Preparation method of heat conduction paster adopting fiber glass mesh as supporting structure

Abstract

The invention discloses a preparation method of heat conduction paster, adopting a fiber glass mesh as a supporting structure. The preparation method comprises the steps of dissolving and formulating silicon rubber into silicon rubber solution, and sequentially adding vulcanizer, heat conduction filler and a silane coupling agent to formulate size with medium viscosity and fine coating performance by ultrasonic dispersion and ball-milling uniform mixing; and uniformly coating the size on the pretreated glass fiber mesh and obtaining the heat conduction paster through solvent volatilization, drying, moulding curing and trimming. The heat conduction paster has a high heat conduction rate and a small thermal expansion coefficient, is high in heat stability and soft, meets the requirement on an insulating property, and is convenient to use and disassemble since the surface of the paster has certain viscosity that can be adjusted within a certain range.

Description

technical field [0001] The invention relates to a preparation method of a heat conduction patch using a glass fiber mesh as a supporting structure. Background technique [0002] With the development of microelectronics technology, electronic components are developing toward miniaturization, integration, and multi-function. The microelectronics industry is facing the problem of heat dissipation bottlenecks. The temperature rises, the function of electronic components decreases, the reliability decreases, and the service life is obvious. decrease. Especially in LED packaging, the difficulty of heat dissipation greatly hinders the improvement of LED lighting power. There are three main ways of traditional heat dissipation: air cooling, circulating water cooling and adding heat sinks. Due to the limitation of small size, it is generally used in the packaging of electronic materials to dissipate heat by adding heat sinks. The heat sinks are generally made of metal copper with ex...

AI Technical Summary

Problems solved by technology

Thermally conductive silicone grease is widely used in the electronics industry, but thermally conductive silicone grease has obvious disadvantages. The high viscosity makes it difficult for thermally conductive silicone grease to be evenly coated between interfaces. Studies have shown that too little thermally conductive silicone grease has limited effect. Coating too thick can cause packaging difficulties

As the temperature rises, the fluidity of thermal conductive silicone grease increases, which may cause pollution to electronic components, or even cause a short circuit, and the residual grease is not easy to remove, etc.

(2) Thermally conductive potting compound, which is made by adding thermally conductive filler to epoxy resin, which can better package the heating parts and heat dissipation parts as a whole, and the thermally conductive filler plays the role of heat conduction channel, but the thermal conductivity of this potting compound is poor, And after curing, affected by the change of ambient temperature, it is easy to cause the two to detach and lose the thermal conductivity condition.