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Photosensitive resin composition and cured film

A photosensitive resin, photocurable resin technology, applied in optics, optomechanical equipment, nonlinear optics, etc., can solve the problems of reduced volume resistivity, poor crosslinking density, low affinity, etc., to reduce volume resistance effect of reduction of , excellent pattern dimensional stability, excellent dispersion stability

Active Publication Date: 2014-02-05
NIPPON STEEL CHEM &MATERIAL CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, for the resin light-shielding film obtained by this method, in order to express the light-shielding properties (optical density) equivalent to the black matrix caused by metal films such as chromium, it is necessary to increase the content of light-shielding pigments, etc. When the light-shielding ability is required in the full wavelength region of light like the black matrix, the light-shielding pigment absorbs the ultraviolet rays during the photocuring process by irradiating ultraviolet rays, so there are problems in the following aspects: 1) Relative light is generated even in the exposed part. The difference in crosslinking density in the film thickness direction makes it difficult to photocure on the substrate surface even if the film surface is fully photocured; 2) It is very difficult to impart a difference in crosslinking density between the exposed part and the unexposed part; 3) In terms of photosensitivity, clarity, adhesion, developability, edge shape clarity, etc.
[0012] However, granular silica has a high cohesive force, so there is still room for improvement in terms of dispersion stability
In addition, after the photosensitive resin composition containing the granular silica is coated on the substrate, when it is dried or post-baked, since the silica particles have a high cohesive force, the particles are aggregated, so The distance between carbon black particles used as a light-shielding component becomes smaller, which may also reduce the volume resistivity
Furthermore, since the affinity of the granular silica to the organic solvent is low, in order to ensure the shape stability after the post-baking, it is necessary to mix more than a certain amount, but when the content of the granular silica increases, there is a possibility that the pattern line may be affected. adverse effects on development properties such as
[0013] However, attempts have been made to use a large amount of light-shielding components as a means of increasing light-shielding. However, when a conductive material such as carbon is used as a pigment, the volume resistivity of the black matrix decreases, which may reduce the reliability of display devices, etc.

Method used

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  • Photosensitive resin composition and cured film
  • Photosensitive resin composition and cured film
  • Photosensitive resin composition and cured film

Examples

Experimental program
Comparison scheme
Effect test

manufacture example A-1～A-7

[0065]

[0066]Mix acrylic resin particles (Nippon Paint Co., Ltd. Finesfere), a polymer dispersant, and propylene glycol monomethyl ether acetate in the ratio shown in Table 1, and disperse with a bead mill to prepare acrylic resin particle-containing dispersion A- 1~A-4, and a-1. In addition, acrylic resin particles (Nippon Paint Co., Ltd. Fainsfere), resin-coated carbon black (Mitsubishi Chemical MS18E, particle size: 25 nm) as a light-shielding pigment (light-shielding component), and polymer The dispersant and propylene glycol monomethyl ether acetate were dispersed with a bead mill to prepare a dispersion A-5 containing both acrylic resin particles and light-shielding pigments. Similarly, as a light-shielding pigment, in addition to carbon black, titanium black (manufactured by Mitsubishi Materials Co., Ltd., particle size: 30 nm) or mixed organic pigment black (manufactured by Mikuni Pigment, particle size: 30 nm) was used to prepare acrylic resin particle / light-shiel...

Embodiment 1～2、5～11

[0070] [Examples 1-2, 5-11, Comparative Examples 1-4, Reference Examples 3-4]

[0071]

[0072] The dispersion obtained above and the components described in Table 2 were mixed in the ratios shown in the table, and 0.30 parts of silane coupling agent S-510 (manufactured by Shin-Etsu Chemical) and propylene glycol monomethyl ether acetate were added to make the total amount It is 100 weight part, and a solid content concentration is 20 weight%. Furthermore, 0.005 parts by weight of silicon-based surfactant SH3775M (manufactured by Toray Dow Corning) was added, and a membrane filter made of polypropylene of 2 μm was added at a rate of 0.2 kg / cm 2 Filtration was performed under pressure to prepare a photosensitive resin composition. In addition, the abbreviation of each component described in Table 2 represents the following compounds, respectively.

[0073] a-3: Nano silica dispersion liquid, NANO BYK-3650 (manufactured by Bicchem Japan, particle size 20-25nm)

[0074] B-1:...

Embodiment 12

[0101] Using the photosensitive resin composition used in Examples 6 to 11, a matrix having light-shielding barrier ribs with an opening (pixel region) of 300 μm×100 μm, a line width of 30 μm, and a film thickness (height) of 2.1 μm was formed. Subsequently, after 3 seconds of treatment with oxygen atmospheric pressure plasma, with CF 4 Atmospheric pressure plasma was performed for 3 seconds. On this light-shielding partition wall (light-shielding film), the static contact angle was measured using water or butyl carbitol acetate (BCA), and the results were 100° and 50°, respectively. Towards the black matrix, red, blue, and green inks with a viscosity of 9 mPa·sec and a solid content concentration of 20% were injected using an inkjet head manufactured by Toshiba Tec, and post-baked at 230°C to form a color filter. . As a result, a good color filter can be obtained.

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Abstract

The invention relates to a photosensitive compound, a solidifying film and a septum, which can form excellent pattern with size stability even if a thick solidifying film is obtained and will not decrease the volume resistance even if conductive materials like carbon are used as a shielding component. The photosensitive compound is characterized in that (i) photo-curing resin and / or photo-curing monomer and (ii) acrylic resin grains are the necessary components, wherein the average once grain size of the (ii) acrylic resin grains is 50 to 200 nm and the weight ratio of the (ii) acrylic resin grains to the (i) photo-curing resin and / or photo-curing monomer is 0.1 to 2.0. Besides, the photosensitive compound is applied to making the solidifying film and the septum.

Description

[0001] This application is a divisional application of patent application 201010159043.6 (application date: April 23, 2010, name of invention: photosensitive resin composition, cured film and partition). technical field [0002] The present invention relates to a photosensitive alkaline aqueous solution developing type resin composition, a cured film formed using the same, and partition walls, and in particular to a photosensitive resin composition for a black resist suitable for forming fine partition walls on a substrate, and The partition formed by it. Background technique [0003] Color filters usually form a black matrix (black matrix) on the surface of a transparent substrate such as glass or plastic sheet, and then sequentially form three or more different hues such as red, green, and blue in a stripe-like or mosaic-like color pattern. The pattern size varies depending on the use of the color filter and each color, but is usually about 5 to 700 μm. In addition, the o...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G03F7/004G03F7/027
CPCG02F1/133509G03F7/0388C08F220/32C08J3/20C08K3/04C08L33/08C08K9/00G02B5/30C08F220/325
Inventor 吉冈敬裕佐佐木健了藤城光一板原俊英
Owner NIPPON STEEL CHEM &MATERIAL CO LTD
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