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Heat-conducting wave-absorbing material

A technology of wave-absorbing materials and heat-conducting fillers, applied in the field of materials, can solve problems such as high cost and poor wave-absorbing performance, and achieve strong wave-absorbing performance and stable performance

Inactive Publication Date: 2018-10-09
SHENZHEN HECHANG ELECTROMAGNETIC MATERIALS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] At present, ferrite or metal is usually used alone as the absorbing material, and the absorbing performance of these materials often does not meet the requirements, and the cost is expensive

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0032] A heat-conducting wave-absorbing material of the present invention, the composition of the wave-absorbing material includes by mass parts:

[0033] Component A: 6-15 parts of silicone oil;

[0034] Thermally conductive filler 6-15 parts;

[0035] 70-85 parts of wave absorbing agent;

[0036] 1-5 parts of coupling agent;

[0037] B component: curing agent 10-25 parts;

[0038] 10-25 parts of catalyst;

[0039] Accelerator 1-3 parts.

[0040] A preferred technical solution of this embodiment: the thermally conductive filler includes one or more of aluminum oxide, silicon oxide, zinc oxide, magnesium oxide, calcium oxide, aluminum nitride, boron nitride, and silicon carbide for compounding .

[0041] A preferred technical solution of this embodiment: the wave absorbing agent includes one of sendust powder, iron powder and graphite powder.

[0042] A preferred technical solution of this embodiment: the coupling agent includes one of silanes, phthalates, and aluminate...

Embodiment 2

[0047] A preparation method of the heat-conducting wave-absorbing material described in any one of claims 1-7, characterized in that the preparation method comprises the following steps:

[0048] Step 1: Surface-treat the thermally conductive filler and wave absorbing agent with a coupling agent, then put the thermally conductive filler, wave absorbing agent, and silicone oil into a vacuum mixer, and stir for 0.5-2 hours to obtain component A;

[0049] Step 2: Mix the mixture of component A with the accelerator and curing agent, stir the mixed components at 25-40°C for 10-15min, then add the catalyst, continue to stir for 5-10min and stir evenly;

[0050] Step 3: inject the mixed slurry stirred in Step 2 into a calender, and cure at a constant temperature of 100°C for 5-15 minutes to obtain a heat-conducting and wave-absorbing material.

[0051] A preferred technical solution of this embodiment: the thermally conductive filler includes one or more of aluminum oxide, silicon ox...

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PUM

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Abstract

The invention discloses a heat-conducting wave-absorbing material. The wave-absorbing material comprises a component A and a component B in parts by mass, wherein the component A comprises 6-15 partsof silicon oil, 6-15 parts of heat-conducting filler, 70-85 parts of wave-absorbing agent, and 1-5 parts of coupling agent, and the component B comprises 10-25 parts of curing agent, 10-25 parts of catalyst, 1-3 parts of accelerant. The formation of the heat-conducting wave-absorbing material is facilitated, so that the wave absorbing performance of the finally formed wave absorbing material is better, and the performance of the wave-absorbing material formed by the method is 5-15% higher than that of a wave-absorbing material formed by a common method. The performance of the formed wave-absorbing material is more stable.

Description

technical field [0001] The invention relates to materials, in particular to a heat-conducting and wave-absorbing material. Background technique [0002] At present, ferrite or metal is usually used alone as a wave absorbing material, and the wave absorbing performance of these materials often fails to meet requirements, and at the same time, the cost is expensive. Contents of the invention [0003] Aiming at the deficiencies in the prior art, the technical problem to be solved by the present invention is to provide a heat-conducting and wave-absorbing material. [0004] In order to solve the above-mentioned technical problems, the present invention is realized through the following scheme: a heat-conducting wave-absorbing material, the composition of which wave-absorbing material includes by mass parts: [0005] Component A: 6-15 parts of silicone oil; [0006] Thermally conductive filler 6-15 parts; [0007] 70-85 parts of wave absorbing agent; [0008] 1-5 parts of c...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K9/00C09K3/00
CPCH05K9/0081C09K3/00
Inventor 罗信拓
Owner SHENZHEN HECHANG ELECTROMAGNETIC MATERIALS CO LTD
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