Structural design for improving power tolerance of micro low-capacitance protective device

Abstract

With the continual increase of the transfer speed of communication equipment, a data line protective device has lower and lower capacitance, but the power tolerance is still higher, so that the traditional machined structure can not meet the design requirements. Although the integration of a transient voltage suppressor (TVS) chip and a low-capacitance device chip on the same chip can reduce the occupied space of the chip, the power tolerance can incur loss accordingly. The invention relates to a structural design for improving the power tolerance of a micro low-capacitance protective device. A group of TVS chips and the low-capacitance device are independently designed, and are encapsulated in a structure disclosed in the drawing, thereby greatly lowering the chip machining difficulty and properly increasing the TVS area. The TVS chips and the low-capacitance device can be assembled in the same micro encapsulation body, thus the conflict between low capacitance and high power is solved.

Description

technical field [0001] The invention belongs to the field of microelectronic devices, and rationally arranges multiple chips in a plastic package with a very small space, thereby solving the contradiction between miniaturization and power tolerance. [0002] Its multi-chip packaging not only solves the processing difficulty of the chip, but also greatly increases the source area of ​​the anti-power chip, completely solves the process incompatibility between low-capacitance devices and power devices, greatly increases the power tolerance, and greatly reduces the value of low-capacitance . Background technique [0003] In the past, ESD did not seem to be a problem because electronic equipment was not so small and the IC devices used were much larger than they are now. Because larger devices also have higher capacitance, they can hold more charge per volt (V) and are therefore less susceptible to ESD than smaller devices. And when the size of electronic equipment is getting s...

AI Technical Summary

Problems solved by technology

And when the size of electronic equipment is getting smaller and smaller, the functions are more and more, the circuit is more and more sophisticated, and the semiconductor technology used is below sub-micron, the IC design is more sensitive to ESD, and it is more vulnerable to ESD damage, ESD At the same time, low capacitance becomes a design challenge

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