Conductive silver paste special for circuit of laptop keyboard and preparation method thereof
A notebook computer, conductive silver paste technology, applied in the direction of cable/conductor manufacturing, circuit, conductive material dispersed in non-conductive inorganic materials, etc., can solve the problem of poor bending resistance, easy wear and tear of silver paste, and long service life short, etc., to achieve the effect of improved coverage or bonding performance, improved electrical conductivity, and improved screen printability
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Embodiment 1
[0039] A preparation method of special conductive silver paste for notebook computer keyboard circuit, the method comprises the following process steps:
[0040] (1) Prepare materials according to the following components and content (weight):
[0041] Metallic Silver Powder 55%
[0042] Polymer resin 20%
[0043] Additives 2.5%
[0044] Solvent 22.5%
[0045] Described metallic silver powder is the mixed silver powder (weight ratio is 8: 1) that flaky silver powder and spherical silver powder are formed, and the particle diameter of described flaky silver powder is 5 μm, bulk density 0.8g / ml, and described spherical The particle diameter of silver powder is less than 1 μ m, and described polymer resin is polyurethane resin, and described additive comprises leveling agent glyceryl oleate, thickener polyvinyl alcohol, defoamer n-butyl alcohol, and the weight ratio of the three is 1:0.4:1, the solvent is cyclohexanone;
[0046] (2) Preparation of carrier:
[0047] Mix the ...
Embodiment 2
[0053] A preparation method of special conductive silver paste for notebook computer keyboard circuit, the method comprises the following process steps:
[0054] (1) Prepare materials according to the following components and content (weight):
[0055] Metallic silver powder 60%
[0056] Polymer resin 16%
[0057] Additive 1.5%
[0058] Solvent 22.5%
[0059] Described metallic silver powder is the mixed silver powder (weight ratio is 4: 1) that flaky silver powder and spherical silver powder are formed, and the particle diameter of described flaky silver powder is 7 μm, bulk density 1.0g / ml, and described spherical The particle size of the silver powder is less than 1 μm, the polymer resin is toluene diisocyanate-ethylene glycol polymer or diisocyanate diphenylmethane-glycerol polymer, and the additives include leveling agent castor oil, thickener Fumed silicon dioxide, defoamer ethylene glycol, the weight ratio of the three is 2: 1.5: 2, and described solvent is methyl b...
Embodiment 3
[0067] A preparation method of special conductive silver paste for notebook computer keyboard circuit, the method comprises the following process steps:
[0068] (1) Prepare materials according to the following components and content (weight):
[0069] Metallic silver powder 65%
[0070] Polymer resin 10%
[0071] Additive 5%
[0072] Solvent 20%
[0073] Described metal silver powder is the mixed silver powder (weight ratio is 5: 1) that flaky silver powder and spherical silver powder are formed, and the particle diameter of described flaky silver powder is 9 μm, bulk density 1.2g / ml, and described spherical The particle diameter of silver powder is less than 1 μ m, and described polymer resin is polyester resin, and described additive comprises leveling agent butyl acetate, thickener hydrogenated castor oil, defoamer ethyl silicone oil, and the weight ratio of the three is 4:1:3, the solvent is ethyl benzoate;
[0074] (2) Preparation of carrier:
[0075] Mix the polym...
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