide disclosed by the invention is soluble in NMP (N-methylpyrrolidone), DMSO (dimethyl sulfoxide), DMAc (dimethyl acetylamide), DMF (N,N-dimethylformamide), m-Cresol, THF (tetrahydrofuran) and any other conventional organic solvent, and has the advantages of high glass transition temperature, high thermal stability, excellent mechanical properties, photoluminescence and the like. The synthesis method disclosed by the invention has the advantage of simple and multiple techniques, and thus, is suitable for industrial production; and the polyimide disclosed by the invention can be used for preparing photoluminescent materials, and is widely applicable to the fields of high and new technology industries, such as electronics, micro-electronics, information, luminescent material, aerospace and the like.

Description

technical field [0001] The invention relates to the field of material science, in particular to a class of soluble functional polyimide with rigid non-planar conjugated structure and its preparation method and application. technical background [0002] Polyimide is one of the best heat-resistant varieties among engineering plastics that have been industrialized at present. It has outstanding properties unmatched by other materials, such as high mechanical strength, good high and low temperature resistance, excellent dielectric properties, and film-forming properties. OK wait. Since the development and industrialization of DuPont in the United States in the 1960s, it has been applied in various fields, especially in aerospace, aviation, microelectronics and military fields. Since polyimide is generally insoluble in organic solvents, it is usually processed with a precursor polyamic acid with good solubility, and then undergoes dehydration and ring-closing imidization treatme...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08G73/10C08J5/18C08L79/08C09K11/06
Inventor 张艺刘亦武许家瑞兰麒秦泽鑫陈亮辉刘四委池振国
Owner SUN YAT SEN UNIV
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