Abrasive material-free polishing fluid for chemical mechanical polishing of rigid fragile material

Abstract

The invention discloses abrasive material-free polishing fluid free for chemical mechanical polishing of a rigid fragile material. The polishing fluid is characterized by consisting of 0.5 to 40 percent of corrosive, 0.5 to 20 percent of corrosion inhibitor, 0.5 to 15 percent of surfactant, 0.1 to 10 percent of pH regulator and de-ionized water. The abrasive material-free polishing fluid has the advantages of no abrasive material, small damage to the surface of a polished material, capability of obtaining a non-damage super smooth surface, no precipitate, capability of being stored and used for a long time, high stability, difficult volatilization, high fluidity, easy cleaning and small corrosion to equipment. The abrasive material-free polishing fluid is prepared special for the chemicalmechanical polishing of the rigid fragile material, so the abrasive material-free polishing fluid has the advantages of conventional abrasive material-free polishing fluid, has high removal ratio forthe rigid fragile material, can obtain high surface quality and has low cost and a simple and easy method.

Description

technical field [0001] The invention relates to a polishing liquid used in the chemical mechanical polishing process, in particular to a non-abrasive polishing liquid for chemical mechanical polishing, in particular to a non-abrasive polishing liquid for chemical mechanical polishing of hard and brittle materials. Background technique [0002] Chemical mechanical polishing technology is widely used in precision ultra-precision machining of semiconductors, crystals, ceramics, glass, metals and other materials, and is currently the only practical technology that can achieve local and global planarization. However, the polishing liquid of traditional chemical mechanical polishing contains hard abrasive particles. During the polishing process, the hard particles in the polishing liquid are easy to scratch, embed or adsorb on the surface of the processed material to form processing defects, such as pits, scratches, and microcracks. , particle embedding or adsorption and other sur...

AI Technical Summary

Problems solved by technology

[0004] The object of the present invention is to aim at the existing hard and brittle material chemical mechanical polishing liquid because of adding abrasives, so scratches will be generated on the polishing surface during the chemical mechanical polishing process and it is not easy to clean after polishing. At the same time, the existing polishing liquid has a single function and is universal. Poor performance, it is necessary to prepare corresponding polishing liquid for different materials to be processed and other defects and deficiencies, to provide a kind of chemical mechanical polishing of hard and brittle materials with good versatility, no scratches on the processed surface, easy to clean, and low cost non-abrasive polishing fluid