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Resin-bonded grinding wheel

A technology of bonding agent and resin, which is applied in the direction of abrasives, metal processing equipment, manufacturing tools, etc., can solve the problems of insufficient improvement of abrasive grain retention, and achieve excellent grinding ability, high surface accuracy, and less shedding.

Inactive Publication Date: 2011-10-05
FUJIMI INCORPORATED
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, these inventions alone have not sufficiently improved the holding power of abrasive grains, and further improvements are expected.

Method used

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  • Resin-bonded grinding wheel

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1～13 and comparative example 1～5

[0059] Abrasive grains, a thermosetting resin, and metal powder were combined as shown in Table 1, and samples provided with resin-bonded grinding wheels were produced by the following method.

[0060] In addition, among the abrasive grains, diamond abrasive grains having an average particle diameter of 6.8 μm were used, and the ratio to the total volume of the resin bonding layer was adjusted to 2.7% by volume. In addition, a polyimide resin and a phenolic resin were used as the thermosetting resin, specifically, Imidaroi KIR-30 (trade name, manufactured by Kyosera Chemical Co., Ltd.) name, manufactured by Ea Uota Co., Ltd.) as the phenolic resin. In addition, when the additional metal powder is used, powdered iron particles having an average particle diameter of 10 µm and a X' / Y' ratio of less than 10 are used.

[0061] Sample manufacturing method

[0062] 1. Mix the raw materials with a V-shaped pulverizer

[0063] 2. Fill the raw material mixture into the forming mold...

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Abstract

The invention provides a resin-bonded grinding wheel satisfying the requirements of high retention and excellent grinding capability of abrasive particles and highly accurate grinded surfaces, and a grinding method by using the resin-bonded grinding wheel. The resin-bonded grinding wheel has a resin-bonded layer containing thermosetting resin and abrasive particles and metallic powder scattered thereon, wherein the metallic power contains over 50% of non-spherical metallic powder particles of 45 micrometers, and the ration of surface area of each metallic particle X to the surface area of an average spherical particle of the metallic particles Y is high than 10.

Description

technical field [0001] This invention relates to resin bonded grinding wheels. Background technique [0002] Diamond abrasive grains and cubic boron nitride abrasive grains (hereinafter referred to as CBN abrasive grains) have extremely high hardness, excellent grinding ability and durability, and are often used as materials for grinding wheels. In particular, grinding wheels using small-sized diamond abrasive grains and CBN abrasive grains are widely and effectively used for hard and brittle materials such as optical parts such as cemented carbide, hard ceramics, synthetic resins, glass, and lenses, or their composite materials. For high precision finishing. [0003] Generally, a grinding wheel has a structure in which abrasive grains are fixed by a bond. Moreover, according to the type of bond used, it can be divided into metal bonded grinding wheel, resin bonded grinding wheel, vitrified bonded grinding wheel, and electrodeposition grinding wheel. The performance of the...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B24D3/28
Inventor 三浦司朗
Owner FUJIMI INCORPORATED
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