Metal substrate of heat conducting aluminium-based core and preparation method thereof

Abstract

The invention discloses a metal substrate of a heat conducting aluminium-based core and a preparation method thereof. The metal substrate is composed of a metal aluminium substrate, an alumina insulating layer, a buffer layer, a first conducting layer, a second conducting layer and a weldable layer, wherein the metal aluminium substrate, the alumina insulating layer, the buffer layer, the first conducting layer, the second conducting layer and the weldable layer are superposed successively. According to the preparation method, a surface of the aluminium substrate is processed by using an anodization solution to generate the alumina insulating layer; the buffer layer and the first conducting layer are coated on the alumina insulating layer by a physical deposition method and then the second conducting layer is coated by an electrochemical deposition method; pad pasting and etching processes are carried out on the surface of the second conducting layer to obtain a needed circuit; at last, the weldable layer metal is coated on the second conducting layer by the electrochemical deposition method. According to the invention, the metal substrate has advantages of light weight, high heat radiation efficiency, long service life, and high reliability of performance; moreover, the metal substrate completely meets packaging requirements of various components and has low production cost; therefore, the metal substrate provided in the invention satisfies a condition of large-scale industrial application.

Description

technical field [0001] The invention relates to a high thermal conductivity metal substrate material, in particular to a metal substrate with a high thermal conductivity aluminum-based core and a preparation method thereof. Background technique [0002] With the development of light, thin, small, high-density and multi-functional electronic products, the assembly density and integration of components on the circuit board are getting higher and higher, the power consumption is increasing, and the heat dissipation performance requirements of the substrate are also increasing. high. If the heat dissipation of the substrate is not good, it will cause the components on the circuit board to overheat and greatly reduce the overall reliability. Therefore, it is imminent to study metal substrates with reliable performance and high thermal conductivity. [0003] A metal substrate generally consists of a three-layer structure, namely a conductive layer (used as a circuit), an insulat...

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Problems solved by technology

The disadvantage of this type of insulating layer is that the thermal conductivity is too low (less than 2-3W / m·K), and the thermal expansion of organic thermal conductive adhesive is larger than that of metal, and it is easy to deform after being heated, which cannot meet the heat dissipation of high-density component assembly circuit boards at all. Require

However, due to the stress mismatch between alumina and metal wires, the substrate is prone to brittle cracks after heating, which seriously affects the reliability of substrate performance; and a large number of microporous structures on the surface of alumina will also have a certain impact on its insulation performance, so High thermal conductivity metal substrates prepared with alumina insulating layers still cannot be fully promoted and used

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