Manufacturing method of laminated type ceramic electronic element

Abstract

The invention relates to a manufacturing method of a laminated type ceramic electronic element, sequentially comprising the following steps at an integral forming stage: (1) carrying out tape casting to form ceramic raw sheets; (2) arranging through holes; (3) filling slurry into the through holes; (4) printing electrodes; (5) laminating and pressing; and (6) carrying out isostatic pressing processing. The manufacturing method of the laminated type ceramic electronic element is characterized in that the step (3) of filling the slurry into the through holes is to fill conductive slurry into the through holes of the ceramic raw sheets in a screen printing manner and a reverse hole-filing manner; and the reverse hole-filing manner is to fill the conductive slurry into the through holes along a printing scraper downwards to be processed by a silk screen, a load-bearing sheet, the ceramic raw sheets and a printing supporting table plate sequentially. By adopting the reverse hole-filing manner in the manufacturing method, the stray capacitance brought about by the redundant electrodes can be effectively eliminated; and besides, the short circuit among the through holes cannot be caused when the through holes have a large number and small intervals on a same layer of the ceramic raw sheets. The manufacturing method provided by the invention can be widely used for manufacturing the laminated type ceramic electronic element made of ferrite ceramics, alumina glass ceramics, manganese-cobalt-nickel ceramics and zinc oxide ceramics.

Description

technical field [0001] The invention relates to laminated chip ceramic electronic components, in particular to a manufacturing method of laminated chip ceramic electronic components. Background technique [0002] Most of the existing manufacturing methods of laminated ceramic electronic components are to print conductive paste on the surface of the ceramic green sheet to form the electrode structure inside the component, and the electrodes of different ceramic green sheets are connected through the through holes inside the green sheet interconnection; the internal lead-out electrode and the external connection electrode are also connected through the internal through hole of the green sheet. The reliability of multilayer chip ceramic electronic components is basically determined by the reliability of through-hole connections. In the actual manufacturing process, the ceramic green sheet enters the printing process after being opened by a laser; while printing the conductive ...

AI Technical Summary

Problems solved by technology

For products with a relatively large size, the above disadvantages are not obvious, but for products with a relatively small size and a large number of electrode layers, the remaining electrodes will form parallel plate capacitors, increasing stray capacitance (such as figure 2 As shown), the performance of the product is deteriorated. In addition, the same layer of ceramic green sheet has many holes and the spacing is small, and the remaining electrodes around the through holes overlap each other, which is easy to cause a short circuit between the through holes (such as image 3 shown)

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