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YBCO thick film resistor slurry

A technology of thick-film resistors and pastes, which is applied in the direction of resistors, conductive materials, conductive materials, etc., can solve the problems of lower production cost of thick-film resistors, higher production costs, restrictions on the wide application of noble metal thick-film resistors and conductors, etc., to achieve The effect of low material cost and stable resistance value

Inactive Publication Date: 2010-06-09
银锐明
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the global resources of precious metals are limited, and the price is expensive and rising, so the wide application of precious metal thick film resistors and conductors is limited
Since the 1970s, people have paid more and more attention to the research on the application of base metals and their oxides to thick film resistors. However, base metals copper, nickel, and aluminum are easily oxidized when sintered in an air atmosphere, which reduces the conductivity or does not conduct electricity. Sintering in an inert atmosphere leads to an increase in manufacturing costs and cannot lead to a reduction in the final cost of manufacturing thick film resistors
With the continuous advancement of science and technology, new types of base metal oxides are partially applied to thick film resistors and commercialized, such as MoO 2 、MoSi 2 and other base metal compounds, but the cost is still high and the performance is not satisfactory
At present, the non-traditional, lower cost, and better performance room temperature conductive compound yttrium barium copper oxide (YBCO) material used in this patent application is applied to the conductive phase of thick film resistors and its supporting inorganic binder phase. rarely reported

Method used

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Examples

Experimental program
Comparison scheme
Effect test

example 1

[0012] (1) Conductive phase powder: use solid-phase method, Sol-gel method + high-temperature firing, oxalate precipitation method + high-temperature firing method or YBCO powder purchased on the market to control the average particle size to less than 2um;

[0013] (2) Inorganic binder phase: choose Bi 2 o 3 , the average particle size is controlled below 5um;

[0014] (3) Organic solvent and dissolution process: 90% of tributyl citrate, 7% of terpineol, 2% of nitrocellulose, 0.5% of lecithin, and 0.5% of bentonite. The dissolution process is to keep the above components in a high-temperature (80°C-90°C) water bath for 5 hours;

[0015] (4) Slurry mixing process: the solid phase component (YBCO: Bi 2 o 3 =95:5) and the organic binder ratio (70:30) were placed in a container for stirring and dispersing, and then three-roll rolling was carried out.

[0016] (5) Paste properties: The prepared resistive paste was leak-printed on a substrate and tested, and the square resista...

example 2

[0018] (1) Conductive phase powder: use solid-phase method, Sol-gel method + high-temperature firing, oxalate precipitation method + high-temperature firing method or YBCO powder purchased on the market to control the average particle size to less than 2um;

[0019] (2) Inorganic binder phase: choose glass powder, the average particle size is controlled below 5um; glass formula: SiO 2 64%, Bi 2 o 3 19%, Na 2 O10%, CaO6%, Al 2 o 3 l%; smelting process: heat preservation at a high temperature of 1400°C for three hours;

[0020] (3) Organic solvent and dissolution process: 90% of tributyl citrate, 7% of terpineol, 2% of nitrocellulose, 0.5% of lecithin, and 0.5% of bentonite. The dissolution process is to keep the above components in a high-temperature (80°C-90°C) water bath for 5 hours;

[0021] (4) Sizing process: the solid phase component (YBCO: glass powder = 70:30) and the organic binder ratio (70:30) are placed in a container, stirred and dispersed, and then rolled by...

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PUM

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Abstract

The invention relates to low-cost base metal oxide thick film resistor slurry which is formed by uniformly mixing a conductive phase (a YBCO series material), an inorganic cementing phase (glass powder or Bi oxide powder or Pb oxide powder) and an organic binder. The glass powder in the inorganic cementing phase is SiO2-Bi2O3-Na2O-CaO-Al2O3 series glass, and the glass powder comprises the following raw materials in percentage by weight: 20-80 percent of SiO2, 10-90 percent of Bi2O3, 5-20 percent of Na2O, 5-30 percent of CaO and 1-15 percent of Al2O3; the organic binder comprises the following components in percentage by weight: 20-98 percent of tributyl citrate, 1-30 percent of terpineol, 1-10 percent of pyroxylin, 0.1-6 percent of lecithin and 0.1-6 percent of bentonite. The proportion by weight of the conductive phase YBCO and the inorganic cementing phase (glass powder or Bi2O3 or PbO powder) can be adjusted according to required resistors and resistance temperature coefficients, and the range of the proportion by weight is 40-85: 60-15. The thick film resistor slurry can be burnt into a thick film resistor in the air atmosphere at the temperature of 500-1000 DEG C, the resistance can be adjusted within the range of 25-1000K(omega / port), the resistance value is stable, and the thick film resistor has lower cost than a traditional noble metal thick film resistor.

Description

Technical field: [0001] The invention relates to a novel low-cost base metal oxide YBCO thick-film resistor paste, in particular to a thick-film resistor that can be prepared by sintering in an air atmosphere, and can partially replace noble metal thick-film resistor paste in common civilian fields. Background technique: [0002] In the field of electrical and electronic technology, thick film components for microcircuits and hybrid integrated circuits, such as resistors, capacitors, thick film conductors, etc., are of increasing importance and have been increasingly used in various electrical and electronic devices. In terms of thick film resistors, well-known, traditional commercial thick film resistors or conductors are based on gold, silver, platinum and palladium and other precious metal powders, adding glass frit as a binder, and mixing with an organic carrier to form a conductive paste. Then the silk screen is leak-printed on the ceramic substrate, and it is made by ...

Claims

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Application Information

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IPC IPC(8): H01B1/00H01B1/14H01B1/20H01C7/00
Inventor 银锐明张晓琪银舜生
Owner 银锐明
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